JP5935947B2 - 導電性接合剤およびはんだ継手 - Google Patents
導電性接合剤およびはんだ継手 Download PDFInfo
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- JP5935947B2 JP5935947B2 JP2015530727A JP2015530727A JP5935947B2 JP 5935947 B2 JP5935947 B2 JP 5935947B2 JP 2015530727 A JP2015530727 A JP 2015530727A JP 2015530727 A JP2015530727 A JP 2015530727A JP 5935947 B2 JP5935947 B2 JP 5935947B2
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- organic acid
- epoxy resin
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
- B22F1/103—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing an organic binding agent comprising a mixture of, or obtained by reaction of, two or more components other than a solvent or a lubricating agent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/0483—Alloys based on the low melting point metals Zn, Pb, Sn, Cd, In or Ga
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0425—Solder powder or solder coated metal powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1446—Treatment after insertion of lead into hole, e.g. bending, cutting, caulking or curing of adhesive but excluding soldering
Description
本発明の導電性接合剤はSn40%以上含有の導電性金属粉末、熱硬化性樹脂、硬化剤および有機酸を含む。
エポキシ樹脂に例えば脂肪族骨格を付与した可撓性樹脂を用いると、柔軟性と強靱性の双方が共に強化されて、表面剥離によるクラックの発生を防止することができる。
エポキシ樹脂の硬化時には発熱反応を伴う。そこで、発熱反応を示差走査熱量測定(DSC)で捉え、熱硬化が起こる温度を測定した。DSCの測定条件は25〜300℃の範囲で、昇温速度を10℃/minとした。結果を表1に示す。導電性金属粉末はSn、Cu、Niを用い、有機酸はグルタル酸を用いた。
比較例3では、エポキシ樹脂と硬化剤を1:2のモル比で配合したとき、硬化温度が220℃の場合で20分ほど経過して半硬化が見られた。これに対して、実施例2ではエポキシ樹脂と硬化剤を1:2のモル比で配合し、その混合物にさらに有機酸金属塩を2重量%混合すると、硬化温度が150℃下では6分経過すると半硬化が見られ、12分経過すると完全に硬化した。しかし、硬化温度が220℃に設定したときには僅か3分で完全に硬化した。
なお、溶剤に関しては必要に応じ0〜20%添加してもよく、リフロー時に揮発するものであればよい。はんだ合金の組成はSn−3.0Ag−0.5Cuである。表3における有機酸とチキソ剤と溶剤の組成率は、フラックス組成物中の重量%であり、フラックスとはんだの組成率は、導電性接合剤中の重量%である。ピーク温度はDSC測定によるエポキシ樹脂の硬化時の発熱反応のピーク温度である。
実施例6にはSn-3.0Ag-3.0Bi-3.0In(合金1)、実施例8にはSn-3.4Ag-0.7Cu-2Bi-5Sb-0.04Ni(合金2)を導電性金属粉末として使用した。その他は、表4に示すような導電性金属粉末を使用したものを実施例7、9および10として示す。
ピーク温度はDSC測定によるエポキシ樹脂の硬化時の発熱反応のピーク温度である。そのときのリフロープロファイルを図1〜図4として示す。図1は実施例6および8のリフロープロファイルであり、図2は実施例7の、図3は実施例9の、そして図4は実施例10のリフロープロファイルである。
Claims (6)
- Sn40%以上含有の導電性金属粉末、エポキシ樹脂、硬化剤および有機酸を含み、前記硬化剤は酸無水物系硬化剤であり、
加熱中に前記Sn40%以上含有の導電性金属粉末と前記有機酸が反応して、生成される有機酸金属塩を硬化促進剤として使用し、前記エポキシ樹脂がリフロー処理中に硬化する
ことを特徴とする導電性接合剤。 - 上記Sn40%以上含有の導電性金属粉末は、Sn、Ag、Cu、In、Ni、Bi、Sb、Pd、Pb単体またはこれら金属粉末群から選ばれた金属からなる合金のうち、1種または2種類以上の単体または/および合金からなり、Snの割合が前記導電性金属粉末100重量部に対して、40重量部以上である
ことを特徴とする請求項1に記載の導電性接合剤。 - 上記エポキシ樹脂として、脂肪族骨格を有し、可撓性を付与したエポキシ樹脂である
ことを特徴とする請求項1に記載の導電性接合剤。 - 上記酸無水物系硬化剤として、無水酢酸、無水プロピオン酸、無水コハク酸、無水マレイン酸の何れかを使用した
ことを特徴とする請求項1に記載の導電性接合剤。 - 上記有機酸を、2〜8重量%添加した
