JP2823799B2 - Anisotropic conductive adhesive - Google Patents
Anisotropic conductive adhesiveInfo
- Publication number
- JP2823799B2 JP2823799B2 JP6178623A JP17862394A JP2823799B2 JP 2823799 B2 JP2823799 B2 JP 2823799B2 JP 6178623 A JP6178623 A JP 6178623A JP 17862394 A JP17862394 A JP 17862394A JP 2823799 B2 JP2823799 B2 JP 2823799B2
- Authority
- JP
- Japan
- Prior art keywords
- particles
- anisotropic conductive
- adhesive
- conductive particles
- conductive adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Liquid Crystal (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
Description
【0001】[0001]
【産業上の利用分野】本発明は、LCD、EL、LE
D、ECD、プラズマディスプレイなどの表示体の接続
端子とその駆動部分を搭載した回路基板あるいは各種電
気回路の基板間などの接続に有用な、2つの表示体、回
路基板の端子部に塗布して、これらを接着すると共にそ
の両端子間を電気的に接続する異方導電接着剤に関す
る。This invention relates to LCD, EL, LE
D, ECD, two display bodies useful for connection between connection terminals of display bodies such as plasma displays and circuit boards on which the driving parts are mounted, or boards of various electric circuits, etc., are applied to terminal portions of circuit boards. And an anisotropic conductive adhesive for adhering them and electrically connecting the two terminals.
【0002】[0002]
【従来の技術】近年、2つの端子間に電気的導通を与え
る手段として、絶縁性接着剤中に導電性粒子を均一に分
散した種々の異方導電接着剤を、端子間に薄膜状に塗布
したものが知られている。この異方導電接着剤が使用さ
れる電子機器の普及に伴い、自動車内、屋外などさまざ
まな環境下での接続の信頼性が要求されるようになって
いる。通常、導電性粒子には、真球状で、できるだけ粒
径を均一にした、カーボン粒子、金、銀、銅、ニッケ
ル、アルミニウムなどの金属粒子、表面を金属でメッキ
したプラスチックボールなどが使用されてきているが、
カーボン粒子は接触抵抗が高く安定した接続状態を保持
しにくいため、より低抵抗で安定した接続の得られる金
属粒子や表面を金属でメッキしたプラスチックボールが
多用されている。2. Description of the Related Art In recent years, various anisotropic conductive adhesives in which conductive particles are uniformly dispersed in an insulating adhesive have been applied in a thin film form between terminals as means for providing electrical conduction between two terminals. Is known. With the widespread use of electronic devices using this anisotropic conductive adhesive, reliability of connection in various environments such as in automobiles and outdoors has been required. Usually, carbon particles, metal particles such as gold, silver, copper, nickel, and aluminum, which are spherical and have a uniform particle size, and plastic balls whose surfaces are plated with metal have been used as the conductive particles. But
Since carbon particles have a high contact resistance and are difficult to maintain a stable connection state, metal particles that provide stable connection with lower resistance and plastic balls whose surfaces are plated with metal are often used.
【0003】[0003]
【発明が解決しようとする課題】しかし、導電性粒子と
して金属粒子を用いた場合には、絶縁性接着剤との比重
差が大きいため、絶縁性接着剤中に導電性粒子を均一に
分散しても保管中に導電性粒子と絶縁性接着剤とが分離
・沈降し易く、導電性粒子が均一に分散した異方導電接
着剤の製造が困難で作業性が悪いという欠点があった。
表面を金属でメッキしたプラスチックボールでは、この
欠点はないが、プラスチックボール表面と金属メッキと
の界面の密着力が弱く、しかもプラスチックボールの圧
縮変形量が大きいために、端子の圧着接続時に金属メッ
キにクラックを生じて部分的に金属メッキが剥れ、リー
クをひきい起こし易く、安定した電気的接続が図れなく
なることがあった。プラスチックボールはまた絶縁性ゆ
えに帯電し易く、そのため導電性粒子同士が凝集体を作
り易く、金属メッキ後の粒子が球形状のもののほか凝集
体にメッキされたものも混入し、粒子サイズや形状が不
均一になったり、絶縁性接着剤への分散配合が困難とな
り、凝集導電粒子による隣接回路間の短絡を生ずること
があった。However, when metal particles are used as the conductive particles, the difference in specific gravity from the insulating adhesive is large, so that the conductive particles are uniformly dispersed in the insulating adhesive. However, the conductive particles and the insulating adhesive tend to separate and settle during storage, making it difficult to produce an anisotropic conductive adhesive in which the conductive particles are uniformly dispersed, resulting in poor workability.
