WO2009078469A1 - 絶縁被覆導電粒子、異方導電接着フィルム及びそれらの製造方法 - Google Patents
絶縁被覆導電粒子、異方導電接着フィルム及びそれらの製造方法 Download PDFInfo
- Publication number
- WO2009078469A1 WO2009078469A1 PCT/JP2008/073119 JP2008073119W WO2009078469A1 WO 2009078469 A1 WO2009078469 A1 WO 2009078469A1 JP 2008073119 W JP2008073119 W JP 2008073119W WO 2009078469 A1 WO2009078469 A1 WO 2009078469A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- particle
- insulator
- methods
- adhesive film
- covered
- Prior art date
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0221—Insulating particles having an electrically conductive coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0224—Conductive particles having an insulating coating
Abstract
基材粒子と該基材粒子表面の少なくとも一部を被覆する多層の金属めっき層とを有する導電粒子と、導電粒子表面の少なくとも一部を被覆する絶縁性微粒子と、を備える絶縁被覆導電粒子であって、前記基材粒子が平均粒径4.0μm以下の樹脂粒子であり、導電粒子が水酸基、カルボキシル基、アルコキシ基及びアルコキシカルボニル基から選ばれる少なくとも1種の官能基を表面に有し、絶縁性微粒子が水酸基を表面に有する無機酸化物微粒子である、絶縁被覆導電粒子。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-325862 | 2007-12-18 | ||
JP2007325862 | 2007-12-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009078469A1 true WO2009078469A1 (ja) | 2009-06-25 |
Family
ID=40795582
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/073119 WO2009078469A1 (ja) | 2007-12-18 | 2008-12-18 | 絶縁被覆導電粒子、異方導電接着フィルム及びそれらの製造方法 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2009170414A (ja) |
WO (1) | WO2009078469A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011002065A1 (ja) * | 2009-07-01 | 2011-01-06 | 日立化成工業株式会社 | 被覆導電粒子及びその製造方法 |
US8698394B2 (en) | 2010-03-31 | 2014-04-15 | 3M Innovative Properties Company | Electronic articles for displays and methods of making same |
CN114630813A (zh) * | 2019-10-29 | 2022-06-14 | 京瓷株式会社 | 陶瓷结构体、吸嘴、刀具、镊子、磨损检测器、粉体除电装置、粉体制造装置、顶销、搬运手及纤维引导件 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0250858A (ja) * | 1988-08-12 | 1990-02-20 | Tokyo Electric Co Ltd | 印刷装置 |
JP5554077B2 (ja) * | 2009-09-15 | 2014-07-23 | 株式会社日本触媒 | 絶縁性微粒子被覆導電性微粒子、異方性導電接着剤組成物、および異方性導電成形体 |
JP5471504B2 (ja) * | 2010-01-25 | 2014-04-16 | 日立化成株式会社 | 異方導電性フィルム |
JP5803393B2 (ja) * | 2011-08-02 | 2015-11-04 | 日立化成株式会社 | 絶縁被覆導電粒子及び異方導電性接着フィルム |
KR101368577B1 (ko) * | 2012-02-21 | 2014-02-28 | 세키스이가가쿠 고교가부시키가이샤 | 도전성 입자, 도전성 입자의 제조 방법, 도전 재료 및 접속 구조체 |
JP6212374B2 (ja) * | 2012-12-05 | 2017-10-11 | 積水化学工業株式会社 | 絶縁性粒子付き導電性粒子、絶縁性粒子付き導電性粒子の製造方法、導電材料及び接続構造体 |
KR20180029945A (ko) * | 2015-07-14 | 2018-03-21 | 세키스이가가쿠 고교가부시키가이샤 | 도전 재료 및 접속 구조체 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000149677A (ja) * | 1998-11-05 | 2000-05-30 | Hitachi Chem Co Ltd | 異方導電性接着フィルムの製造装置 |
JP2003317827A (ja) * | 2002-04-26 | 2003-11-07 | Hitachi Chem Co Ltd | 異方導電性接着剤及び回路板 |
WO2005004171A1 (ja) * | 2003-07-04 | 2005-01-13 | Natoco Co., Ltd. | 被覆導電性粒子、導電性材料、異方性導電接着剤および異方性導電接合構造 |
JP2005044773A (ja) * | 2003-07-07 | 2005-02-17 | Sekisui Chem Co Ltd | 被覆導電性粒子、異方性導電材料及び導電接続構造体 |
JP2005187637A (ja) * | 2003-12-25 | 2005-07-14 | Sekisui Chem Co Ltd | 異方導電性接着剤、液晶表示素子用上下導通材料及び液晶表示素子 |
JP2005197091A (ja) * | 2004-01-07 | 2005-07-21 | Hitachi Chem Co Ltd | 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法 |
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2008
- 2008-12-18 WO PCT/JP2008/073119 patent/WO2009078469A1/ja active Application Filing
- 2008-12-18 JP JP2008322620A patent/JP2009170414A/ja active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000149677A (ja) * | 1998-11-05 | 2000-05-30 | Hitachi Chem Co Ltd | 異方導電性接着フィルムの製造装置 |
JP2003317827A (ja) * | 2002-04-26 | 2003-11-07 | Hitachi Chem Co Ltd | 異方導電性接着剤及び回路板 |
WO2005004171A1 (ja) * | 2003-07-04 | 2005-01-13 | Natoco Co., Ltd. | 被覆導電性粒子、導電性材料、異方性導電接着剤および異方性導電接合構造 |
JP2005044773A (ja) * | 2003-07-07 | 2005-02-17 | Sekisui Chem Co Ltd | 被覆導電性粒子、異方性導電材料及び導電接続構造体 |
JP2005187637A (ja) * | 2003-12-25 | 2005-07-14 | Sekisui Chem Co Ltd | 異方導電性接着剤、液晶表示素子用上下導通材料及び液晶表示素子 |
JP2005197091A (ja) * | 2004-01-07 | 2005-07-21 | Hitachi Chem Co Ltd | 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011002065A1 (ja) * | 2009-07-01 | 2011-01-06 | 日立化成工業株式会社 | 被覆導電粒子及びその製造方法 |
CN102474023A (zh) * | 2009-07-01 | 2012-05-23 | 日立化成工业株式会社 | 包覆导电粒子及其制造方法 |
US8698394B2 (en) | 2010-03-31 | 2014-04-15 | 3M Innovative Properties Company | Electronic articles for displays and methods of making same |
CN114630813A (zh) * | 2019-10-29 | 2022-06-14 | 京瓷株式会社 | 陶瓷结构体、吸嘴、刀具、镊子、磨损检测器、粉体除电装置、粉体制造装置、顶销、搬运手及纤维引导件 |
CN114630813B (zh) * | 2019-10-29 | 2023-11-21 | 京瓷株式会社 | 陶瓷结构体、吸嘴、刀具、镊子、磨损检测器、粉体除电装置、粉体制造装置、顶销、搬运手及纤维引导件 |
Also Published As
Publication number | Publication date |
---|---|
JP2009170414A (ja) | 2009-07-30 |
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