ことを特徴とする請求項1に記載の導電性接合剤。 - 請求項1〜5に記載の導電性接合剤を用いた
ことを特徴とするはんだ継手。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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JP2013162932 | 2013-08-06 | ||
JP2013162932 | 2013-08-06 | ||
PCT/JP2014/060729 WO2015019667A1 (ja) | 2013-08-06 | 2014-04-15 | 導電性接合剤およびはんだ継手 |
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JP5935947B2 true JP5935947B2 (ja) | 2016-06-15 |
JPWO2015019667A1 JPWO2015019667A1 (ja) | 2017-03-02 |
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JP2015530727A Active JP5935947B2 (ja) | 2013-08-06 | 2014-04-15 | 導電性接合剤およびはんだ継手 |
JP2015530726A Active JP5920536B2 (ja) | 2013-08-06 | 2014-04-15 | 導電性接着剤、接合体および継手 |
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US (2) | US10650939B2 (ja) |
EP (2) | EP3031571A4 (ja) |
JP (2) | JP5935947B2 (ja) |
KR (2) | KR102095083B1 (ja) |
CN (2) | CN105452414B (ja) |
TW (2) | TWI565785B (ja) |
WO (2) | WO2015019667A1 (ja) |
Families Citing this family (12)
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JP5935947B2 (ja) * | 2013-08-06 | 2016-06-15 | 千住金属工業株式会社 | 導電性接合剤およびはんだ継手 |
JP6428716B2 (ja) * | 2016-07-12 | 2018-11-28 | 千住金属工業株式会社 | 導電性接着剤、接合体および継手 |
CN106181148B (zh) * | 2016-08-17 | 2017-12-19 | 浙江特富锅炉有限公司 | 一种耐腐蚀的锅炉尾部烟气管道合金的焊接工艺 |
WO2018066368A1 (ja) * | 2016-10-06 | 2018-04-12 | 積水化学工業株式会社 | 導電材料、接続構造体及び接続構造体の製造方法 |
JP6956365B2 (ja) * | 2017-02-10 | 2021-11-02 | パナソニックIpマネジメント株式会社 | はんだペーストとそれにより得られる実装構造体 |
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CN107745202B (zh) * | 2017-06-23 | 2020-07-03 | 深圳市福英达工业技术有限公司 | 锡基膏状钎焊焊料及其制备方法 |
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TWI565785B (zh) | 2017-01-11 |
TW201518470A (zh) | 2015-05-16 |
EP3031876B1 (en) | 2019-07-31 |
CN105473276B (zh) | 2018-04-17 |
US10650939B2 (en) | 2020-05-12 |
US20160194525A1 (en) | 2016-07-07 |
WO2015019666A1 (ja) | 2015-02-12 |
TW201518469A (zh) | 2015-05-16 |
KR102095083B1 (ko) | 2020-03-30 |
KR20160040269A (ko) | 2016-04-12 |
EP3031571A4 (en) | 2017-05-17 |
EP3031876A1 (en) | 2016-06-15 |
WO2015019667A1 (ja) | 2015-02-12 |
JPWO2015019667A1 (ja) | 2017-03-02 |
KR102006057B1 (ko) | 2019-07-31 |
JPWO2015019666A1 (ja) | 2017-03-02 |
EP3031571A1 (en) | 2016-06-15 |
JP5920536B2 (ja) | 2016-05-18 |
CN105452414A (zh) | 2016-03-30 |
CN105473276A (zh) | 2016-04-06 |
CN105452414B (zh) | 2017-05-17 |
KR20160040268A (ko) | 2016-04-12 |
TWI563062B (ja) | 2016-12-21 |
US20160194526A1 (en) | 2016-07-07 |
EP3031876A4 (en) | 2017-05-31 |
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