WO2021012452A1 - 异方性导电胶膜、显示面板及显示面板的制作方法 - Google Patents

异方性导电胶膜、显示面板及显示面板的制作方法 Download PDF

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WO2021012452A1
WO2021012452A1 PCT/CN2019/115335 CN2019115335W WO2021012452A1 WO 2021012452 A1 WO2021012452 A1 WO 2021012452A1 CN 2019115335 W CN2019115335 W CN 2019115335W WO 2021012452 A1 WO2021012452 A1 WO 2021012452A1
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Prior art keywords
substrate
anisotropic conductive
display panel
conductive adhesive
adhesive film
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PCT/CN2019/115335
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English (en)
French (fr)
Inventor
吴豪旭
李金城
梅园
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深圳市华星光电半导体显示技术有限公司
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Priority to US16/618,980 priority Critical patent/US11332584B2/en
Publication of WO2021012452A1 publication Critical patent/WO2021012452A1/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G83/00—Macromolecular compounds not provided for in groups C08G2/00 - C08G81/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
    • H01B1/122—Ionic conductors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
    • H01B1/124—Intrinsically conductive polymers
    • H01B1/128—Intrinsically conductive polymers comprising six-membered aromatic rings in the main chain, e.g. polyanilines, polyphenylenes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/0102—Constructional details, not otherwise provided for in this subclass
    • G02F1/0107—Gaskets, spacers or sealing of cells; Filling and closing of cells

Definitions

  • the present invention relates to the field of display, in particular to an anisotropic conductive adhesive film, a display panel and a manufacturing method of the display panel.
  • connection part of the display panel and the driving chip needs to be bound by anisotropic conductive film to realize signal input.
  • the traditional anisotropic conductive film is made by mixing the glue with gold balls, using the method of coating, and then thermally curing to form a film.
  • the manufacturing process of the golden ball is high and the material cost is expensive.
  • the purpose of the present invention is to provide an anisotropic conductive adhesive film for binding, a display panel, and a manufacturing method of the display panel.
  • the conductive particles of a covalent organic frame material replace the existing gold balls as an anisotropic conductive adhesive.
  • the film is bound, which saves the production cost of the golden ball, improves the conductivity and water resistance, and avoids the oxidation of the bonding contact point.
  • one of the embodiments of the present invention provides an anisotropic conductive adhesive film, which includes conductive particles, the conductive particles include a covalent organic framework material, and the covalent organic framework material includes PyVg-COF.
  • covalent organic framework material is PyVg-COF, and its structural formula is as follows:
  • anisotropic conductive adhesive film further includes solvents, adhesives and additives.
  • the solvent includes polymethylmethacrylate (PMMA), dimethylacetamide (DMAC), pyrrolidone (NMP), N,N-diethylformamide (DEF) or dimethyl sulfoxide (DMSO) one or more of.
  • PMMA polymethylmethacrylate
  • DMAC dimethylacetamide
  • NMP pyrrolidone
  • DEF N,N-diethylformamide
  • DMSO dimethyl sulfoxide
  • the adhesive includes one or more of vinyl acetate resin, acrylic resin, and epoxy resin.
  • One embodiment of the present invention provides a display panel including a first substrate, a second substrate and the anisotropic conductive adhesive film.
  • the surface of the first substrate is provided with a plurality of raised electrodes located in the binding area at intervals; the second substrate is arranged opposite to the first substrate, and the surface of the second substrate is spaced apart
  • a plurality of pins located in the binding area are provided, and the plurality of pins correspond to the plurality of bump electrodes one to one; wherein, the first substrate and the second substrate pass through the anisotropic conductive adhesive film
  • Adhesive bonding conductive particles are filled between each of the bump electrodes and the corresponding pins, the conductive particles include a covalent organic frame material, and the covalent organic frame material includes PyVg-COF.
  • the first substrate is a panel substrate
  • the second substrate is a chip package substrate or a flexible printed circuit substrate.
  • the first substrate and the second substrate are bound.
  • the bump electrode is made on the first substrate by coating or pasting.
  • binding the first substrate and the second substrate specifically includes: maintaining the first substrate and the second substrate in a state of being aligned and pressed against each other with a hot plate, and dissolving the anisotropy
  • the conductive adhesive film volatilizes the solvent, and after cooling and solidification, the conductive particles are contacted with the protruding electrode and the pins respectively.
