JP4996859B2 - 圧着装置 - Google Patents
圧着装置 Download PDFInfo
- Publication number
- JP4996859B2 JP4996859B2 JP2006033745A JP2006033745A JP4996859B2 JP 4996859 B2 JP4996859 B2 JP 4996859B2 JP 2006033745 A JP2006033745 A JP 2006033745A JP 2006033745 A JP2006033745 A JP 2006033745A JP 4996859 B2 JP4996859 B2 JP 4996859B2
- Authority
- JP
- Japan
- Prior art keywords
- pressing
- rubber
- rubbers
- substrate
- electrical components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
- B30B15/02—Dies; Inserts therefor; Mounting thereof; Moulds
- B30B15/022—Moulds for compacting material in powder, granular of pasta form
- B30B15/024—Moulds for compacting material in powder, granular of pasta form using elastic mould parts
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
- B30B15/06—Platens or press rams
- B30B15/065—Press rams
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B5/00—Presses characterised by the use of pressing means other than those mentioned in the preceding groups
- B30B5/02—Presses characterised by the use of pressing means other than those mentioned in the preceding groups wherein the pressing means is in the form of a flexible element, e.g. diaphragm, urged by fluid pressure
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Description
図14(a)の符号101は従来技術の圧着装置を示しており、圧着装置101は台座126と押圧ヘッド120とを有している。
しかし、この方法では電気部品116、118と基板111の種類や、電気部品116、118の接続場所が変る毎に台座126を作り直す必要がある。
請求項2記載の発明は、第一、第三の押圧ゴムを有し、前記第一、第三の押圧ゴムの間に配置された圧着対象物を、前記第一、第三の押圧ゴムで押圧可能に構成され、前記第一の押圧ゴムは、第一の押圧板上に配置された圧着装置であって、前記第一、第三の押圧ゴムの周囲には、前記第一、第三の押圧ゴムの表面高さよりも高いダム部材がそれぞれ配置され、前記第一の押圧ゴムと前記第一の押圧板との間には圧縮変形できる第一の圧縮部材が配置され、少なくとも前記第一の圧縮部材が圧縮したときに、前記ダム部材の高さは前記第一の押圧ゴムの表面高さよりも高くなるように構成された圧着装置である。
第一のヘッド本体11のうち、第一の押圧ゴム15の底面と密着した部分は第一の押圧板12であり、第一の押圧板12は軸3によって駆動装置2に取り付けられ、駆動装置2を動作させ、軸3を伸縮させると、第一の押圧ゴム15の表面を略水平に向けたまま、第一の押圧板12が第一の押圧ゴム15や第一のダム部材16と一緒に鉛直方向に上下移動するように構成されている。
第二の押圧ヘッド20は金属製の押圧板からなる第二のヘッド本体21と、第二のヘッド本体21の表面に配置された第二の押圧ゴム25とを有しており、第二の押圧ヘッド20は第二のヘッド本体21側の面が作業台9と密着し、第二の押圧ゴム25側の面が上側に向けられている。従って、第二の押圧ヘッド20の上側の面には第二の押圧ゴム25の表面が露出している。
図4(a)の符号30は圧着対象物を示しており、圧着対象物30は基板31と、接着フィルム35と、電気部品32、33とを有している。
第一の押圧ヘッド10の下降を続けると、圧着対象物30と第一の押圧ゴム15とが相対的に近づく。
従って、電気部品32、33は基板31に硬化又は固化した接着フィルム35を介して機械的にも接続され、電気装置30aが得られる(図3(c))。
第一の圧縮部材46の変形量は限度があるので、第一の圧縮部材46がある程度変形すると圧縮が止まる。
図7の符号6は本発明第三例の圧着装置を示しており、この圧着装置6は、上述した第一の押圧ヘッド10の他に、第三の押圧ヘッド60を有している。
第一、第三の押圧ゴム15、65は接着フィルム35との接着性が高い物質で構成されており、接着フィルム35との接触を避けるために、上述した保護フィルム5を第三の押圧ゴム65の表面に配置してから、圧着対象物30を第三の押圧ゴム65上に配置し、更に圧着対象物30表面にも保護フィルム5を配置する(図8(a))。
上述した第一、第三の凹部17、67の深さの合計は、設定された圧力で圧着対象物30を押圧する時に、第一、第三の押圧ゴム15、65が変形しても、第一、第三のダム部材16、66の先端同士が直接接触しない深さにされており、従って、第一の押圧ヘッド10は第一、第三の押圧ゴム15、65の変形が続く限り下降し、第一、第三の押圧ゴム15、65の変形の変形が止まった後は、第一の押圧ヘッド10を下降させる力は、圧着対象物30を押圧する力となる(図8(c))。
図10(a)の符号8は第五例の圧着装置を示しており、この圧着装置8は第四、第五の押圧ヘッド80、90と、ダム部材86とを有している。
図11に示すように、ダム部材86は筒状であって、筒の両端の開口の形状は、第四、第五の押圧ゴム85、95の表面の形状と同じか、それよりも大きい相似形にされている。従って、第四、第五の押圧ゴム85、95の少なくとも表面部分は、ダム部材86の開口にそれぞれ挿入可能になっている。
