WO2008129590A1 - 半導体用接着フィルム及びこれを用いた半導体装置 - Google Patents
半導体用接着フィルム及びこれを用いた半導体装置 Download PDFInfo
- Publication number
- WO2008129590A1 WO2008129590A1 PCT/JP2007/000379 JP2007000379W WO2008129590A1 WO 2008129590 A1 WO2008129590 A1 WO 2008129590A1 JP 2007000379 W JP2007000379 W JP 2007000379W WO 2008129590 A1 WO2008129590 A1 WO 2008129590A1
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- WO
- WIPO (PCT)
- Prior art keywords
- adhesive film
- semiconductor
- semiconductor device
- same
- device made
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/062—Copolymers with monomers not covered by C09J133/06
- C09J133/066—Copolymers with monomers not covered by C09J133/06 containing -OH groups
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- C09J7/00—Adhesives in the form of films or foils
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- C—CHEMISTRY; METALLURGY
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
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- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Chemical & Material Sciences (AREA)
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- Computer Hardware Design (AREA)
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- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Die Bonding (AREA)
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Abstract
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2007800525332A CN101641773B (zh) | 2007-04-10 | 2007-04-10 | 用于半导体的粘合膜和使用该粘合膜的半导体器件 |
KR1020097022227A KR101125762B1 (ko) | 2007-04-10 | 2007-04-10 | 반도체용 접착필름 및 이를 이용한 반도체 장치 |
PCT/JP2007/000379 WO2008129590A1 (ja) | 2007-04-10 | 2007-04-10 | 半導体用接着フィルム及びこれを用いた半導体装置 |
US11/886,463 US20090230568A1 (en) | 2007-04-10 | 2007-04-10 | Adhesive Film for Semiconductor and Semiconductor Device Therewith |
EP07737036A EP2136393A4 (en) | 2007-04-10 | 2007-04-10 | HAFTFILM FOR SEMICONDUCTORS AND SEMI-FINISHED SEMICONDUCTOR ARRANGEMENT |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2007/000379 WO2008129590A1 (ja) | 2007-04-10 | 2007-04-10 | 半導体用接着フィルム及びこれを用いた半導体装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008129590A1 true WO2008129590A1 (ja) | 2008-10-30 |
Family
ID=39875139
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2007/000379 WO2008129590A1 (ja) | 2007-04-10 | 2007-04-10 | 半導体用接着フィルム及びこれを用いた半導体装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20090230568A1 (ja) |
EP (1) | EP2136393A4 (ja) |
KR (1) | KR101125762B1 (ja) |
CN (1) | CN101641773B (ja) |
WO (1) | WO2008129590A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
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JP6193663B2 (ja) * | 2013-07-26 | 2017-09-06 | 日東電工株式会社 | ダイシングテープ付きダイボンドフィルム、及び、半導体装置の製造方法 |
WO2015152037A1 (ja) * | 2014-03-31 | 2015-10-08 | 明和化成株式会社 | フェノール樹脂、該フェノール樹脂を含むエポキシ樹脂組成物、該エポキシ樹脂組成物の硬化物、及び該硬化物を有する半導体装置 |
KR101799499B1 (ko) * | 2014-12-24 | 2017-12-20 | 주식회사 엘지화학 | 반도체 접착용 수지 조성물, 접착 필름, 다이싱 다이본딩 필름 및 반도체 장치 |
CN106715631B (zh) * | 2015-07-10 | 2019-07-30 | 株式会社Lg化学 | 半导体用粘合剂组合物和切割管芯粘结膜 |
KR101770505B1 (ko) * | 2016-03-03 | 2017-08-22 | 주식회사 케이씨씨 | 다이 본딩용 에폭시 수지 조성물 |
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WO2019013040A1 (ja) * | 2017-07-10 | 2019-01-17 | Dic株式会社 | 積層体、それを用いたプリント配線板、フレキシブルプリント配線板及び成形品 |
EP3524462A1 (en) * | 2018-02-13 | 2019-08-14 | D. Swarovski KG | Decorative composite body |
TWI695453B (zh) * | 2019-01-04 | 2020-06-01 | 台灣愛司帝科技股份有限公司 | 半導體晶片修補方法以及半導體晶片修補裝置 |
JP2023521068A (ja) * | 2020-04-24 | 2023-05-23 | エルジー・ケム・リミテッド | 硬化剤、これを含む半導体接着用組成物、半導体接着用フィルムおよびこれを用いた半導体パッケージ |
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KR100815314B1 (ko) * | 2000-03-31 | 2008-03-19 | 히다치 가세고교 가부시끼가이샤 | 접착제 조성물, 그의 제조 방법, 이것을 사용한 접착필름, 반도체 탑재용 기판 및 반도체 장치 |
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US20070073008A1 (en) * | 2005-09-28 | 2007-03-29 | Cookson Singapore Pte, Ltd. | Compositions effective to suppress void formation |
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- 2007-04-10 US US11/886,463 patent/US20090230568A1/en not_active Abandoned
- 2007-04-10 WO PCT/JP2007/000379 patent/WO2008129590A1/ja active Application Filing
- 2007-04-10 EP EP07737036A patent/EP2136393A4/en not_active Withdrawn
- 2007-04-10 KR KR1020097022227A patent/KR101125762B1/ko not_active IP Right Cessation
- 2007-04-10 CN CN2007800525332A patent/CN101641773B/zh not_active Expired - Fee Related
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JPH06264035A (ja) | 1993-03-16 | 1994-09-20 | Hitachi Chem Co Ltd | 接着フィルム、その製造法及び接着法 |
JP2003096426A (ja) | 2001-09-26 | 2003-04-03 | Hitachi Chem Co Ltd | 接着部材 |
JP2007059787A (ja) * | 2005-08-26 | 2007-03-08 | Sumitomo Bakelite Co Ltd | 半導体用接着フィルム及びこれを用いた半導体装置 |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120114934A1 (en) * | 2009-05-13 | 2012-05-10 | Megumi Kodama | Bonding sheet |
JP2011103307A (ja) * | 2011-01-19 | 2011-05-26 | Sony Chemical & Information Device Corp | 異方性導電フィルム |
JP2023505277A (ja) * | 2019-12-05 | 2023-02-08 | ドゥーサン コーポレイション | 半導体パッケージ用アンダーフィルフィルム及びこれを用いた半導体パッケージの製造方法 |
JP7373073B2 (ja) | 2019-12-05 | 2023-11-01 | ドゥーサン コーポレイション | 半導体パッケージ用アンダーフィルフィルム及びこれを用いた半導体パッケージの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US20090230568A1 (en) | 2009-09-17 |
CN101641773A (zh) | 2010-02-03 |
EP2136393A1 (en) | 2009-12-23 |
EP2136393A4 (en) | 2012-10-24 |
KR20100009555A (ko) | 2010-01-27 |
KR101125762B1 (ko) | 2012-03-20 |
CN101641773B (zh) | 2011-08-17 |
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