WO2006084537A3 - Strahlungsvernetzbare schmelzhaftklebstoffe - Google Patents

Strahlungsvernetzbare schmelzhaftklebstoffe Download PDF

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Publication number
WO2006084537A3
WO2006084537A3 PCT/EP2006/000172 EP2006000172W WO2006084537A3 WO 2006084537 A3 WO2006084537 A3 WO 2006084537A3 EP 2006000172 W EP2006000172 W EP 2006000172W WO 2006084537 A3 WO2006084537 A3 WO 2006084537A3
Authority
WO
WIPO (PCT)
Prior art keywords
radiation cross
melt contact
linkable
contact adhesives
epoxy groups
Prior art date
Application number
PCT/EP2006/000172
Other languages
English (en)
French (fr)
Other versions
WO2006084537A2 (de
Inventor
Thomas Moeller
Holger Toenniessen
Original Assignee
Henkel Kgaa
Thomas Moeller
Holger Toenniessen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel Kgaa, Thomas Moeller, Holger Toenniessen filed Critical Henkel Kgaa
Priority to BRPI0606944-4A priority Critical patent/BRPI0606944A2/pt
Priority to AU2006212536A priority patent/AU2006212536B2/en
Priority to EP06701180A priority patent/EP1846529A2/de
Publication of WO2006084537A2 publication Critical patent/WO2006084537A2/de
Publication of WO2006084537A3 publication Critical patent/WO2006084537A3/de
Priority to US11/836,296 priority patent/US7682477B2/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J115/00—Adhesives based on rubber derivatives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J119/00—Adhesives based on rubbers, not provided for in groups C09J107/00 - C09J117/00
    • C09J119/006—Rubber characterised by functional groups, e.g. telechelic diene polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/04—Homopolymers or copolymers of ethene
    • C09J123/08—Copolymers of ethene
    • C09J123/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
    • C09J123/0869—Acids or derivatives thereof
    • C09J123/0884—Epoxide containing esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0016—Plasticisers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/08—Copolymers of ethene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
    • C08L2666/06—Homopolymers or copolymers of unsaturated hydrocarbons; Derivatives thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/287—Adhesive compositions including epoxy group or epoxy polymer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)

Abstract

Die Erfindung betrifft einen strahlungsvernetzbaren Schmelzhaftklebstoff auf Basis von strahlungsvernetzbaren epoxydierten Polyolefinen, wobei die Epoxydgruppen im wesentlichen über die Polymerkette verteilt vorliegen, sowie einer Komponente (B) als klebrigmachendes Harz, das frei von Epoxydgruppen ist, sowie ggf. einer oligomeren Verbindung (C), die reaktive Gruppen aufweist, die mit den Epoxydgruppen der Komponente (A) reagieren können, zusammen mit mindestens einem Photoinitiator und weiteren Additiven.
PCT/EP2006/000172 2005-02-10 2006-01-11 Strahlungsvernetzbare schmelzhaftklebstoffe WO2006084537A2 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
BRPI0606944-4A BRPI0606944A2 (pt) 2005-02-10 2006-01-11 adesivos de contato de fusão a quente, reticuláveis por radiação
AU2006212536A AU2006212536B2 (en) 2005-02-10 2006-01-11 Radiation cross-linkable hot-melt contact adhesives
EP06701180A EP1846529A2 (de) 2005-02-10 2006-01-11 Strahlungsvernetzbare schmelzhaftklebstoffe
US11/836,296 US7682477B2 (en) 2005-02-10 2007-08-09 Radiation cross-linkable hot-melt contact adhesives

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE200510006282 DE102005006282A1 (de) 2005-02-10 2005-02-10 Strahlungsvernetzbare Schmelzhaftklebstoffe
DE102005006282.2 2005-02-10

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US11/836,296 Continuation US7682477B2 (en) 2005-02-10 2007-08-09 Radiation cross-linkable hot-melt contact adhesives

Publications (2)

Publication Number Publication Date
WO2006084537A2 WO2006084537A2 (de) 2006-08-17
WO2006084537A3 true WO2006084537A3 (de) 2007-04-26

Family

ID=36129679

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2006/000172 WO2006084537A2 (de) 2005-02-10 2006-01-11 Strahlungsvernetzbare schmelzhaftklebstoffe

Country Status (6)

