WO2009004902A1 - 異方性導電膜及びその製造方法、並びに接合体 - Google Patents
異方性導電膜及びその製造方法、並びに接合体 Download PDFInfo
- Publication number
- WO2009004902A1 WO2009004902A1 PCT/JP2008/060738 JP2008060738W WO2009004902A1 WO 2009004902 A1 WO2009004902 A1 WO 2009004902A1 JP 2008060738 W JP2008060738 W JP 2008060738W WO 2009004902 A1 WO2009004902 A1 WO 2009004902A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- conductive particles
- conductive film
- anisotropic conductive
- bonded body
- layer
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
- Y10T428/264—Up to 3 mils
- Y10T428/265—1 mil or less
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Insulated Conductors (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Laminated Bodies (AREA)
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008800037526A CN101601171B (zh) | 2007-07-03 | 2008-06-12 | 各向异性导电膜和其制造方法以及接合体 |
US12/473,355 US7931956B2 (en) | 2007-07-03 | 2009-05-28 | Anisotropic conductive film, method for producing the same, and bonded structure |
HK10102514A HK1135804A1 (en) | 2007-07-03 | 2010-03-10 | Anisotropic conductive film and method for producing the same, and bonded body |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-175428 | 2007-07-03 | ||
JP2007175428A JP4880533B2 (ja) | 2007-07-03 | 2007-07-03 | 異方性導電膜及びその製造方法、並びに接合体 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/473,355 Continuation US7931956B2 (en) | 2007-07-03 | 2009-05-28 | Anisotropic conductive film, method for producing the same, and bonded structure |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009004902A1 true WO2009004902A1 (ja) | 2009-01-08 |
Family
ID=40225956
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/060738 WO2009004902A1 (ja) | 2007-07-03 | 2008-06-12 | 異方性導電膜及びその製造方法、並びに接合体 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7931956B2 (ja) |
JP (1) | JP4880533B2 (ja) |
KR (1) | KR101035864B1 (ja) |
CN (1) | CN101601171B (ja) |
HK (1) | HK1135804A1 (ja) |
TW (1) | TWI377240B (ja) |
WO (1) | WO2009004902A1 (ja) |
Cited By (3)
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JP2015149128A (ja) * | 2014-02-04 | 2015-08-20 | デクセリアルズ株式会社 | 異方性導電フィルム及びその製造方法 |
JP2015149132A (ja) * | 2014-02-04 | 2015-08-20 | デクセリアルズ株式会社 | 異方性導電フィルム及びその製造方法 |
WO2022168972A1 (ja) * | 2021-02-08 | 2022-08-11 | デクセリアルズ株式会社 | 接続体の製造方法,接続体 |
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US20090278891A1 (en) * | 1997-07-15 | 2009-11-12 | Silverbrook Research Pty Ltd | Printhead IC With Filter Structure At Inlet To Ink Chambers |
US8518304B1 (en) | 2003-03-31 | 2013-08-27 | The Research Foundation Of State University Of New York | Nano-structure enhancements for anisotropic conductive material and thermal interposers |
CN101553084B (zh) * | 2008-04-01 | 2010-12-08 | 富葵精密组件(深圳)有限公司 | 线路基板及线路基板的制作方法 |
KR101307198B1 (ko) | 2009-01-28 | 2013-09-11 | 스미도모쥬기가이고교 가부시키가이샤 | 하이브리드형 작업기계 및 축전제어장치 |
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JP4673931B2 (ja) * | 2009-08-26 | 2011-04-20 | 積水化学工業株式会社 | 異方性導電材料及び接続構造体 |
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WO2019235596A1 (ja) * | 2018-06-06 | 2019-12-12 | デクセリアルズ株式会社 | 接続体、接続体の製造方法、接続方法 |
KR20210141953A (ko) * | 2019-03-13 | 2021-11-23 | 쇼와덴코머티리얼즈가부시끼가이샤 | 회로 접속용 접착제 필름 및 그 제조 방법, 회로 접속 구조체의 제조 방법, 및, 접착제 필름 수용 세트 |
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JPH11306861A (ja) * | 1998-04-09 | 1999-11-05 | Minnesota Mining & Mfg Co <3M> | 導電性接着剤組成物、それを有する異方導電性接着フィルム及びそのフィルムを用いた接続方法 |
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2007
- 2007-07-03 JP JP2007175428A patent/JP4880533B2/ja active Active
-
2008
- 2008-06-12 WO PCT/JP2008/060738 patent/WO2009004902A1/ja active Application Filing
- 2008-06-12 KR KR1020097011832A patent/KR101035864B1/ko active IP Right Grant
- 2008-06-12 CN CN2008800037526A patent/CN101601171B/zh active Active
- 2008-06-17 TW TW97122605A patent/TWI377240B/zh active
-
2009
- 2009-05-28 US US12/473,355 patent/US7931956B2/en active Active
-
2010
- 2010-03-10 HK HK10102514A patent/HK1135804A1/xx unknown
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JPH11306861A (ja) * | 1998-04-09 | 1999-11-05 | Minnesota Mining & Mfg Co <3M> | 導電性接着剤組成物、それを有する異方導電性接着フィルム及びそのフィルムを用いた接続方法 |
JP2000003621A (ja) * | 1998-06-12 | 2000-01-07 | Sekisui Chem Co Ltd | 異方性導電膜及び導電接続構造体 |
JP2002358825A (ja) * | 2001-05-31 | 2002-12-13 | Hitachi Chem Co Ltd | 異方導電性接着フィルム |
JP2003064324A (ja) * | 2001-06-11 | 2003-03-05 | Hitachi Chem Co Ltd | 異方導電性接着フィルム及びそれを用いた回路基板の接続方法、回路基板接続体 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015149128A (ja) * | 2014-02-04 | 2015-08-20 | デクセリアルズ株式会社 | 異方性導電フィルム及びその製造方法 |
JP2015149132A (ja) * | 2014-02-04 | 2015-08-20 | デクセリアルズ株式会社 | 異方性導電フィルム及びその製造方法 |
KR20160117456A (ko) * | 2014-02-04 | 2016-10-10 | 데쿠세리아루즈 가부시키가이샤 | 이방성 도전 필름 및 그의 제조 방법 |
US10849236B2 (en) | 2014-02-04 | 2020-11-24 | Dexerials Corporation | Anisotropic conductive film and production method of the same |
US10902973B2 (en) | 2014-02-04 | 2021-01-26 | Dexerials Corporation | Anisotropic conductive film and production method of the same |
KR102450709B1 (ko) * | 2014-02-04 | 2022-10-06 | 데쿠세리아루즈 가부시키가이샤 | 이방성 도전 필름 및 그의 제조 방법 |
WO2022168972A1 (ja) * | 2021-02-08 | 2022-08-11 | デクセリアルズ株式会社 | 接続体の製造方法,接続体 |
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US7931956B2 (en) | 2011-04-26 |
HK1135804A1 (en) | 2010-06-11 |
KR101035864B1 (ko) | 2011-05-20 |
TW200914572A (en) | 2009-04-01 |
TWI377240B (en) | 2012-11-21 |
JP2009016133A (ja) | 2009-01-22 |
US20090239082A1 (en) | 2009-09-24 |
CN101601171A (zh) | 2009-12-09 |
KR20090092796A (ko) | 2009-09-01 |
JP4880533B2 (ja) | 2012-02-22 |
CN101601171B (zh) | 2011-04-20 |
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