  • the beneficial effect of the present invention is that the present invention relates to an anisotropic conductive adhesive film for binding, a display panel, and a manufacturing method of the display panel.
  • the conductive particles with a covalent organic frame material replace the existing gold balls as The anisotropic conductive adhesive film is bound to save the production cost of the golden ball, while improving the conductivity and water resistance, and avoiding the oxidation of the bonding contact point.
  • FIG. 1 is a schematic diagram of the structure of the display panel in this embodiment
  • FIG. 2 is a flow chart of the manufacturing method of the display panel in this embodiment.
  • the first substrate 2.
  • the second substrate 3.
  • Anisotropic conductive adhesive film 10.
  • the display panel 12.
  • Covalent Organic Frameworks are a class of crystalline organic porous polymers with a regular structure, which have dynamic covalent bonds to polymerize and build, and have the characteristics of low density, high specific surface area, and precise and adjustable pore size.
  • the covalent organic framework material is PyVg-COF, and its structural formula is as follows:
  • the PyVg-COF framework is highly charged, and therefore can be used as a conductive material.
  • This embodiment also takes advantage of this feature, and replaces the existing gold balls as an anisotropic conductive adhesive film for binding by conductive particles of covalent organic frame materials, which saves the production cost of the gold balls and improves the conductivity and resistance. Water-based, to avoid oxidation of binding contact points.
  • the PyVg-COF passes through 1,3,6,8-tetra-(p-aminophenyl)-pyrene (Py) and 1,1-bis(4-formylphenyl)-4, 4 'with pyridinium dichloride (Vg 2+ ⁇ 2Cl -) obtained making the reaction, the reaction temperature is 120 deg.] C; wherein the Py structural formula:
  • two building monomers with opposite properties Py and Vg 2+ ⁇ 2Cl -are used to control the crystallinity of the PyVg-COF.
  • the monomer Py exhibits a strong ⁇ - ⁇ interaction and is easy to form a crystalline stacked structure; the monomer Vg 2+ ⁇ 2Cl - generates a strong electric repulsion due to the high charge density, which inhibits the formation of the alternate stacked structure.
  • the PyVg-COF material exhibits obvious crystallinity and is very soluble in various organic solvents; after it is dissolved, it will form a true solution and overcome the interaction between layers by itself to cause dissociation between layers. In the form of large-area single-layer or multilayer nanosheets. Thanks to the good solubility of the PyVg-COF in organic solvents, the PyVg-COF solution can be dropped onto the base material (both conductors and insulators) to form a thin film.
  • the PyVg-COF is a network polymer obtained by polycondensation reaction of Py and Vg 2+ ⁇ 2Cl - under solvothermal conditions (temperature 120° C.).
  • the Py and Vg 2+ ⁇ 2Cl - a chemical reactor is substantially:
  • the anisotropic conductive adhesive film further includes solvents, adhesives and additives.
  • the components and content of the anisotropic conductive adhesive film are: the conductive particles, 20%-40%; the solvent, 50%-70%; the adhesive, 3%-5 %; and the additive, 2%-5%; wherein all percentages are percentages by weight.
  • the solvent includes polymethylmethacrylate (PMMA), dimethylacetamide (DMAC), pyrrolidone (NMP), N,N-diethylformamide (DEF) or dimethylmethylene
  • PMMA polymethylmethacrylate
  • DMAC dimethylacetamide
  • NMP pyrrolidone
  • DEF N,N-diethylformamide
  • DMSO dimethylmethylene
  • PMMA polymethylmethacrylate
  • DMAC dimethylacetamide
  • NMP pyrrolidone
  • DEF N,N-diethylformamide
  • DMSO dimethylmethylene
  • DMSO dimethylmethylene
  • the adhesive includes one or more of vinyl acetate resin, acrylic resin, and epoxy resin.
  • the additives are azole substances, including benzotriazole, 1H-imidazole, 1H-tetrazole, 5-phenyl-1H-tetrazole, 5-amino-1H-tetrazole, 3- One or more of amino-1H-triazole and 5-carboxybenzotriazole.