Plastic balls with metal plating on the surface do not have this drawback, but the adhesion between the plastic ball surface and the metal plating is weak, and the plastic ball has a large amount of compressive deformation. In some cases, the metal plating was partially peeled off due to cracks, and a leak was easily caused, and stable electrical connection could not be achieved. Plastic balls are also insulative and are easily charged due to their insulating properties.Therefore, conductive particles are likely to form aggregates.Particles after metal plating are also spherical, as well as those that are plated on aggregates. In some cases, nonuniformity or difficulty in dispersing and blending in the insulating adhesive was caused, and a short circuit between adjacent circuits due to agglomerated conductive particles sometimes occurred.
【0004】さらに金属メッキは通常、下層にNiなど
の卑金属、上層にAuなどの貴金属を施す2層構造と
し、総厚は 0.5μm以下にすることが多いが、金属メッ
キされた凝集体が外力などにより分離して下層の卑金属
が露出し、せっかく表面に貴金属メッキを施しても下層
でメッキの腐食が発生することがあった。また、真球状
の粒子は接続される電極と一点のみで接触するため、使
用環境下での温度、湿度などの変化による絶縁性接着剤
の微視的な動きや、振動、落下などの外力に対して接触
点が外れ易く、電気的導通の信頼性を損なった。したが
って、本発明の目的は、種々の使用環境下において、導
電性粒子が絶縁性接着剤の残存応力による微視的な動き
や、振動、落下などの外力を受けても容易に接触点を外
さない状態を保ち、電気的接続の信頼性を大きく向上す
ると共に製造時の作業性のよい異方導電接着剤を提供す
るものである。Further, the metal plating usually has a two-layer structure in which a base metal such as Ni is applied to a lower layer and a noble metal such as Au is applied to an upper layer, and the total thickness is often 0.5 μm or less. For example, the base metal of the lower layer is exposed by separation, and even if noble metal plating is performed on the surface, plating corrosion may occur in the lower layer. In addition, since spherical particles come into contact with the connected electrode at only one point, they are not affected by microscopic movement of the insulating adhesive due to changes in temperature, humidity, etc., in the operating environment, or by external forces such as vibration and dropping. On the other hand, the contact points easily come off, and the reliability of electrical conduction is impaired. Therefore, an object of the present invention is to easily remove a contact point even if the conductive particles receive an external force such as microscopic movement, vibration, or drop due to residual stress of the insulating adhesive under various use environments. An object of the present invention is to provide an anisotropic conductive adhesive which keeps no electrical connection, greatly improves the reliability of electrical connection, and has good workability during manufacturing.
【0005】[0005]
【課題を解決するための手段】本発明者は異方導電接着
剤における電気的接続の信頼性が導電性粒子の接触点数
および接触点の清浄度に起因し、接触点が多いほど、ま
た接触点の清浄度が高いほど、その信頼性が向上するこ
と、さらに導電性粒子の核としてカーボン粒子を用いる
と、導電性粒子の比重が絶縁性接着剤のそれに近づいて
製造時の分離が防止されると共に、カーボン粒子表面の
多孔性によって金属メッキの密着性が向上し、圧着時の
メッキ層の剥離も防止できること、さらにカーボン粒子
の導電性により導電性粒子の帯電を妨げて導電性粒子同
士の凝集が防止できることを見出し、本発明に至った。
すなわち、本発明による異方導電接着剤は、(イ)10%
圧縮時の強度が 10kgf/mm2以上、 80kgf/mm2以下で、表
面にタールまたはピッチの付着・焼成により黒鉛化され
た複数の突起をもつカーボン粒子を核とし、(ロ)この
核の表面に厚さ0.05〜 0.3μm の卑金属メッキ層と厚さ
50〜 500Åの貴金属メッキ層とを順次設けた、全体の粒
径が5〜 100μm の導電性粒子を、(ハ)絶縁性接着剤
中に分散してなることを特徴とするものである。The inventor of the present invention has found that the reliability of the electrical connection in the anisotropic conductive adhesive depends on the number of contact points of the conductive particles and the cleanliness of the contact points. The higher the cleanliness of a point, the higher its reliability.In addition, if carbon particles are used as the core of the conductive particles, the specific gravity of the conductive particles approaches that of the insulating adhesive, preventing separation during manufacturing. At the same time, the porosity of the carbon particles surface improves the adhesion of metal plating and prevents the plating layer from peeling off during compression, and the conductivity of the carbon particles prevents the conductive particles from being charged due to the conductivity of the carbon particles. The present inventors have found that aggregation can be prevented, and have reached the present invention.
