CN102543894A - 电性连接垫结构及包含有多个电性连接垫结构的集成电路 - Google Patents

电性连接垫结构及包含有多个电性连接垫结构的集成电路 Download PDF

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CN102543894A
CN102543894A CN2011100090803A CN201110009080A CN102543894A CN 102543894 A CN102543894 A CN 102543894A CN 2011100090803 A CN2011100090803 A CN 2011100090803A CN 201110009080 A CN201110009080 A CN 201110009080A CN 102543894 A CN102543894 A CN 102543894A
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peristome
insulating barrier
integrated circuit
electric connection
mat structure
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CN102543894B (zh
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杨毓儒
卢智宏
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ILI Techonology Corp
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ILI Techonology Corp
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Abstract

本发明公开一种电性连接垫结构及包含有多个电性连接垫结构的集成电路。其中设置于该集成电路上的电性连接垫结构包含有一连接垫、一绝缘层以及一金凸块，其中该连接垫设置于该集成电路上；该绝缘层设置于该连接垫上方，其中该绝缘层仅具有一开口部，且该开口部的形状包含有至少一条状弯折处；该金凸块设置于该绝缘层上方，其中该金凸块可以通过该绝缘层的该开口部与该连接垫电连接。

Description

电性连接垫结构及包含有多个电性连接垫结构的集成电路
技术领域
本发明涉及一种电性连接垫结构，尤其是涉及一种设置于一集成电路上且应用于玻璃覆晶(Chip on Glass，COG)以及薄膜覆晶(Chip on Film，COF)封装中的一种电性连接垫结构。
背景技术
请参考图1，图1为一玻璃覆晶结构100的示意图。如图1所示，玻璃覆晶结构100包含有一驱动集成电路110、一异向性导电膜(AnisotropicConductive Film，ACF)120以及一玻璃基板130，其中驱动集成电路110包含有多个电性连接垫结构112，异向性导电膜120是由粘合剂122及导电粒子124所组成，且玻璃基板130上具有与多个电性连接垫结构112相对应的多个电极132。
在玻璃覆晶结构压接的过程中，首先，将异向性导电膜120贴覆于玻璃基板130上，接着，将驱动集成电路110上的电性连接垫结构112与玻璃基板130上的电极132对齐，之后在一定的温度、速度与压力条件下，将驱动集成电路110与玻璃基板130压合，以使得驱动集成电路110上的电性连接垫结构112可以通过异向性导电膜120中的导电粒子124与玻璃基板130上的电极132电连接，并通过粘合剂122将集成电路110与玻璃基板130黏合。压合后的玻璃覆晶结构可参见图2，因为玻璃覆晶结构的制作过程为本发明领域中具有通常知识者所现有，故相关细节在此不再赘述。
此外，因为目前液晶显示器的分辨率越来越高，因此，驱动集成电路110的接脚数目也越来越多，亦即电性连接垫结构112的数量会增加，且电性连接垫结构112之间的间距也会越来越小。为了因应电性连接垫结构112之间的间距缩小的问题，异向性导电膜120会采用尺寸比较小的导电粒子124(大小约为3～4um)以避免电性连接垫结构112之间的短路。
接着，请参考图3，图3为图1、图2所示的电性连接垫结构112的剖视图。如图3所示，连接垫结构112包含有一连接垫302、制作于连接垫302上的绝缘层304、以及制作于连接垫302及绝缘层304上的金凸块306。然而，因为金凸块306形成于连接垫302及绝缘层304上，因此在金凸块306的表面将会形成一下凹区域，如此一来，若是导电粒子124的尺寸太小，则会使得将集成电路110的电性连接垫结构112与玻璃基板130的电极132在压合时无法确实压破足够的导电粒子，而影响到其电连接效果。
发明内容
因此，本发明的目的之一在于提供一种电性连接垫结构，其中的金凸块具有较为平坦的表面，以使得与玻璃基板上的电极压合后具有良好的电连接效果。
依据本发明一实施例，一种设置于一集成电路上的电性连接垫结构包含有一连接垫、一绝缘层以及一金凸块，其中该连接垫设置于该集成电路上；该绝缘层设置于该连接垫上方，其中该绝缘层仅具有一开口部，且该开口部的形状包含有至少一条状弯折处；该金凸块设置于该绝缘层上方，其中该金凸块可以通过该绝缘层的该开口部与该连接垫电连接。
依据本发明另一实施例，一种集成电路，包含有多个电性连接垫结构，其中该多个电性连接垫结构中每一个电性连接垫结构包含有一连接垫、一绝缘层以及一金凸块，其中该连接垫设置于该集成电路上；该绝缘层设置于该连接垫上方，其中该绝缘层仅具有一开口部，且该开口部的形状包含有至少一条状弯折处；该金凸块设置于该绝缘层上方，其中该金凸块可以通过该绝缘层的该开口部与该连接垫电连接。。
附图说明
图1为一玻璃覆晶结构的示意图；
图2为压合后的玻璃覆晶结构的示意图；
图3为图1、图2所示的电性连接垫结构的剖视图；
图4为本发明一实施例的一玻璃覆晶结构的示意图；
图5为本发明一实施例的电性连接垫结构的示意图；
图6为绝缘层的开口部的形状为一“口”字型的示意图；
图7为绝缘层的开口部的形状为一“弓”字型的示意图；
图8为绝缘层的开口部的形状为一鱼骨型的示意图。
主要元件符号说明
100、400                                    玻璃覆晶结构
110、410                                    驱动集成电路
112、412                                    电性连接垫结构
120、420                                    异向性导电膜
122、422                                    粘合剂
124、424                                    导电粒子
130、430                                    玻璃基板
132、432                                    电极
302、502                                    连接垫
304、504                                    色缘层
306、506                                    金凸块
602、702、802                               开口部
具体实施方式
请参考图4，图4为依据本发明一实施例的一玻璃覆晶结构400的示意图。参考图4，玻璃覆晶结构400包含有一驱动集成电路410、一异向性导电膜420以及一玻璃基板430，其中驱动集成电路410包含有多个电性连接垫结构412，异向性导电膜420是由粘合剂422及导电粒子424所组成，且玻璃基板430上具有与多个电性连接垫结构412相对应的多个电极432，其中驱动集成电路410上的电性连接垫结构412可以通过异向性导电膜420中的导电粒子424与玻璃基板430上的电极432电连接，且驱动集成电路410通过粘合剂422与玻璃基板430黏合。
接着，请参考图5，图5为依据本发明一实施例的电性连接垫结构412的示意图。如图5所示，电性连接垫结构412包含有一连接垫502、制作于连接垫502上的绝缘层504、以及制作于连接垫502及绝缘层504上的金凸块506，其中绝缘层504仅具有一开口部，且该开口部的形状包含有至少一条状弯折处。举例来说，请参考图6、图7、图8，绝缘层504的开口部602、702、802的形状可分别为一“口”字型、一“弓”字型以及一鱼骨型，而金凸块506直接制作于绝缘层504及开口部602、702、802的上方，以使得金凸块506可以通过绝缘层504的开口部602、702、802与连接垫502电连接。
此外，虽然图6、图7、图8仅描绘出开口部为“口”字型、“弓”字型及鱼骨型，然而，本发明并不以此为限，在本发明的其他实施例中，绝缘层504的开口部的形状可以为“口”字型、“弓”字型及鱼骨型的任意组合(例如开口部同时包含“口”字型及鱼骨型)或是其简单变化(例如ㄇ字型或是反“弓”字型)，换句话说，只要开口部的形状包含有至少一条状弯折处，这些设计上的变化均应隶属于本发明的范畴。此外，本发明所指的条状弯折并非一定如图6、图7、图8所示的直角弯折，也可以为非直角弯折或是弧形弯折。
此外，金凸块506的材料可以同时包含有铜、镍、金三层金属层，也可以仅包含铜、镍、金三种金属中一或两种金属层，或是锡铅合金，并以电镀的方式形成于绝缘层之上。
本发明的绝缘层504的开口部形状包含有至少一条状弯折处，因此，以图6、图7、图8所示的实施例来说明，开口部条状弯折的形状可以使得金凸块506的凹陷幅度大幅减少，以同样面积的金凸块来说，若是采用图3所示的现有电性连接垫结构的金凸块下陷幅度为2um，则采用本发明的电性连接垫结构的金凸块下陷幅度会小于1um，如此一来，金凸块的表面将会较为平整，在进行玻璃覆晶结构压合时也可以有效地压破足够的导电粒子424，而使得电性连接垫结构412与电极432具有良好的电连接效果。
因为本发明的电性连接垫结构412的金凸块下陷幅度很小，故异向性导电膜420可以在维持良好导电性的情形下使用尺寸更小的导电粒子424，故电性连接垫结构412之间的间距便可以进一步的缩小以增加驱动集成电路410的金凸块密度。
此外，以上所揭露的内容均以玻璃覆晶来作说明，然而，本发明的驱动集成电路410也可应用于薄膜覆晶(COF)封装，亦即将图4所示的玻璃基板430置换为一具有多个电极的薄膜，并通过上述压合方式或金属熔合共金的方式将驱动集成电路410与薄膜压合。
简要归纳本发明，本发明的电性连接垫结构中的绝缘层仅具有一开口部，且该开口部的形状包含有至少一条状弯折处，如此一来，制作于绝缘层与开口部之上的金凸块会具有平整的表面，而使得连接垫结构与玻璃基板的电极具有良好的电连接效果。
以上所述仅为本发明的较佳实施例，凡依本发明权利要求所做的均等变化与修饰，皆应属本发明的涵盖范围。