  • one embodiment of the present invention provides a display panel 10 including a first substrate 1, a second substrate 2 and the anisotropic conductive adhesive film 3.
  • the surface of the first substrate 1 is provided with a plurality of bump electrodes 11 located in the binding area at intervals; the second substrate 2 is arranged opposite to the first substrate 1, and the second substrate
  • the surface of 2 is provided with a plurality of pins 21 located in the binding area at intervals, and the plurality of pins 21 correspond to the plurality of bump electrodes 11 one-to-one; wherein, the first substrate 1 and the second substrate 2
  • the anisotropic conductive adhesive film 3 is bonded and bound, and conductive particles 31 are filled between each bump electrode 11 and the corresponding stitch 21, and the conductive particles 31 include a covalent organic frame Material, the covalent organic framework material includes PyVg-COF.
  • the first substrate 1 is a panel substrate
  • the second substrate 2 is a chip package substrate or a flexible printed circuit substrate.
  • one embodiment of the present invention provides a method for manufacturing the above-mentioned display panel 10, which includes the following steps:
  • a first substrate 1 is provided, and a plurality of raised electrodes 11 located in the binding area are spaced on the surface of the first substrate;
  • the bump electrode 11 is fabricated on the first substrate 1 by coating or pasting.
  • the step S4 of binding the first substrate 1 and the second substrate 2 specifically includes: respectively holding the first substrate 1 and the second substrate 2 by a hot plate.
  • the anisotropic conductive adhesive film 3 is dissolved and the solvent in it is volatilized. After it is cooled and solidified, the conductive particles 31 are brought into contact with the bump electrodes 11 and the pins 21 respectively.
  • the anisotropic conductive adhesive film 3 is bonded to the first substrate 1 and the second substrate 2, and the anisotropic conductive adhesive film 3 fills the first substrate 1 and the second substrate 1.