That is, the anisotropic conductive adhesive according to the present invention has (a) 10%
Strength in compression is 10 kgf / mm 2 or more, at 80 kgf / mm 2 or less, the table
Graphite by attaching tar or pitch to the surface and firing
Carbon particles having a plurality of projections at the core, (ii) the
Base metal plating layer with thickness of 0.05-0.3μm on core surface and thickness
Provided a noble metal plating layer of 50 to 500 Å in sequence, the conductive particles of the overall particle size. 5 to 100 [mu] m, and is characterized in Rukoto such dispersed in (c) an insulating adhesive.
【0006】上記導電性粒子の核としてのカーボン粒子
には、接触点を増やすために複数の突起を有するものが
用いられる。突起が小さすぎたり少なすぎたりすると、
表面のメッキ後に多点での接触ができなくなるため、導
電性粒子の仮想最大内接球径より 0.5μm 以上、とくに
は2μm 以上突出し、粒子1個当たり4個以上有するの
が好ましい。カーボン粒子は端子への圧着接続時に突起
部に荷重が集中するため高強度のものがよく、具体的に
は10%圧縮時の強度で 10kgf/mm2以上、とくには 15kgf
/mm2以上で通常は 80kgf/mm2以下、また粒子の圧縮破壊
強度で 30kgf/mm2以上、とくには 50kgf/mm2以上で通常
は100kgf/mm2以下のものが好ましい。このようなカーボ
ン粒子としては、原料の真球状カーボン粒子の表面に黒
鉛化が容易なタールまたはピッチを付着させた後、約 8
00〜 3,000℃で焼成して黒鉛化させたものがよく、これ
により一層均一な粒子径をもつ高強度の粒子となる。Some of the carbon particles as the core of the conductive particles have a plurality of protrusions in order to increase the number of contact points.
Using et al is. If the projections are too small or too small,
Since contact at multiple points becomes impossible after plating of the surface, the conductive particles protrude 0.5 μm or more, particularly 2 μm or more from the virtual maximum inscribed sphere diameter, and preferably have 4 or more particles per particle. Carbon particles may include the high strength for load to the protrusion during crimp connection to the terminal to focus, specifically, in the strength at 10% compression 10 kgf / mm 2 or more, particularly 15kgf
/ mm 2 or more and usually 80 kgf / mm 2 or less, and the compressive breaking strength of the particles is preferably 30 kgf / mm 2 or more, particularly preferably 50 kgf / mm 2 or more and usually 100 kgf / mm 2 or less. As such carbon particles, tar or pitch, which can be easily graphitized, is attached to the surface of the raw spherical carbon particles, and then about 8%.
It is preferable to graphitize by baking at 00 to 3,000 ° C., which results in high-strength particles having a more uniform particle size.
【0007】カーボン粒子の表面は接触抵抗が高く接触
点が汚染され易いため、このカーボン粒子に金、銀、白
金、パラジウムなどの貴金属メッキを施して、清浄な表
面をもたせる必要がある。貴金属メッキを施し易くし、
かつ低い抵抗にするために、ニッケルなどの卑金属をメ
ッキしてから貴金属メッキを施すことが、一般に行われ
ている。このとき、ニッケルなどの卑金属メッキ層の厚
さは、薄すぎると上記のような貴金属メッキを施し易く
し、かつ低い抵抗にするといった効果が少なくなり、厚
すぎるとカーボン粒子表面の突起がなくなってしまうの
で、0.05〜 0.3μm 程度とすることがよく、貴金属メッ
キ層の厚さはコストの点からできる限り薄く、かつ確実
に表面を覆うように50〜 500Å、とくには 100〜 300Å
とすればよい。こうしてできた導電性粒子の突起を含め
た外径は、できるだけ均一なものがよく、大きすぎると
隣接電極間で短絡を生じ易くなるので、粒径5〜 100μ
m の範囲内のものが好ましい。Since the surface of the carbon particles has high contact resistance and the contact points are easily contaminated, it is necessary to apply a noble metal plating of gold, silver, platinum, palladium or the like to the carbon particles to have a clean surface. Make it easy to apply precious metal plating,
In order to obtain a low resistance, plating of a base metal such as nickel and then noble metal plating is generally performed. At this time, the thickness of the base metal plating layer , such as nickel, is too thin to facilitate the precious metal plating as described above, and the effect of making the resistance low is reduced. Therefore, the thickness of the noble metal plating layer should be as small as possible from the viewpoint of cost, and should be 50 to 500 mm, especially 100 to 300 mm so as to cover the surface surely.
