TW200730599A - Adhesive composition, circuit connecting material, connecting structure circuit member connecting method - Google Patents

Adhesive composition, circuit connecting material, connecting structure circuit member connecting method

Info

Publication number
TW200730599A
TW200730599A TW095142436A TW95142436A TW200730599A TW 200730599 A TW200730599 A TW 200730599A TW 095142436 A TW095142436 A TW 095142436A TW 95142436 A TW95142436 A TW 95142436A TW 200730599 A TW200730599 A TW 200730599A
Authority
TW
Taiwan
Prior art keywords
circuit
adhesive composition
base material
circuit member
material particle
Prior art date
Application number
TW095142436A
Other languages
Chinese (zh)
Other versions
TWI367246B (en
Inventor
Tomomi Yokozumi
Masaki Fujii
Kenzou Takemura
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW200730599A publication Critical patent/TW200730599A/en
Application granted granted Critical
Publication of TWI367246B publication Critical patent/TWI367246B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0218—Composite particles, i.e. first metal coated with second metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0266—Size distribution

Abstract

An adhesive composition of the present invention is provided with an adhesive component and conductive particles 10 dispersed in the adhesive component. The conductive particle 10 is provided with a base material particle 1 constituting the center portion, a metal plating layer 3 covering at least a part of the surface of the base material particle 1, and a plurality of metal fine particles 2 arranged inside the metal plating layer 3 and on the surface of the base material particle 1.
TW095142436A 2005-11-18 2006-11-16 Adhesive composition, circuit connecting material, connecting structure circuit member connecting method TW200730599A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005334235 2005-11-18
JP2006178346 2006-06-28

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TWI367246B TWI367246B (en) 2012-07-01

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TW095142436A TW200730599A (en) 2005-11-18 2006-11-16 Adhesive composition, circuit connecting material, connecting structure circuit member connecting method

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KR (2) KR101049609B1 (en)
CN (1) CN101309993B (en)
TW (2) TW201202375A (en)
WO (1) WO2007058159A1 (en)

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JP2011231326A (en) 2011-11-17
TWI367246B (en) 2012-07-01
CN101309993B (en) 2012-06-27
KR20110048079A (en) 2011-05-09
JPWO2007058159A1 (en) 2009-04-30
CN101309993A (en) 2008-11-19
WO2007058159A1 (en) 2007-05-24
JP4877230B2 (en) 2012-02-15
KR101049609B1 (en) 2011-07-14
KR20080072658A (en) 2008-08-06

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