Country Link
US (1) US7682477B2 (de)
EP (1) EP1846529A2 (de)
AU (1) AU2006212536B2 (de)
BR (1) BRPI0606944A2 (de)
DE (1) DE102005006282A1 (de)
WO (1) WO2006084537A2 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006054196A1 (de) * 2006-11-15 2008-05-21 Henkel Kgaa Schmelzhaftklebstoffe mit verbesserter Haftung
DE102007023425A1 (de) 2007-05-16 2008-11-20 Henkel Ag & Co. Kgaa Verfahren zum Verkleben von Etiketten
WO2008144703A2 (en) * 2007-05-21 2008-11-27 Avery Dennison Corporation Pressure sensitive adhesives made from renewable resources and related methods
DE102011087834A1 (de) * 2011-12-06 2013-06-06 Henkel Ag & Co. Kgaa Reaktive 2K-Schmelzklebstoffzusammensetzung
RU2628949C2 (ru) 2012-04-09 2017-08-25 Эйвери Деннисон Корпорейшн Клеи, чувствительные к давлению, на основе перерабатываемых материалов и способы с отверждением уф
JP6582363B2 (ja) * 2013-12-03 2019-10-02 オート化学工業株式会社 接着剤組成物及びその製造方法
DE102015200315B4 (de) * 2015-01-13 2018-05-30 Altana Ag Elektroisolierlack für OLED-Leuchtelemente sowie dessen Verwendung
CN105694750A (zh) * 2016-02-03 2016-06-22 河北华夏实业有限公司 一种新型耐高温聚氯乙烯胶带的制作方法

Citations (5)

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Publication number Priority date Publication date Assignee Title
WO1996011241A2 (en) * 1994-10-11 1996-04-18 Shell Internationale Research Maatschappij B.V. Curable binders for pressure sensitive adhesives and sealants
EP0882775A1 (de) * 1996-12-02 1998-12-09 Daicel Chemical Industries, Ltd. Heissschmelzklebstoffzusammensetzung mit hervorragender widerstandsfähigkeit gegenüber wärme und kälte
WO2000000566A1 (en) * 1998-06-29 2000-01-06 Minnesota Mining And Manufacturing Company Hot-melt adhesive composition, heat-bonding film adhesive and adhering method using hot-melt adhesive composition
EP1130070A2 (de) * 2000-02-29 2001-09-05 National Starch and Chemical Investment Holding Corporation Klebstoffe für thermoschrumpfbare Filme und Etiketten
WO2003002684A1 (en) * 2001-06-26 2003-01-09 National Starch And Chemical Investment Holding Corporation Radiation curable adhesive

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KR100227998B1 (ko) * 1991-04-29 1999-11-01 오노 알버어스 가교-결합 에폭시 관능화 폴리디엔 블럭 중합체, 그들의 제조 방법, 그들을 포함하는 조성물 및 출발 블럭 공중합체
TW226380B (de) * 1992-04-03 1994-07-11 Shell Internat Res Schappej B V
US5247026A (en) * 1992-06-19 1993-09-21 Shell Oil Company Randomly epoxidized small star polymers
US5393818A (en) * 1993-04-06 1995-02-28 Shell Oil Company Solvent-free laminating adhesive composition from epoxidized block polymer
US5436063A (en) * 1993-04-15 1995-07-25 Minnesota Mining And Manufacturing Company Coated abrasive article incorporating an energy cured hot melt make coat
US5837749A (en) * 1996-04-26 1998-11-17 Shell Oil Company Non-aqueous solvent free process for making UV curable adhesives and sealants from epoxidized monohydroxylated diene polymers (III)
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ATE276326T1 (de) 1998-10-09 2004-10-15 Kraton Polymers Res Bv Strahlenhärtbares klebemittel
AU1716000A (en) 1998-11-10 2000-05-29 Ato Findley, Inc. Radiation curable pressure sensitive hot melt adhesive
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EP1217011B1 (de) 2000-12-21 2005-10-12 Kuraray Co., Ltd. Verfahren zur Herstellung von epoxydierten Polymeren
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Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996011241A2 (en) * 1994-10-11 1996-04-18 Shell Internationale Research Maatschappij B.V. Curable binders for pressure sensitive adhesives and sealants
EP0882775A1 (de) * 1996-12-02 1998-12-09 Daicel Chemical Industries, Ltd. Heissschmelzklebstoffzusammensetzung mit hervorragender widerstandsfähigkeit gegenüber wärme und kälte
WO2000000566A1 (en) * 1998-06-29 2000-01-06 Minnesota Mining And Manufacturing Company Hot-melt adhesive composition, heat-bonding film adhesive and adhering method using hot-melt adhesive composition
EP1130070A2 (de) * 2000-02-29 2001-09-05 National Starch and Chemical Investment Holding Corporation Klebstoffe für thermoschrumpfbare Filme und Etiketten
WO2003002684A1 (en) * 2001-06-26 2003-01-09 National Starch And Chemical Investment Holding Corporation Radiation curable adhesive

Also Published As

Publication number Publication date
AU2006212536A1 (en) 2006-08-17
WO2006084537A2 (de) 2006-08-17
US7682477B2 (en) 2010-03-23
EP1846529A2 (de) 2007-10-24
AU2006212536B2 (en) 2012-04-19
US20080039594A1 (en) 2008-02-14
BRPI0606944A2 (pt) 2009-07-28
DE102005006282A1 (de) 2006-08-24

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