And it is sufficient. The outer diameter of the conductive particles including the protrusions thus formed is preferably as uniform as possible. If the diameter is too large, a short circuit is likely to occur between adjacent electrodes.
Those within the range of m are preferred.
【0008】得られた導電性粒子は次に絶縁性接着剤中
に分散させて本発明の異方導電接着剤とするが、この絶
縁性接着剤としては加熱によって接着性を示すものであ
れば熱可塑性、熱硬化性のいずれでもよく、熱可塑性の
ものは比較的低温、短時間の加熱で接着しポットライフ
も長く、熱硬化性のものは接着強度が大きく耐熱性も優
れているので、これらはその使用目的に応じて適宜選択
すればよい。この絶縁性接着剤の具体例としては、エチ
レン・酢酸ビニル共重合体、カルボキシル変成エチレン
・酢酸ビニル共重合体、エチレン・イソブチルアクリレ
ート共重合体、ポリアミド、ポリエステル、ポリメチル
メタクリレート、ポリビニルエーテル、ポリビニルブチ
ラール、ポリウレタン、スチレン・ブチレン・スチレン
(SBS)共重合体、カルボキシル変性SBS共重合
体、スチレン・イソプレン・スチレン(SIS)共重合
体、スチレン・エチレン・ブチレン・スチレン(SEB
S)共重合体、マレイン酸変性SEBS共重合体、ポリ
ブタジエンゴム、クロロプレンゴム(CR)、カルボキ
シル変性CR、スチレン・ブタジエンゴム、イソブチレ
ン・イソプレン共重合体、アクリロニトリル・ブタジエ
ンゴム(NBR)、カルボキシル変性NBR、エポキシ
樹脂、シリコーンゴム(SR)などが挙げられ、これら
は1種単独または2種以上を組合せて使用される。前記
導電性粒子の絶縁性接着剤中への分散量は、多過ぎて導
電性粒子が確率的に平面方向に連なって異方導電性を損
なわないようにするため、他方、少なすぎて接続すべき
電極上に粒子が少なくなって接続不良をきたし、断線、
高抵抗値化を招くことがないようにするため、絶縁性接
着剤 100容量部に対して 0.1〜30容量部、とくには1〜
15容量部が好ましい。The obtained conductive particles are then dispersed in an insulating adhesive to form the anisotropic conductive adhesive of the present invention. Thermoplastic, thermosetting may be any.The thermoplastic is bonded at a relatively low temperature and heating for a short time, the pot life is long, and the thermosetting one has high adhesive strength and excellent heat resistance, These may be appropriately selected according to the purpose of use. Specific examples of the insulating adhesive include ethylene / vinyl acetate copolymer, carboxyl-modified ethylene / vinyl acetate copolymer, ethylene / isobutyl acrylate copolymer, polyamide, polyester, polymethyl methacrylate, polyvinyl ether, and polyvinyl butyral. , Polyurethane, styrene-butylene-styrene (SBS) copolymer, carboxyl-modified SBS copolymer, styrene-isoprene-styrene (SIS) copolymer, styrene-ethylene-butylene-styrene (SEB)
S) Copolymer, maleic acid-modified SEBS copolymer, polybutadiene rubber, chloroprene rubber (CR), carboxyl-modified CR, styrene-butadiene rubber, isobutylene-isoprene copolymer, acrylonitrile-butadiene rubber (NBR), carboxyl-modified NBR , Epoxy resin, silicone rubber (SR) and the like, and these are used alone or in combination of two or more. The amount of the conductive particles dispersed in the insulating adhesive is too large, so that the conductive particles are stochastically connected in a planar direction so as not to impair the anisotropic conductivity. The particles on the electrode to be connected are reduced, resulting in poor connection, disconnection,
0.1 to 30 parts by volume, especially 1 to 100 parts by volume of insulating adhesive
15 parts by volume are preferred.