図12の符号96はダム部材の他の例を示しており、ダム部材96は複数の板状の壁材99を有しており、不図示の移動手段により、各壁材99は表面を鉛直方向に向けた状態で第四の押圧ゴム85の側面に沿って並べられて第四の押圧板82に取り付けられ、第四の押圧ゴム85の周囲を取り囲む1つの筒が形成される。
熱硬化性樹脂と熱可塑性樹脂の種類は特に限定されないが、熱硬化性樹脂としては、エポキシ樹脂、アクリル樹脂、ウレタン樹脂等を1種類以上用いることができ、熱可塑性樹脂としては例えばフェノキシ樹脂、ポリビニルアルコール等を1種類以上用いることができる。
更に、内部に導電性粒子が分散された接着フィルム35を用い、電気部品32、33の接続端子37、38と、基板31の接続端子37で導電性粒子を挟み込むことで、電気部品32、33と基板31とを電気的に接続してもよい。
基板31に接続する電気部品32、33の種類は特に限定されず、具体的には半導体素子、抵抗素子、他の基板等がある。
Claims (2)
- 第一、第二の押圧ゴムを有し、前記第一、第二の押圧ゴムの間に配置された圧着対象物を、前記第一、第二の押圧ゴムで押圧可能に構成され、
前記第一の押圧ゴムは、第一の押圧板上に配置された圧着装置であって、
前記第一の押圧ゴムの周囲には前記第一の押圧ゴムの表面高さよりも高いダム部材が配置され、
前記第二の押圧ゴムは前記ダム部材で囲まれた空間内に挿入できるように構成され、
前記第一の押圧ゴムと前記第一の押圧板との間には圧縮変形できる第一の圧縮部材が配置され、
少なくとも前記第一の圧縮部材が圧縮したときに、前記ダム部材の高さは前記第一の押圧ゴムの表面高さよりも高くなるように構成された圧着装置。 - 第一、第三の押圧ゴムを有し、
前記第一、第三の押圧ゴムの間に配置された圧着対象物を、前記第一、第三の押圧ゴムで押圧可能に構成され、
前記第一の押圧ゴムは、第一の押圧板上に配置された圧着装置であって、
前記第一、第三の押圧ゴムの周囲には、前記第一、第三の押圧ゴムの表面高さよりも高いダム部材がそれぞれ配置され、
前記第一の押圧ゴムと前記第一の押圧板との間には圧縮変形できる第一の圧縮部材が配置され、
少なくとも前記第一の圧縮部材が圧縮したときに、前記ダム部材の高さは前記第一の押圧ゴムの表面高さよりも高くなるように構成された圧着装置。
Priority Applications (11)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006033745A JP4996859B2 (ja) | 2006-02-10 | 2006-02-10 | 圧着装置 |
EP07713933A EP1983564A4 (en) | 2006-02-10 | 2007-02-08 | CONTACT FIXING DEVICE |
EP10168917A EP2239131A1 (en) | 2006-02-10 | 2007-02-08 | Compression bonding device |
KR1020087019439A KR101235532B1 (ko) | 2006-02-10 | 2007-02-08 | 압착 장치 |
PCT/JP2007/052217 WO2007091635A1 (ja) | 2006-02-10 | 2007-02-08 | 圧着装置 |
EP10168899A EP2230073A1 (en) | 2006-02-10 | 2007-02-08 | Compression bonding device |
CN2007800049726A CN101379603B (zh) | 2006-02-10 | 2007-02-08 | 压接装置 |
TW096104695A TWI368285B (en) | 2006-02-10 | 2007-02-09 | Contact bonding device |
US12/186,154 US20090014498A1 (en) | 2006-02-10 | 2008-08-05 | Compression bonding device |
HK09104516.8A HK1126315A1 (en) | 2006-02-10 | 2009-05-18 | Contact-bonding device |
US12/753,533 US8241455B2 (en) | 2006-02-10 | 2010-04-02 | Method for packing electric components on a substrate |
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JP2006033745A JP4996859B2 (ja) | 2006-02-10 | 2006-02-10 | 圧着装置 |
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US (2) | US20090014498A1 (ja) |
EP (3) | EP2239131A1 (ja) |
JP (1) | JP4996859B2 (ja) |
KR (1) | KR101235532B1 (ja) |
CN (1) | CN101379603B (ja) |
HK (1) | HK1126315A1 (ja) |
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JP5164499B2 (ja) * | 2007-09-27 | 2013-03-21 | デクセリアルズ株式会社 | 電子部品の実装方法及び電子部品実装基板 |
JP2009141269A (ja) * | 2007-12-10 | 2009-06-25 | Sony Chemical & Information Device Corp | 電気部品の実装方法及び実装装置 |
JP5614217B2 (ja) * | 2010-10-07 | 2014-10-29 | デクセリアルズ株式会社 | マルチチップ実装用緩衝フィルム |
JP2013033925A (ja) * | 2011-07-01 | 2013-02-14 | Tokyo Electron Ltd | 洗浄方法、プログラム、コンピュータ記憶媒体、洗浄装置及び剥離システム |
