TWI456595B - 異向性導電膜及其製造方法 - Google Patents

異向性導電膜及其製造方法 Download PDF

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Publication number
TWI456595B
TWI456595B TW099133204A TW99133204A TWI456595B TW I456595 B TWI456595 B TW I456595B TW 099133204 A TW099133204 A TW 099133204A TW 99133204 A TW99133204 A TW 99133204A TW I456595 B TWI456595 B TW I456595B
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Taiwan
Prior art keywords
conductive film
anisotropic conductive
resin layer
manufacturing same
resin
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TW099133204A
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English (en)
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TW201129994A (en
Inventor
Tatsurou Fukaya
Takayuki Matsushima
Jun Yamamoto
Ryota Aizaki
Katsuya Kudo
Kazutaka Furuta
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Dexerials Corp
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Publication of TW201129994A publication Critical patent/TW201129994A/zh
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Publication of TWI456595B publication Critical patent/TWI456595B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • C—CHEMISTRY; METALLURGY
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    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Non-Insulated Conductors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Laminated Bodies (AREA)

Claims (6)

  1. 一種異向性導電膜，其積層有：具有高於200kPa之黏著力之第1樹脂層，及含有導電性粒子之第2樹脂層；且其係用於：以表面構裝機將數個電子零件暫時搭載於該第1樹脂層上，再以熱壓接同時構裝該電子零件與其他電子零件。
  2. 如申請專利範圍第1項之異向性導電膜，其於常溫下之黏度為10~1000kPa．s。
  3. 如申請專利範圍第2項之異向性導電膜，其中，該第1樹脂層及該第2樹脂層含有膜形成樹脂、液狀環氧樹脂及潛在性硬化劑。
  4. 如申請專利範圍第3項之異向性導電膜，其中，該第2樹脂層含有無機填料。
  5. 如申請專利範圍第4項之異向性導電膜，其中，該第1樹脂層含有無機填料。
  6. 一種製造方法，係製造申請專利範圍第1項之異向性導電膜。
TW099133204A 2009-09-30 2010-09-29 異向性導電膜及其製造方法 TWI456595B (zh)

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WO2014034741A1 (ja) 2012-08-29 2014-03-06 デクセリアルズ株式会社 異方性導電フィルム及びその製造方法
JP5956362B2 (ja) * 2013-02-19 2016-07-27 デクセリアルズ株式会社 異方性導電フィルム、接続方法、及び接合体
KR101665160B1 (ko) * 2013-05-31 2016-10-11 제일모직주식회사 이방성 도전 필름, 이의 조성물 및 이를 이용한 디스플레이 장치
JP2015149126A (ja) * 2014-02-04 2015-08-20 デクセリアルズ株式会社 異方性導電フィルム及びその製造方法
KR102541899B1 (ko) * 2014-02-04 2023-06-14 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름 및 그의 제조 방법
JP6428325B2 (ja) * 2014-02-04 2018-11-28 デクセリアルズ株式会社 異方性導電フィルム及びその製造方法
JP6661888B2 (ja) * 2014-03-31 2020-03-11 デクセリアルズ株式会社 異方性導電フィルムの製造方法
TWI755470B (zh) * 2018-01-16 2022-02-21 優顯科技股份有限公司 導電薄膜、光電半導體裝置及其製造方法
DE102019126859A1 (de) * 2019-10-07 2021-04-08 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Anzeigevorrichtung und Anzeigeeinheit

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