【0009】本発明の異方導電接着剤は前述したように
2つの接続すべき端子部に塗布して表示体および/また
は基板間を接着すると共にその両端子間を電気的に接続
するのであるが、この表示体としては、表示パネルなど
のガラス、LSIチップなどの金属、金属酸化物、ある
いはポリイミド、ポリエステル樹脂などをベースとした
フレキシブルプリント回路基板などが挙げられる。これ
らの表面には−OH、−COOH、−C=O、−COO
CH3 などの極性基を備えているため、上記絶縁性接着
剤にはこれに対応した官能基をもつことが望ましく、そ
の溶解度パラメーターとして 8.5以上、とくには 9.0以
上のものが望ましい。これら溶解度パラメーターの調整
に際し、上記アクリル樹脂、ニトリルゴム、クロロプレ
ンゴム、酢酸ビニル樹脂などを主剤とする接着剤では、
ベースポリマー自体が高い溶解度パラメーターをもって
いるためこのままでもよいが、ポリイソブチレン、ポリ
ブタジエン、ポリスチレンなどの低い溶解度パラメータ
ーをもつ樹脂を主剤とする場合には、ロジン、ロジン誘
導体、テルペン樹脂、テルペン・フェノール共重合体、
石油樹脂、クマロン・インデン樹脂、スチレン系樹脂、
イソプレン系樹脂、アルキルフェノール樹脂、フェノー
ル樹脂などの粘着付与剤を加えて極性を対応させること
ができる。As described above, the anisotropic conductive adhesive of the present invention is applied to two terminals to be connected to bond the display body and / or the substrate and to electrically connect both terminals. However, examples of the display include a flexible printed circuit board based on glass such as a display panel, metal such as an LSI chip, metal oxide, polyimide, polyester resin, or the like. These surfaces have -OH, -COOH, -C = O, -COO
Since the insulating adhesive has a polar group such as CH 3, it is preferable that the insulating adhesive has a functional group corresponding to the polar group, and the solubility parameter is preferably 8.5 or more, particularly preferably 9.0 or more. In adjusting these solubility parameters, the above-mentioned acrylic resin, nitrile rubber, chloroprene rubber, an adhesive mainly composed of vinyl acetate resin, etc.,
Since the base polymer itself has a high solubility parameter, this may be used as is, but when a resin having a low solubility parameter such as polyisobutylene, polybutadiene, or polystyrene is used as a base material, rosin, rosin derivative, terpene resin, terpene / phenol copolymer Coalescing,
Petroleum resin, coumarone-indene resin, styrene resin,
The polarity can be adjusted by adding a tackifier such as an isoprene-based resin, an alkylphenol resin, or a phenol resin.
【0010】本発明の異方導電接着剤には、さらに必要
に応じて、反応性助剤、架橋剤としてのフェノール樹
脂、ポリオール類、イソシアネート類、メラミン樹脂、
尿素樹脂、ウロトロピン樹脂、アミン類、酸無水物、過
酸化物、金属酸化物、トリフルオロ酢酸クロム塩などの
有機金属塩、チタン、ジルコニア、アルミニウムなどの
アルコキシド、ジブチル錫ジオキサイドなどの有機金属
化合物、2,2−ジエトシキアセトフェノン、ベンジル
などの光開始剤、アミン類、リン化合物、塩素化合物な
どの増感剤、さらには硬化剤、加硫剤、制御剤、劣化防
止剤、耐熱添加剤、熱伝導向上剤、軟化剤、着色剤、各
種カップリング剤、金属不活性剤などを適宜添加するこ
とができる。The anisotropic conductive adhesive of the present invention may further comprise, if necessary, a reactive auxiliary agent, a phenol resin as a crosslinking agent, a polyol, an isocyanate, a melamine resin,
Urea resins, urotropin resins, amines, acid anhydrides, peroxides, metal oxides, organic metal salts such as chromium trifluoroacetate, alkoxides such as titanium, zirconia and aluminum, and organic metal compounds such as dibutyltin dioxide , Photoinitiators such as 2,2-diethoxyacetophenone and benzyl, sensitizers such as amines, phosphorus compounds and chlorine compounds, as well as curing agents, vulcanizing agents, control agents, deterioration inhibitors, heat-resistant additives, Heat conduction improvers, softeners, coloring agents, various coupling agents, metal deactivators, and the like can be appropriately added.
【0011】本発明の異方導電接着剤は、接着成分が常
温、無溶剤で固形状態あるいは高粘度液状の場合、これ
を適当な溶剤に溶解し、印刷、コーティング、スプレー
などの公知の方法により、接続すべき表示体、電子・電
気回路基板の端子部に直接塗布形成して使用することも
できるが、セパレーターフィルムないしシート上に形成
した後、所望の寸法にカットし、これを接続端子部に転
写して用いたり、また、接着剤成分が液状である場合に
は接続作業時に接続端子部に塗布して用いることもでき
る。塗布後、接続すべき一方の表示体、電子・電気回路
基板の上方から加圧し、同時に加熱あるいは光、電子線
の照射により接着剤を活性化させ、2つの表示体および
/または回路基板を接着剤により接合・固定すると共
に、相対する両端子部を導電性粒子を介して電気的な接
続を行う。In the anisotropic conductive adhesive of the present invention, when the adhesive component is in a solid state or a high-viscosity liquid at room temperature and without a solvent, this is dissolved in an appropriate solvent, and the solution is prepared by a known method such as printing, coating and spraying. It can be used by directly applying it to the display unit to be connected or the terminal part of the electronic / electric circuit board, but after forming it on the separator film or sheet, it is cut to the desired size and this is connected to the connection terminal part. Alternatively, when the adhesive component is in a liquid state, it can be used by applying it to a connection terminal portion during connection work. After application, one display unit to be connected, pressurized from above the electronic / electric circuit board, and simultaneously activate the adhesive by heating or irradiation of light or electron beam to bond the two display units and / or the circuit board. In addition to bonding and fixing with an agent, both opposing terminal portions are electrically connected via conductive particles.
【0012】[0012]
【作用】本発明の異方導電接着剤は導電性粒子が複数の
突起をもち、表面が清浄な貴金属によって覆われた構造
であるため、接続すべき電極と多数の点で低い接触抵抗
を保持して接触し、振動、落下などの衝撃に耐え、長期
にわたる使用環境下での接続の信頼性を向上させ、カー
ボン粒子表面と金属メッキの密着性がよいために圧着時
にメッキが剥れたりすることなく安定した電気的接続が
達成され、さらに比重が絶縁性接着剤に近いために分離
することがなく、粒子の凝集も起こらないため製造時の
作業性にもすぐれたものである。The anisotropic conductive adhesive of the present invention has a structure in which conductive particles have a plurality of projections and the surface is covered with a clean noble metal, and thus has low contact resistance at many points with electrodes to be connected. Withstands shocks such as vibration and dropping, improves the reliability of the connection in a long-term use environment, and has good adhesion between the carbon particle surface and the metal plating. Thus, stable electrical connection is achieved without any problem, and since the specific gravity is close to that of the insulating adhesive, there is no separation, and there is no aggregation of particles.
【0013】[0013]
【実施例】以下、本発明の具体的態様を実施例および比
較例を挙げて説明する。 実施例 平均粒径20μmの球状フェノール樹脂粒子を焼成して平
均粒径14μmのカーボン粒子を作り、このカーボン粒子
100重量部に対しタール15重量部を加え、不活性ガス雰
囲気下で撹拌しながら 3,000℃で焼成し、図1に示すよ
うな多数の突起を有する平均粒径20μmのカーボン粒子
2を得た。その表面にニッケルメッキ(卑金属メッキ)
3を 0.1μm、さらにこの表面に金メッキ(貴金属メッ
キ)4を200Å行って導電性粒子1を得た。他方、クロ
ロプレンゴム(CR) 100重量部、飽和ポリエステル樹
脂10重量部、アルキルフェノール系粘着付与剤45重量
部、テルペンフェノール系粘着付与剤15重量部、酸化マ
グネシウム5重量部、酸化亜鉛4重量部をトルエンに溶
解し、40重量%の絶縁性接着剤溶液を調製した。この絶
縁性接着剤5の 100容量部に対して上記導電性粒子1を
10容量部加えて撹拌機で1時間混合し、図2に示す異方
導電接着剤7を得た。25μmのPETフィルム上に銀ペ
ーストにて 0.3mmピッチの回路を形成したフレキシブル
プリント回路基板(FPC、被接続基板)6上に、乾燥
後の膜厚が14μmとなるように上記異方導電接着剤7を
塗布し、異方導電接着剤層付きFPCを得た。EXAMPLES Specific embodiments of the present invention will be described below with reference to examples and comparative examples. EXAMPLE Spherical phenol resin particles having an average particle size of 20 μm were fired to produce carbon particles having an average particle size of 14 μm.
