TW200942580A - Radiation-sensitive resin composition, cured product thereof, and interlayer insulation film and optical device using the composition - Google Patents

Radiation-sensitive resin composition, cured product thereof, and interlayer insulation film and optical device using the composition

Info

Publication number
TW200942580A
TW200942580A TW98105452A TW98105452A TW200942580A TW 200942580 A TW200942580 A TW 200942580A TW 98105452 A TW98105452 A TW 98105452A TW 98105452 A TW98105452 A TW 98105452A TW 200942580 A TW200942580 A TW 200942580A
Authority
TW
Taiwan
Prior art keywords
composition
radiation
sensitive resin
resin composition
optical device
Prior art date
Application number
TW98105452A
Other languages
Chinese (zh)
Other versions
TWI438246B (en
Inventor
Naoko Imaizumi
Ryuji Uehara
Original Assignee
Nippon Kayaku Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Kayaku Kk filed Critical Nippon Kayaku Kk
Publication of TW200942580A publication Critical patent/TW200942580A/en
Application granted granted Critical
Publication of TWI438246B publication Critical patent/TWI438246B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133345—Insulating layers
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2202/00—Materials and properties
    • G02F2202/02—Materials and properties organic material
    • G02F2202/022—Materials and properties organic material polymeric
    • G02F2202/023—Materials and properties organic material polymeric curable

Abstract

Disclosed is a radiation-sensitive resin composition characterized by containing the following components (A), (B) and (C). (A) a co-condensation product of a silicon compound represented by Formula (1) and having an epoxy group and/or a silicon compound represented by Formula (2) and having an epoxy group, and a silicon compound represented by Formula (3) and/or a silicon compound represented by Formula (4) (1) (2) (3) (4) (B) a cationic photopolymerization initiator (C) a solvent
TW98105452A 2008-02-22 2009-02-20 Radiation-sensitive resin composition, cured product thereof, and interlayer insulation film and optical device using the composition TWI438246B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008041917 2008-02-22

Publications (2)

Publication Number Publication Date
TW200942580A true TW200942580A (en) 2009-10-16
TWI438246B TWI438246B (en) 2014-05-21

Family

ID=40985558

Family Applications (1)

Application Number Title Priority Date Filing Date
TW98105452A TWI438246B (en) 2008-02-22 2009-02-20 Radiation-sensitive resin composition, cured product thereof, and interlayer insulation film and optical device using the composition

Country Status (3)

Country Link
JP (1) JPWO2009104680A1 (en)
TW (1) TWI438246B (en)
WO (1) WO2009104680A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105874882A (en) * 2014-02-28 2016-08-17 Jsr株式会社 Display or illumination device, and method for forming insulating film

Families Citing this family (9)

* Cited by examiner, † Cited by third party
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JP2009280767A (en) * 2008-05-26 2009-12-03 Asahi Kasei Corp Siloxane derivative, cured product, and optical semiconductor sealing material
JP5533147B2 (en) * 2010-03-31 2014-06-25 Ｊｓｒ株式会社 Radiation sensitive composition
JP5310656B2 (en) 2010-06-18 2013-10-09 信越化学工業株式会社 Silphenylene-containing photocurable composition, pattern forming method using the same, and optical semiconductor device obtained by the method
US8865392B2 (en) * 2010-07-14 2014-10-21 Nippon Kayaku Kabushiki Kaisha Photosensitive resin composition and cured product thereof
JP6065789B2 (en) * 2012-09-27 2017-01-25 信越化学工業株式会社 Chemically amplified positive resist material and pattern forming method
PL2912075T3 (en) * 2012-10-02 2017-06-30 Bluestar Silicones France Sas Cationically cross-linkable/polymerisable composition comprising an iodonium borate and releasing an acceptable odour
JP2014137477A (en) * 2013-01-17 2014-07-28 Sumitomo Chemical Co Ltd Polarizing plate
JP6213082B2 (en) * 2013-02-08 2017-10-18 東レ・ファインケミカル株式会社 Siloxane copolymer and process for producing the same
WO2016204115A1 (en) * 2015-06-17 2016-12-22 株式会社ダイセル Process for producing cured object, cured object, and layered product including said cured object

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03288857A (en) * 1990-04-06 1991-12-19 Nippon Telegr & Teleph Corp <Ntt> Resist material and photosensitive resin composition
JPH04161435A (en) * 1990-10-24 1992-06-04 Kansai Paint Co Ltd Curable silicone resin composition for glass fiber and cured product thereof
JP3133039B2 (en) * 1998-10-05 2001-02-05 日本電信電話株式会社 Photosensitive composition for optical waveguide, method for producing the same, and method for forming polymer optical waveguide pattern
JP4205368B2 (en) * 2002-06-11 2009-01-07 株式会社Ａｄｅｋａ Curable composition for optical materials
JP4143835B2 (en) * 2002-07-18 2008-09-03 信越化学工業株式会社 Optical waveguide forming material, optical waveguide using the same, and optical waveguide manufacturing method
JP2005338790A (en) * 2004-04-30 2005-12-08 Nagase Chemtex Corp Composition for color filter protective film
JP4371220B2 (en) * 2004-05-11 2009-11-25 信越化学工業株式会社 Master for fine pattern transfer and method for producing the same
JPWO2006003990A1 (en) * 2004-07-02 2008-04-17 日本化薬株式会社 Photosensitive resin composition for optical waveguide and optical waveguide comprising cured product thereof
JP2007226214A (en) * 2006-01-27 2007-09-06 Toray Ind Inc Photosensitive siloxane composition, cured film formed of the same and element having cured film
JP2009042422A (en) * 2007-08-08 2009-02-26 Toray Ind Inc Photosensitive siloxane composition, cured film formed therefrom, and element having cured film

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105874882A (en) * 2014-02-28 2016-08-17 Jsr株式会社 Display or illumination device, and method for forming insulating film
TWI609239B (en) * 2014-02-28 2017-12-21 Jsr股份有限公司 Method for forming insulating film and device using insulating film

Also Published As

Publication number Publication date
TWI438246B (en) 2014-05-21
JPWO2009104680A1 (en) 2011-06-23
WO2009104680A1 (en) 2009-08-27

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees