JPWO2015019667A1 - 導電性接合剤およびはんだ継手 - Google Patents
導電性接合剤およびはんだ継手 Download PDFInfo
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- JPWO2015019667A1 JPWO2015019667A1 JP2015530727A JP2015530727A JPWO2015019667A1 JP WO2015019667 A1 JPWO2015019667 A1 JP WO2015019667A1 JP 2015530727 A JP2015530727 A JP 2015530727A JP 2015530727 A JP2015530727 A JP 2015530727A JP WO2015019667 A1 JPWO2015019667 A1 JP WO2015019667A1
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- 229910000679 solder Inorganic materials 0.000 title claims description 18
- 229910052751 metal Inorganic materials 0.000 claims abstract description 78
- 239000002184 metal Substances 0.000 claims abstract description 78
- 150000007524 organic acids Chemical class 0.000 claims abstract description 69
- 239000000843 powder Substances 0.000 claims abstract description 43
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- WYVAMUWZEOHJOQ-UHFFFAOYSA-N propionic anhydride Chemical compound CCC(=O)OC(=O)CC WYVAMUWZEOHJOQ-UHFFFAOYSA-N 0.000 claims description 2
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- PVFQHGDIOXNKIC-UHFFFAOYSA-N 4-[2-[3-[2-(4-hydroxyphenyl)propan-2-yl]phenyl]propan-2-yl]phenol Chemical compound C=1C=CC(C(C)(C)C=2C=CC(O)=CC=2)=CC=1C(C)(C)C1=CC=C(O)C=C1 PVFQHGDIOXNKIC-UHFFFAOYSA-N 0.000 description 1
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- SDDLEVPIDBLVHC-UHFFFAOYSA-N Bisphenol Z Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)CCCCC1 SDDLEVPIDBLVHC-UHFFFAOYSA-N 0.000 description 1
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- ZFVMWEVVKGLCIJ-UHFFFAOYSA-N bisphenol AF Chemical compound C1=CC(O)=CC=C1C(C(F)(F)F)(C(F)(F)F)C1=CC=C(O)C=C1 ZFVMWEVVKGLCIJ-UHFFFAOYSA-N 0.000 description 1
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- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
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- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
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- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
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- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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Abstract
Description
本発明の導電性接合剤はSn40%以上含有の導電性金属粉末、熱硬化性樹脂、硬化剤および有機酸を含む。
エポキシ樹脂に例えば脂肪族骨格を付与した可撓性樹脂を用いると、柔軟性と強靱性の双方が共に強化されて、表面剥離によるクラックの発生を防止することができる。
エポキシ樹脂の硬化時には発熱反応を伴う。そこで、発熱反応を示差走査熱量測定(DSC)で捉え、熱硬化が起こる温度を測定した。DSCの測定条件は25〜300℃の範囲で、昇温速度を10℃/minとした。結果を表1に示す。導電性金属粉末はSn、Cu、Niを用い、有機酸はグルタル酸を用いた。
比較例3では、エポキシ樹脂と硬化剤を1:2のモル比で配合したとき、硬化温度が220℃の場合で20分ほど経過して半硬化が見られた。これに対して、実施例2ではエポキシ樹脂と硬化剤を1:2のモル比で配合し、その混合物にさらに有機酸金属塩を2重量%混合すると、硬化温度が150℃下では6分経過すると半硬化が見られ、12分経過すると完全に硬化した。しかし、硬化温度が220℃に設定したときには僅か3分で完全に硬化した。
なお、溶剤に関しては必要に応じ0〜20%添加してもよく、リフロー時に揮発するものであればよい。はんだ合金の組成はSn−3.0Ag−0.5Cuである。表3における有機酸とチキソ剤と溶剤の組成率は、フラックス組成物中の重量%であり、フラックスとはんだの組成率は、導電性接合剤中の重量%である。ピーク温度はDSC測定によるエポキシ樹脂の硬化時の発熱反応のピーク温度である。
実施例6にはSn-3.0Ag-3.0Bi-3.0In(合金1)、実施例8にはSn-3.4Ag-0.7Cu-2Bi-5Sb-0.04Ni(合金2)を導電性金属粉末として使用した。その他は、表4に示すような導電性金属粉末を使用したものを実施例7、9および10として示す。
ピーク温度はDSC測定によるエポキシ樹脂の硬化時の発熱反応のピーク温度である。そのときのリフロープロファイルを図1〜図4として示す。図1は実施例6および8のリフロープロファイルであり、図2は実施例7の、図3は実施例9の、そして図4は実施例10のリフロープロファイルである。
Claims (6)
- Sn40%以上含有の導電性金属粉末、熱硬化性樹脂、酸無水物系硬化剤および有機酸を含み、加熱中に導電性金属粉末と有機酸が反応して、生成される有機酸金属塩を硬化促進剤として使用する
ことを特徴とする導電性接合剤。 - 上記導電性金属粉末は、Sn、Ag、Cu、In、Ni、Bi、Sb、Pd、Pb単体またはこれら金属粉末群から選ばれた金属からなる合金のうち、1種または2種類以上の単体または/および合金である
ことを特徴とする請求項1に記載の導電性接合剤。 - 上記熱硬化性樹脂として、脂肪族骨格を有し、可撓性を付与したエポキシ樹脂である
ことを特徴とする請求項1に記載の導電性接合剤。 - 酸無水物系硬化剤として、無水酢酸、無水プロピオン酸、無水コハク酸、無水マレイン酸の何れかを使用した
ことを特徴とする請求項1に記載の導電性接合剤。 - 上記有機酸を、2〜8重量%添加した
ことを特徴とする請求項1に記載の導電性接合剤。 - 請求項1〜5に記載の導電性接合剤を用いた
ことを特徴とするはんだ継手。
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PCT/JP2014/060729 WO2015019667A1 (ja) | 2013-08-06 | 2014-04-15 | 導電性接合剤およびはんだ継手 |
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US (2) | US20160194526A1 (ja) |
EP (2) | EP3031571A4 (ja) |
JP (2) | JP5920536B2 (ja) |
KR (2) | KR102006057B1 (ja) |
CN (2) | CN105473276B (ja) |
TW (2) | TW201518469A (ja) |
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2014
- 2014-04-15 EP EP14834922.8A patent/EP3031571A4/en not_active Withdrawn
- 2014-04-15 KR KR1020167005622A patent/KR102006057B1/ko active IP Right Grant
- 2014-04-15 WO PCT/JP2014/060729 patent/WO2015019667A1/ja active Application Filing
- 2014-04-15 CN CN201480044068.8A patent/CN105473276B/zh active Active
- 2014-04-15 EP EP14834727.1A patent/EP3031876B1/en active Active
- 2014-04-15 JP JP2015530726A patent/JP5920536B2/ja active Active
- 2014-04-15 KR KR1020167005620A patent/KR102095083B1/ko active IP Right Grant
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- 2014-04-15 US US14/910,427 patent/US20160194526A1/en not_active Abandoned
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TWI563062B (ja) | 2016-12-21 |
CN105452414A (zh) | 2016-03-30 |
WO2015019667A1 (ja) | 2015-02-12 |
JPWO2015019666A1 (ja) | 2017-03-02 |
JP5920536B2 (ja) | 2016-05-18 |
EP3031876A1 (en) | 2016-06-15 |
US10650939B2 (en) | 2020-05-12 |
KR102095083B1 (ko) | 2020-03-30 |
TW201518470A (zh) | 2015-05-16 |
US20160194526A1 (en) | 2016-07-07 |
KR102006057B1 (ko) | 2019-07-31 |
TWI565785B (zh) | 2017-01-11 |
EP3031571A1 (en) | 2016-06-15 |
CN105452414B (zh) | 2017-05-17 |
TW201518469A (zh) | 2015-05-16 |
EP3031571A4 (en) | 2017-05-17 |
CN105473276B (zh) | 2018-04-17 |
WO2015019666A1 (ja) | 2015-02-12 |
CN105473276A (zh) | 2016-04-06 |
EP3031876A4 (en) | 2017-05-31 |
KR20160040268A (ko) | 2016-04-12 |
EP3031876B1 (en) | 2019-07-31 |
US20160194525A1 (en) | 2016-07-07 |
JP5935947B2 (ja) | 2016-06-15 |
KR20160040269A (ko) | 2016-04-12 |
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