15 parts by weight of tar was added to 100 parts by weight, and calcined at 3,000 ° C. with stirring in an inert gas atmosphere to obtain carbon particles 2 having a large number of projections and an average particle diameter of 20 μm as shown in FIG. Nickel plating (base metal plating) on its surface
3 was subjected to 0.1 μm, and further gold plating (noble metal plating) 4 was applied to this surface at 200 ° to obtain conductive particles 1. On the other hand, 100 parts by weight of chloroprene rubber (CR), 10 parts by weight of a saturated polyester resin, 45 parts by weight of an alkylphenol-based tackifier, 15 parts by weight of a terpene phenol-based tackifier, 5 parts by weight of magnesium oxide, and 4 parts by weight of zinc oxide were dissolved in toluene. To prepare a 40% by weight insulating adhesive solution. The conductive particles 1 were added to 100 parts by volume of the insulating adhesive 5.
10 parts by volume were added and mixed with an agitator for 1 hour to obtain an anisotropic conductive adhesive 7 shown in FIG. The above anisotropic conductive adhesive is applied on a flexible printed circuit board (FPC, connected substrate) 6 having a circuit of 0.3 mm pitch formed of silver paste on a 25 μm PET film so that the film thickness after drying is 14 μm. 7 was applied to obtain an FPC with an anisotropic conductive adhesive layer.
【0014】比較例 平均粒径20μmの真球状フェノール樹脂粒子の表面にニ
ッケルメッキを 0.1μm、またさらに表面に金メッキを
200Å行った導電性粒子を得た。上記実施例1で調製し
た絶縁性接着剤溶液 100容量部中に、この導電性粒子10
容量部を加え、撹拌機で1時間混合したが、約5〜30個
程度の凝集体が存在した。以下、実施例1と同様の方法
で異方導電接着剤層付きFPCを得た。Comparative Example Nickel plating was applied on the surface of spherical phenol resin particles having an average particle diameter of 20 μm to 0.1 μm, and gold plating was further applied to the surface.
Conducted conductive particles were obtained at 200Å. The conductive particles 10 were added to 100 parts by volume of the insulating adhesive solution prepared in Example 1 above.
The volume was added and mixed for 1 hour with a stirrer, but about 5 to 30 aggregates were present. Hereinafter, an FPC with an anisotropic conductive adhesive layer was obtained in the same manner as in Example 1.
【0015】実施例および比較例のFPCを、図2に示
すように、面積抵抗率30ΩのITO薄膜(被接続基板
6)と 140℃30kg12秒の条件でヒートシールし、−40
℃、30分〜85℃、30分を1サイクルとした熱衝撃試験を
1,000時間行い、FPCの隣接電極間の抵抗値の測定を
行った。得られた結果を表1に示す。なお、表中の* は
短絡箇所における値を示し、**では導電性粒子の金メッ
キ表面にクラックが存在した。As shown in FIG. 2, the FPCs of the embodiment and the comparative example were heat-sealed with an ITO thin film (substrate 6 to be connected) having a sheet resistance of 30Ω at 140 ° C. for 30 kg for 12 seconds.
℃, 30 minutes ~ 85 ℃, thermal shock test with one cycle of 30 minutes
The measurement was performed for 1,000 hours, and the resistance value between the adjacent electrodes of the FPC was measured. Table 1 shows the obtained results. In the table, * indicates the value at the short-circuited point, and ** indicates that cracks were present on the gold-plated surface of the conductive particles.
【表1】 [Table 1]
【0016】[0016]
【発明の効果】本発明の異方導電接着剤によれば、導電
性粒子の凝集による短絡が防止され、貴金属メッキの剥
れによる接触抵抗の不安定化もなく、環境の変化による
絶縁性接着剤の微小な動きや、振動、落下などの外力に
耐え、使用環境下でのさまざまな動的ストレスによる接
触点の脱離を緩和し、低い接触抵抗を保つことによっ
て、高い電気的接続信頼性をもつ電気・電子部品が作業
性よく製造される。According to the anisotropic conductive adhesive of the present invention, a short circuit due to agglomeration of conductive particles is prevented, contact resistance is not destabilized due to peeling of noble metal plating, and insulating adhesive due to environmental changes. High electrical connection reliability by withstanding external forces such as small movements of the agent, vibration, and dropping, mitigating detachment of contact points due to various dynamic stresses in the operating environment, and maintaining low contact resistance Electrical and electronic parts having good workability.