  • the gaps between the substrates 2 are kept insulated to form the binding structure of the display panel 10.
  • the present invention relates to an anisotropic conductive adhesive film 3 for binding, a display panel, and a manufacturing method of the display panel.
  • the conductive particles 31 with a covalent organic frame material replace the existing gold.
  • the ball is bound as an anisotropic conductive adhesive film 3, which saves the production cost of the golden ball, improves the conductivity and water resistance, and prevents the bonding contact point from being oxidized.
  • the anisotropic conductive adhesive film provided by the present invention has been described in detail above. It should be understood that the exemplary embodiments described herein should only be regarded as descriptive, used to help understand the method and core idea of the present invention, but not to limit the present invention.

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Abstract

本发明涉及一种异方性导电胶膜、显示面板及显示面板的制作方法。异方性导电胶膜包括导电粒子，所述导电粒子包括共价有机框架材料，所述共价有机框架材料包括PyVg-COF。显示面板包括第一基板、第二基板和所述异方性导电胶膜。显示面板的制作方法包括步骤：提供一第一基板、涂覆所述异方性导电胶膜、将所述第二基板与所述第一基板对合、将所述第一基板与所述第二基板进行绑定。本发明通过具有共价有机框架材料的导电粒子代替现有的金球作为异方性导电胶膜进行绑定，节省了金球的制作成本，同时提高了导电性能和阻水性，避免了绑定接触点被氧化。

Description

异方性导电胶膜、显示面板及显示面板的制作方法 技术领域
本发明涉及显示领域，特别涉及一种异方性导电胶膜、显示面板及显示面板的制作方法。
背景技术
在显示技术领域，显示面板与驱动芯片连接部位需要通过各向异性导电膜绑定实现信号输入。传统的各向异性导电膜是通过金球混合胶材，利用涂布的方式制作，再进行热固化，从而成膜。但金球的制造工艺要求高，材料费用昂贵。
因此，亟待提出一种新的异方性导电胶膜、显示面板及显示面板的制作方法来解决上述问题。
技术问题
本发明的目的是提供一种用于绑定的异方性导电胶膜、显示面板及显示面板的制作方法，通过共价有机框架材料的导电粒子代替现有的金球作为异方性导电胶膜进行绑定，节省了金球的制作成本，同时提高了导电性能和阻水性，避免了绑定接触点被氧化。
技术解决方案
为了解决上述问题，本发明的其中一个实施方式提供了一种异方性导电胶膜，包括导电粒子，所述导电粒子包括共价有机框架材料，所述共价有机框架材料包括PyVg-COF。
进一步地，所述共价有机框架材料为PyVg-COF，其结构式如下：
Figure PCTCN2019115335-appb-000001
进一步地，所述异方性导电胶膜还包括溶剂、粘合剂以及添加剂。
进一步地，所述溶剂包括聚甲基丙烯酸甲酯(PMMA)、二甲基乙酰胺(DMAC)、吡咯烷酮(NMP)、N,N-二乙基甲酰胺(DEF)或二甲基亚砜(DMSO)中的一种或多种。
进一步地，所述粘合剂包括醋酸乙烯树脂、丙烯酸树脂、环氧树脂中的一种或多种。
本发明的其中一个实施方式提供了一种显示面板，包括第一基板、第二基板和所述异方性导电胶膜。具体地讲，所述第一基板的表面上间隔设有多个位于绑定区的凸起电极；所述第二基板与所述第一基板相对设置，且所述第二基板的表面上间隔设有多个位于绑定区的针脚，所述多个针脚与所述多个凸起电极一一对应；其中，所述第一基板与所述第二基板通过所述异方性导电胶膜粘结绑定，每个所述凸起电极和与其对应的所述针脚之间填充有导电粒子，所述导电粒子包括共价有机框架材料，所述共价有机框架材料包括PyVg-COF。
