WO2008129590A1 - 半導体用接着フィルム及びこれを用いた半導体装置 - Google Patents

半導体用接着フィルム及びこれを用いた半導体装置 Download PDF

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Publication number
WO2008129590A1
WO2008129590A1 PCT/JP2007/000379 JP2007000379W WO2008129590A1 WO 2008129590 A1 WO2008129590 A1 WO 2008129590A1 JP 2007000379 W JP2007000379 W JP 2007000379W WO 2008129590 A1 WO2008129590 A1 WO 2008129590A1
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WIPO (PCT)
Prior art keywords
adhesive film
semiconductor
semiconductor device
same
device made
Prior art date
Application number
PCT/JP2007/000379
Other languages
English (en)
French (fr)
Inventor
Hiroyuki Yasuda
Masato Yoshida
Original Assignee
Sumitomo Bakelite Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co., Ltd. filed Critical Sumitomo Bakelite Co., Ltd.
Priority to CN2007800525332A priority Critical patent/CN101641773B/zh
Priority to KR1020097022227A priority patent/KR101125762B1/ko
Priority to PCT/JP2007/000379 priority patent/WO2008129590A1/ja
Priority to US11/886,463 priority patent/US20090230568A1/en
Priority to EP07737036A priority patent/EP2136393A4/en
Publication of WO2008129590A1 publication Critical patent/WO2008129590A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
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    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062—Copolymers with monomers not covered by C09J133/06
    • C09J133/066—Copolymers with monomers not covered by C09J133/06 containing -OH groups
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    • C09J7/00—Adhesives in the form of films or foils
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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • H—ELECTRICITY
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    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
  • Adhesive Tapes (AREA)

Abstract

（Ａ）熱可塑性樹脂、（Ｂ）エポキシ樹脂、及び、（Ｃ）硬化剤を含む半導体用接着フィルムであって、前記半導体用接着フィルムの室温から１０℃／分の昇温速度で昇温したときの５０℃以上１８０℃以下の範囲における最低溶融粘度が０．１Ｐａ・ｓ以上５００Ｐａ・ｓ以下であり、かつ、揮発分が５．０％以下であることを特徴とする半導体用接着フィルムにより、半導体素子と半導体素子搭載用支持部材をより間隙なく、ボイド発生を抑制しつつ接着することができ、信頼性の高い半導体装置を提供可能にする。
PCT/JP2007/000379 2007-04-10 2007-04-10 半導体用接着フィルム及びこれを用いた半導体装置 WO2008129590A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN2007800525332A CN101641773B (zh) 2007-04-10 2007-04-10 用于半导体的粘合膜和使用该粘合膜的半导体器件
KR1020097022227A KR101125762B1 (ko) 2007-04-10 2007-04-10 반도체용 접착필름 및 이를 이용한 반도체 장치
PCT/JP2007/000379 WO2008129590A1 (ja) 2007-04-10 2007-04-10 半導体用接着フィルム及びこれを用いた半導体装置
US11/886,463 US20090230568A1 (en) 2007-04-10 2007-04-10 Adhesive Film for Semiconductor and Semiconductor Device Therewith
EP07737036A EP2136393A4 (en) 2007-04-10 2007-04-10 HAFTFILM FOR SEMICONDUCTORS AND SEMI-FINISHED SEMICONDUCTOR ARRANGEMENT

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/000379 WO2008129590A1 (ja) 2007-04-10 2007-04-10 半導体用接着フィルム及びこれを用いた半導体装置

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WO2008129590A1 true WO2008129590A1 (ja) 2008-10-30

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US (1) US20090230568A1 (ja)
EP (1) EP2136393A4 (ja)
KR (1) KR101125762B1 (ja)
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WO (1) WO2008129590A1 (ja)

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JP2023505277A (ja) * 2019-12-05 2023-02-08 ドゥーサン コーポレイション 半導体パッケージ用アンダーフィルフィルム及びこれを用いた半導体パッケージの製造方法

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JP4816750B2 (ja) * 2009-03-13 2011-11-16 住友電気工業株式会社 プリント配線基板の接続方法
JP2012049388A (ja) * 2010-08-27 2012-03-08 Shin Etsu Chem Co Ltd 半導体ウエハ保護膜形成用シート
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JP2023521068A (ja) * 2020-04-24 2023-05-23 エルジー・ケム・リミテッド 硬化剤、これを含む半導体接着用組成物、半導体接着用フィルムおよびこれを用いた半導体パッケージ

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US20120114934A1 (en) * 2009-05-13 2012-05-10 Megumi Kodama Bonding sheet
JP2011103307A (ja) * 2011-01-19 2011-05-26 Sony Chemical & Information Device Corp 異方性導電フィルム
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Also Published As

Publication number Publication date
US20090230568A1 (en) 2009-09-17
CN101641773A (zh) 2010-02-03
EP2136393A1 (en) 2009-12-23
EP2136393A4 (en) 2012-10-24
KR20100009555A (ko) 2010-01-27
KR101125762B1 (ko) 2012-03-20
CN101641773B (zh) 2011-08-17

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