TW200734429A - Isotropically conductive adhesive sheet and circuit board - Google Patents
Isotropically conductive adhesive sheet and circuit boardInfo
- Publication number
- TW200734429A TW200734429A TW096101304A TW96101304A TW200734429A TW 200734429 A TW200734429 A TW 200734429A TW 096101304 A TW096101304 A TW 096101304A TW 96101304 A TW96101304 A TW 96101304A TW 200734429 A TW200734429 A TW 200734429A
- Authority
- TW
- Taiwan
- Prior art keywords
- conductive adhesive
- circuit board
- adhesive sheet
- isotropically conductive
- isotropically
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
- Conductive Materials (AREA)
- Laminated Bodies (AREA)
Abstract
An isotropically conductive adhesive sheet that realizes simplification of the step of bonding a metallic reinforcing plate to a main body of circuit board and imparting of conduction reliability and electromagnetic shielding effect to the circuit board; and a circuit board obtained by the use of the isotropically conductive adhesive sheet. Isotropically conductive adhesive sheet (1) includes mold release film (2) and, superimposed on a surface thereof, isotropically conductive adhesive layer (3). Numeral 5 refers to a main body of circuit board (bonded portion only shown), 6 to an insulating layer, 7 to an electrode of copper, etc., and 8 to a reinforcing plate. The isotropically conductive adhesive layer (3) consists of a binder containing conductive particles (4). The conductive particles (4) consist of a metal powder, or low-melting-point metal powder, having an average particle diameter of 5 to 50 μm and are added in an amount of 150 to 250 parts by weight per 100 parts by weight of binder.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006006404A JP2007189091A (en) | 2006-01-13 | 2006-01-13 | Isotropic conductive bonding sheet and circuit substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200734429A true TW200734429A (en) | 2007-09-16 |
Family
ID=38256249
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096101304A TW200734429A (en) | 2006-01-13 | 2007-01-12 | Isotropically conductive adhesive sheet and circuit board |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2007189091A (en) |
TW (1) | TW200734429A (en) |
WO (1) | WO2007080842A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI557207B (en) * | 2012-07-11 | 2016-11-11 | Tatsuta Densen Kk | A hardened conductive adhesive composition, an electromagnetic wave shielding film, and a conductive property Adhesive film, bonding method and its circuit board |
TWI669721B (en) * | 2014-03-19 | 2019-08-21 | 日商迪睿合股份有限公司 | Anisotropic conductive adhesive |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5280034B2 (en) * | 2007-10-10 | 2013-09-04 | 日東電工株式会社 | Double-sided adhesive tape or sheet for printed circuit board and printed circuit board |
JP5195061B2 (en) * | 2008-06-16 | 2013-05-08 | 株式会社デンソー | Conductive adhesive and member connecting method using the same |
JP5521227B2 (en) * | 2009-01-26 | 2014-06-11 | タツタ電線株式会社 | Conductive adhesive sheet, electromagnetic shielding material provided with the same, and printed wiring board |
JP2011178986A (en) * | 2010-02-02 | 2011-09-15 | Nitto Denko Corp | Adhesive composition for production of semiconductor device and adhesive sheet for production of semiconductor device |
JP4996727B2 (en) | 2010-08-31 | 2012-08-08 | 株式会社東芝 | Electronic devices and flexible printed wiring boards |
JP5395854B2 (en) | 2011-08-11 | 2014-01-22 | タツタ電線株式会社 | Printed wiring board and printed wiring board manufacturing method |
JP6258290B2 (en) | 2013-02-26 | 2018-01-10 | タツタ電線株式会社 | Reinforcing member for flexible printed wiring board, flexible printed wiring board, and shield printed wiring board |
JP5681824B1 (en) | 2013-10-01 | 2015-03-11 | 株式会社フジクラ | Wiring board assembly and manufacturing method thereof |
JP5736026B2 (en) * | 2013-11-13 | 2015-06-17 | タツタ電線株式会社 | Conductive adhesive sheet, wiring board including the same, and method for producing conductive adhesive sheet |
CN106576424B (en) | 2014-08-29 | 2020-08-25 | 拓自达电线株式会社 | Reinforcing member for flexible printed wiring board, and flexible printed wiring board provided with reinforcing member for flexible printed wiring board |
JP6467701B2 (en) * | 2014-10-28 | 2019-02-13 | 信越ポリマー株式会社 | Electromagnetic wave shielding film, flexible printed wiring board with electromagnetic wave shielding film, and manufacturing method thereof |
JP2016157781A (en) * | 2015-02-24 | 2016-09-01 | 株式会社巴川製紙所 | Conductive adhesive sheet, shield printed wiring board and electronic apparatus |
JP5854248B1 (en) | 2015-05-27 | 2016-02-09 | 東洋インキScホールディングス株式会社 | Conductive adhesive, and conductive adhesive sheet and electromagnetic wave shielding sheet using the same |
US20190373716A1 (en) | 2017-02-13 | 2019-12-05 | Tatsuta Electric Wire & Cable Co., Ltd. | Printed Wiring Board |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01206575A (en) * | 1988-02-15 | 1989-08-18 | Shin Etsu Polymer Co Ltd | Hot bond type connector with adhesive |
JP3157344B2 (en) * | 1993-04-27 | 2001-04-16 | 三洋電機株式会社 | Method for manufacturing conductive sheet and display device |
JP4684439B2 (en) * | 2001-03-06 | 2011-05-18 | 富士通株式会社 | Conductive particles, conductive composition, and method for manufacturing electronic device |
JP4403360B2 (en) * | 2003-02-28 | 2010-01-27 | Dic株式会社 | Conductive adhesive sheet |
KR100719993B1 (en) * | 2003-09-26 | 2007-05-21 | 히다치 가세고교 가부시끼가이샤 | Mixed Conductive Powder and Use Thereof |
JP4843979B2 (en) * | 2004-03-30 | 2011-12-21 | 住友ベークライト株式会社 | Circuit board |
JP4538266B2 (en) * | 2004-05-21 | 2010-09-08 | ソニーケミカル&インフォメーションデバイス株式会社 | Adhesive film, method for producing substrate with adhesive, and method for producing adhesive film |
-
2006
- 2006-01-13 JP JP2006006404A patent/JP2007189091A/en active Pending
-
2007
- 2007-01-09 WO PCT/JP2007/050062 patent/WO2007080842A1/en active Application Filing
- 2007-01-12 TW TW096101304A patent/TW200734429A/en unknown
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI557207B (en) * | 2012-07-11 | 2016-11-11 | Tatsuta Densen Kk | A hardened conductive adhesive composition, an electromagnetic wave shielding film, and a conductive property Adhesive film, bonding method and its circuit board |
TWI669721B (en) * | 2014-03-19 | 2019-08-21 | 日商迪睿合股份有限公司 | Anisotropic conductive adhesive |
Also Published As
Publication number | Publication date |
---|---|
JP2007189091A (en) | 2007-07-26 |
WO2007080842A1 (en) | 2007-07-19 |
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