进一步地，所述第一基板为面板基板，所述第二基板为芯片包膜基板或柔性印刷电路基板。本发明的其中一个实施方式提供了一种以上所述显示面板的制作方法，包括以下步骤：
提供一第一基板，其表面上间隔设有多个位于绑定区的凸起电极；
在所述第一基板上涂覆所述异方性导电胶膜，并使所述异方性导电胶膜覆盖所述凸起电极；
将所述第二基板与所述第一基板对合，使多个所述凸起电极与多个所述针脚一一对应设置；
将所述第一基板与所述第二基板进行绑定。
进一步地，所述凸起电极采用涂布或粘贴的方式制作在所述第一基板上。
进一步地，将所述第一基板与所述第二基板绑定具体包括：分别用热板保持所述第一基板与所述第二基板对合且对压的状态，溶解所述异方性导电胶膜并将其中的溶剂挥发出去，待其冷却固化后使所述导电粒子分别与所述凸起电极和所述针脚接触。
有益效果
本发明的有益效果在于，本发明涉及一种用于绑定的异方性导电胶膜、显示面板及显示面板的制作方法，通过具有共价有机框架材料的导电粒子代替现有的金球作为异方性导电胶膜进行绑定，节省了金球的制作成本，同时提高了导电性能和阻水性，避免了绑定接触点被氧化。
附图说明
图1是本实施例中显示面板的结构示意图；
图2是本实施例中显示面板的制作方法的流程图。
其中：
1、第一基板，2、第二基板，3、异方性导电胶膜，10、显示面板，
11、凸起电极，21、针脚，31、导电粒子。
本发明的实施方式
以下结合说明书附图详细说明本发明的优选实施例，以向本领域中的技术人员完整介绍本发明的技术内容，以举例证明本发明可以实施，使得本发明公开的技术内容更加清楚，使得本领域的技术人员更容易理解如何实施本发明。然而本发明可以通过许多不同形式的实施例来得以体现，本发明的保护范围并非仅限于文中提到的实施例，下文实施例的说明并非用来限制本发明的范围。
本发明的其中一个实施方式提供了一种异方性导电胶膜，包括导电粒子，所述导电粒子包括共价有机框架材料，所述共价有机框架材料包括PyVg-COF。共价有机框架(Covalent Organic Frameworks,COFs)是一类结构规整的结晶性有机多孔聚合物，具有动态共价键来聚合构筑，具有低密度、高比表面、孔尺寸精确可调等特点。
本实施例中，所述共价有机框架材料为PyVg-COF，其结构式如下：
Figure PCTCN2019115335-appb-000002
所述PyVg-COF骨架具有高度带电性，因此可以用作导电材料。本实施例也是利用这一特点，通过共价有机框架材料的导电粒子代替现有的金球作为异方性导电胶膜进行绑定，节省了金球的制作成本，同时提高了导电性能和阻水性，避免了绑定接触点被氧化。
本实施例中，所述PyVg-COF通过1,3,6,8-四-(对胺基苯基)-芘(Py)和1,1-二(4-甲酰基苯基)-4,4'二氯化联吡啶鎓(Vg 2+·2Cl -)反应制作获得，反应温度为120℃；其中，所述Py的结构式为：
Figure PCTCN2019115335-appb-000003
所述Vg 2+·2Cl -的结构式为：
Figure PCTCN2019115335-appb-000004
本实施例采用了性质相反的两种构筑单体Py和Vg 2+·2Cl -来调控所述PyVg-COF的结晶性。单体Py表现出强烈的π-π相互作用，易于形成结晶性的堆叠结构；单体Vg 2+·2Cl -则因电荷密度高而产生了强烈的电斥力，抑制了交替堆叠结构的形成。所述PyVg-COF材料表现出明显的结晶性，非常易溶于各种有机溶剂；其在溶解后会形成真溶液，并自行克服层间的相互作用而使层与层之间发生解离，以大面积的单层或多层纳米片的形式存在。得益于所述PyVg-COF在有机溶剂中的良好溶解性，可以将所述PyVg-COF溶液滴加到基底材质上(导体和绝缘体均可)形成薄膜。
所述PyVg-COF是Py和Vg 2+·2Cl -在溶剂热的条件(温度为120℃)下通过缩聚反应得到的网状聚合物。所述Py和Vg 2+·2Cl -反应的化学式大体为：
Figure PCTCN2019115335-appb-000005
本实施例中，所述异方性导电胶膜还包括溶剂、粘合剂以及添加剂。
更具体的，所述异方性导电胶膜的组分及含量为：所述导电粒子，20％-40％；所述溶剂，50％-70％；所述粘合剂，3％-5％；以及所述添加剂，2％-5％；其中所有百分数为重量百分数。
本实施例中，所述溶剂包括聚甲基丙烯酸甲酯(PMMA)、二甲基乙酰胺(DMAC)、吡咯烷酮(NMP)、N,N-二乙基甲酰胺(DEF)或二甲基亚砜(DMSO)中的一种或多种。
本实施例中，所述粘合剂包括醋酸乙烯树脂、丙烯酸树脂、环氧树脂中的一种或多种。
本实施例中，所述添加剂为唑类物质，包括苯并三氮唑、1H-咪唑、1H-四唑、5-苯基-1H-四唑、5-氨基-1H-四唑、3-氨基-1H-三唑、以及5-羧基苯并三氮唑中的一种或多种。