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JP2015046573A (ja) * | 2013-07-31 | 2015-03-12 | 日東電工株式会社 | 貼着治具および電子装置の製造方法 |
US9910646B2 (en) * | 2015-12-26 | 2018-03-06 | Intel Corporation | Technologies for native code invocation using binary analysis |
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US3557446A (en) * | 1968-12-16 | 1971-01-26 | Western Electric Co | Method of forming printed circuit board through-connections |
SE408383B (sv) * | 1976-04-08 | 1979-06-11 | Asea Ab | Press for formning av platar och dylikt med hjelp av en formdyna, som under formningsskedet er innesluten i en kavitet, som bildas av en ovre och en undre verktygsdel av vilka minst en er rorligt anordnad i ett ... |
JP2001501547A (ja) * | 1992-06-12 | 2001-02-06 | アルミナム カンパニー オブ アメリカ | 非平面を有する多層構造の製造方法 |
JP2925946B2 (ja) * | 1994-09-19 | 1999-07-28 | 沖電気工業株式会社 | 異方導電性フィルムを用いた半導体装置の実装方法及びそのための装置 |
US5707480A (en) * | 1995-09-19 | 1998-01-13 | International Business Machines Corporation | Apparatus for forming multiple cavity products |
JP3456146B2 (ja) * | 1998-06-11 | 2003-10-14 | 松下電器産業株式会社 | バンプ付電子部品のボンディング装置およびボンディング方法 |
JP4077982B2 (ja) * | 1998-06-26 | 2008-04-23 | 日機装株式会社 | 加圧成形用型 |
JP4157672B2 (ja) * | 1999-09-06 | 2008-10-01 | 日機装株式会社 | 加圧成形装置 |
JP4513235B2 (ja) | 2001-05-31 | 2010-07-28 | ソニー株式会社 | フリップチップ実装装置 |
EP1434261B1 (en) * | 2001-09-12 | 2010-03-31 | Nikkiso Co., Ltd. | Circuit device mounting method and press |
JP4718734B2 (ja) * | 2001-09-12 | 2011-07-06 | 日機装株式会社 | 回路素子の実装方法 |
JP4064808B2 (ja) * | 2001-12-25 | 2008-03-19 | 東芝松下ディスプレイテクノロジー株式会社 | 熱圧着装置及び熱圧着方法 |
JP3949072B2 (ja) * | 2003-03-26 | 2007-07-25 | 日機装株式会社 | 加圧装置 |
JP3921459B2 (ja) * | 2003-07-11 | 2007-05-30 | ソニーケミカル&インフォメーションデバイス株式会社 | 電気部品の実装方法及び実装装置 |
JP4925669B2 (ja) * | 2006-01-13 | 2012-05-09 | ソニーケミカル&インフォメーションデバイス株式会社 | 圧着装置及び実装方法 |
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2007
- 2007-02-08 EP EP10168917A patent/EP2239131A1/en not_active Withdrawn
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- 2007-02-08 WO PCT/JP2007/052217 patent/WO2007091635A1/ja active Application Filing
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Also Published As
Publication number | Publication date |
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JP2007214434A (ja) | 2007-08-23 |
CN101379603B (zh) | 2011-05-25 |
US20100186894A1 (en) | 2010-07-29 |
EP2230073A1 (en) | 2010-09-22 |
TW200739772A (en) | 2007-10-16 |
EP1983564A1 (en) | 2008-10-22 |
HK1126315A1 (en) | 2009-08-28 |
US20090014498A1 (en) | 2009-01-15 |
CN101379603A (zh) | 2009-03-04 |
WO2007091635A1 (ja) | 2007-08-16 |
EP2239131A1 (en) | 2010-10-13 |
US8241455B2 (en) | 2012-08-14 |
KR20080101895A (ko) | 2008-11-21 |
EP1983564A4 (en) | 2012-07-04 |
TWI368285B (en) | 2012-07-11 |
KR101235532B1 (ko) | 2013-02-21 |
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