Claims (8)

1.一种电性连接垫结构，设置于一集成电路上，包含有：
连接垫，设置于该集成电路上；
绝缘层，设置于该连接垫上方，其中该绝缘层仅具有一开口部，且该开口部的形状包含有至少一条状弯折处；以及
金凸块，设置于该绝缘层上方，其中该金凸块可以通过该绝缘层的该开口部与该连接垫电连接。
2.如权利要求1所述的电性连接垫结构，其中该开口部包含有一口字型开口。
3.如权利要求1所述的电性连接垫结构，其中该开口部包含有一弓字型开口。
4.如权利要求1所述的电性连接垫结构，其中该开口部包含有一鱼骨型开口。
5.一种集成电路，包含有多个电性连接垫结构，其中该多个电性连接垫结构中每一个电性连接垫结构包含有：
连接垫，设置于该集成电路上；
绝缘层，设置于该连接垫上方，其中该绝缘层仅具有一开口部，且该开口部的形状包含有至少一条状弯折处；以及
金凸块，设置于该绝缘层上方，其中该金凸块可以通过该绝缘层的该开口部与该连接垫电连接。
6.如权利要求5所述的集成电路，其中该开口部包含有一“口”字型开口。
7.如权利要求5所述的集成电路，其中该开口部包含有一“弓”字型开口。
8.如权利要求5所述的集成电路，其中该开口部包含有一鱼骨型开口。
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