如图1所示，本发明的其中一个实施方式提供了一种显示面板10，包括第一基板1、第二基板2和所述异方性导电胶膜3。具体地讲，所述第一基板1的表面上间隔设有多个位于绑定区 的凸起电极11；所述第二基板2与所述第一基板1相对设置，且所述第二基板2的表面上间隔设有多个位于绑定区的针脚21，所述多个针脚21与所述多个凸起电极11一一对应；其中，所述第一基板1与所述第二基板2通过所述异方性导电胶膜3粘结绑定，每个所述凸起电极11和与其对应的所述针脚21之间填充有导电粒子31，所述导电粒子31包括共价有机框架材料，所述共价有机框架材料包括PyVg-COF。
本实施例中，所述第一基板1为面板基板，所述第二基板2为芯片包膜基板或柔性印刷电路基板。
如图2所示，本发明的其中一个实施方式提供了一种以上所述显示面板10的制作方法，包括以下步骤：
S1、提供一第一基板1，其表面上间隔设有多个位于绑定区的凸起电极11；
S2、在所述第一基板1上涂覆所述异方性导电胶膜3，并使所述异方性导电胶膜3覆盖所述凸起电极11；更具体的，在电场下利用溶液法制作所述PyVg-COF薄膜以形成所述异方性导电胶膜3；
S3、将所述第二基板2与所述第一基板1对合，使多个所述凸起电极11与多个所述针脚21一一对应设置；
S4、将所述第一基板1与所述第二基板2进行绑定。
本实施例中，所述凸起电极11采用涂布或粘贴的方式制作在所述第一基板1上。
本实施例中，所述将所述第一基板1与所述第二基板2进行绑定的步骤S4具体包括：分别用热板保持所述第一基板1与所述第二基板2对合且对压的状态，溶解所述异方性导电胶膜3并将其中的溶剂挥发出去，待其冷却固化后使所述导电粒子31分别与所述凸起电极11和所述针脚21接触。且使所述异方性导电胶膜3与所述第一基板1和所述第二基板2粘结，所述异方性导电胶膜3填充满所述第一基板1与所述第二基板2之间的空隙处保持绝缘，以形成所述显示面板10的绑定结构。
本发明的有益效果是：本发明涉及一种用于绑定的异方性导电胶膜3、显示面板及显示面板的制作方法，通过具有共价有机框架材料的导电粒子31代替现有的金球作为异方性导电胶膜3进行绑定，节省了金球的制作成本，同时提高了导电性能和阻水性，避免了绑定接触点被氧化。以上对本发明所提供的异方性导电胶膜进行了详细介绍。应理解，本文所述的示例性实施方式应仅被认为是描述性的，用于帮助理解本发明的方法及其核心思想，而并不用于限制本发明。在每个示例性实施方式中对特征或方面的描述通常应被视作适用于其他示例性实施例中的类似特征或方面。尽管参考示例性实施例描述了本发明，但可建议所属领域的技术人员进行各种变化和更改。本发明意图涵盖所附权利要求书的范围内的这些变化和更改，凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本发明的保护范围之内。

Claims (10)

  1. 一种异方性导电胶膜，其包括：
    导电粒子，所述导电粒子包括共价有机框架材料，所述共价有机框架材料包括PyVg-COF。
  2. 根据权利要求1所述的异方性导电胶膜，其中，所述共价有机框架材料为PyVg-COF，其结构式如下：
    Figure PCTCN2019115335-appb-100001
  3. 根据权利要求1所述的异方性导电胶膜，其中，还包括溶剂、粘合剂以及添加剂。
  4. 根据权利要求3所述的异方性导电胶膜，其中，所述溶剂包括：
    聚甲基丙烯酸甲酯、二甲基乙酰胺、吡咯烷酮、
    N,N-二乙基甲酰胺或二甲基亚砜中的一种或多种。
  5. 根据权利要求3所述的异方性导电胶膜，其中，所述粘合剂包括：醋酸乙烯树脂、丙烯酸树脂、环氧树脂中的一种或多种。
  6. 一种显示面板，其包括
    第一基板，其表面上间隔设有多个位于绑定区的凸起电极；
    第二基板，其与所述第一基板相对设置，且其表面上间隔设有多个位于绑定区的针脚，所述多个针脚与所述多个凸起电极一一对应；
    其中，所述第一基板与所述第二基板通过权利要求1所述的异方性导电胶膜粘结绑定，每个所述凸起电极和与其对应的所述针脚之间填充有导电粒子，所述导电粒子包括共价有机框架材料，所述共价有机框架材料包括PyVg-COF。
  7. 根据权利要求6所述的显示面板，其中，所述第一基板为面板基板，所述第二基板为芯片包膜基板或柔性印刷电路基板。
  8. 一种显示面板的制作方法，其包括以下步骤：
    提供一第一基板，其表面上间隔设有多个位于绑定区的凸起电极；在所述第一基板上涂覆所述异方性导电胶膜，并使所述异方性导电胶膜覆盖所述凸起电极；
    将所述第二基板与所述第一基板对合，使多个所述凸起电极与多个所述针脚一一对应设置；
    将所述第一基板与所述第二基板进行绑定。
  9. 一种如权利要求8所述的显示面板的制作方法，其中，所述凸起电极采用涂布或粘贴的方式制作在所述第一基板上。
  10. 一种如权利要求8所述的显示面板的制作方法，其中，将所述第一基板与所述第二基板进行绑定具体包括：
    分别用热板保持所述第一基板与所述第二基板对合且对压的状态，溶解所述异方性导电胶膜并将其中的溶剂挥发出去，待其冷却固化后使所述导电粒子分别与所述凸起电极和所述针脚接触。
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