【図面の簡単な説明】[Brief description of the drawings]
【図1】本発明の異方導電接着剤に使用される導電性粒
子の縦断面図である。FIG. 1 is a longitudinal sectional view of conductive particles used in an anisotropic conductive adhesive of the present invention.
【図2】本発明の異方導電接着剤の一使用例を示す縦断
面図である。FIG. 2 is a longitudinal sectional view showing one usage example of the anisotropic conductive adhesive of the present invention.
1‥導電性粒子 2‥カーボン粒子、
3‥卑金属メッキ層、 4‥貴金属メッキ層、 5‥絶縁性接着剤、
6‥被接続基板、 7‥異方導電接着剤。1) conductive particles 2) carbon particles,
3 ‥ base metal plating layer , 4 ‥ precious metal plating layer , 5 ‥ insulating adhesive,
6 ‥ Connected substrate, 7 ‥ Anisotropic conductive adhesive.
Claims (1)
上、 80kgf/mm2以下で、表面にタールまたはピッチの付
着・焼成により黒鉛化された複数の突起をもつカーボン
粒子を核とし、(ロ)この核の表面に厚さ0.05〜 0.3μ
m の卑金属メッキ層と厚さ50〜 500Åの貴金属メッキ層
とを順次設けた、全体の粒径が5〜 100μm の導電性粒
子を、(ハ)絶縁性接着剤中に分散してなることを特徴
とする異方導電接着剤。1. A (i) 10% strength in compression 10 kgf / mm 2 or more, at 80 kgf / mm 2 or less, with the tar or pitch to the surface
Carbon particles having a plurality of protrusions graphitized by deposition and firing are used as nuclei, and (b) the surface of the nuclei has a thickness of 0.05 to 0.3 μm.
m base metal plated layer and the thickness of 50 to 500 Å and a noble metal plating layer <br/> sequential provided in the conductive particles of the total particle diameter. 5 to 100 [mu] m, dispersed in (c) an insulating adhesive anisotropic conductive adhesive agent characterized Rukoto such Te.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6178623A JP2823799B2 (en) | 1994-07-29 | 1994-07-29 | Anisotropic conductive adhesive |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6178623A JP2823799B2 (en) | 1994-07-29 | 1994-07-29 | Anisotropic conductive adhesive |
Publications (2)
Publication Number | Publication Date |
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JPH0845337A JPH0845337A (en) | 1996-02-16 |
JP2823799B2 true JP2823799B2 (en) | 1998-11-11 |
Family
ID=16051691
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JP6178623A Expired - Fee Related JP2823799B2 (en) | 1994-07-29 | 1994-07-29 | Anisotropic conductive adhesive |
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JP (1) | JP2823799B2 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020160193A1 (en) * | 2001-02-21 | 2002-10-31 | Karel Hajmrle | Noble metal clad Ni/C conductive fillers and conductive polymers made therefrom |
JP4622533B2 (en) * | 2005-01-19 | 2011-02-02 | パナソニック株式会社 | Wiring board, wiring board manufacturing method, and electronic device |
WO2007058159A1 (en) * | 2005-11-18 | 2007-05-24 | Hitachi Chemical Company, Ltd. | Adhesive composition, circuit connecting material, connecting structure and circuit member connecting method |
KR100852501B1 (en) * | 2008-04-23 | 2008-08-18 | (주)대화엔지니어링 | Lead-in panel board for apartment house |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61195178A (en) * | 1985-02-25 | 1986-08-29 | Matsushita Electric Ind Co Ltd | Anisotropically conductive adhesive |
JP2546262B2 (en) * | 1987-03-25 | 1996-10-23 | 日立化成工業株式会社 | Circuit connecting member and method of manufacturing the same |
JPH0623350B2 (en) * | 1988-01-20 | 1994-03-30 | 信越ポリマー株式会社 | Anisotropic conductive adhesive |
JPH0266101A (en) * | 1988-09-01 | 1990-03-06 | Matsushita Electric Ind Co Ltd | Electric conductive particles and manufacture thereof |
JPH0725933B2 (en) * | 1988-12-22 | 1995-03-22 | 財団法人生産開発科学研究所 | Metallized coke powder |
JP3083535B2 (en) * | 1990-06-01 | 2000-09-04 | 積水化学工業株式会社 | Conductive fine particles and conductive adhesive |
-
1994
- 1994-07-29 JP JP6178623A patent/JP2823799B2/en not_active Expired - Fee Related
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