TWI382478B - 按壓頭及按壓裝置 - Google Patents

按壓頭及按壓裝置 Download PDF

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Publication number
TWI382478B
TWI382478B TW096114208A TW96114208A TWI382478B TW I382478 B TWI382478 B TW I382478B TW 096114208 A TW096114208 A TW 096114208A TW 96114208 A TW96114208 A TW 96114208A TW I382478 B TWI382478 B TW I382478B
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Taiwan
Prior art keywords
pressing
head
bars
deforming member
deformed
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TW096114208A
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English (en)
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TW200802656A (en
Inventor
Masaki Taniguchi
Kazutaka Furuta
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Sony Chem & Inf Device Corp
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Publication of TW200802656A publication Critical patent/TW200802656A/zh
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Publication of TWI382478B publication Critical patent/TWI382478B/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/06—Platens or press rams
    • B30B15/065—Press rams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B5/00—Presses characterised by the use of pressing means other than those mentioned in the preceding groups
    • B30B5/02—Presses characterised by the use of pressing means other than those mentioned in the preceding groups wherein the pressing means is in the form of a flexible element, e.g. diaphragm, urged by fluid pressure
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
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    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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Description

按壓頭及按壓裝置
本發明係關於一種按壓頭及使用該按壓頭之按壓裝置。
以往，接著劑廣泛地使用在電氣元件及基板的連接上，為了將電氣元件連接在基板上，使用可按壓電氣元件的按壓頭。
雖按壓頭一般係使用金屬及陶瓷等硬質頭，但由於在將不同高度的電氣元件連接在相同基板上時，無法以一次的按壓進行電氣元件的連接，故此時使用具有彈性體等之按壓橡膠的彈性體頭。
圖10之符號101係顯示具有彈性體頭110的按壓裝置，彈性體頭110具有金屬製的頭本體111及安裝在頭本體111上的按壓橡膠120。
彈性體頭110與使用硬質頭時不同，由於按壓橡膠120能夠壓縮變形，因此能一次將不同高度的電氣元件140,145按壓而連接在基板130上。又，在構裝IC晶片等的電氣元件140時，雖混入圍繞電氣元件140之接著劑層135(邊緣部分)之氣泡(孔洞)的存在成為問題，但由於彈性體頭110不僅抵接電氣元件140，亦會抵接該電氣元件140周圍的接著劑層135，因此具有在邊緣部分不易產生孔洞的優點。
然而，由於在使用彈性體頭110構裝時，按壓橡膠120會依不同高度的電氣元件140,145變形，故會有按壓橡膠120在橫方向產生變形，而引起電氣元件140,145之位置偏移的問題。
(專利文獻1)日本特開2002－359264號公報(專利文獻2)日本特開2005－32952號公報
本發明係為了解決上述問題而構成，其目的在於提供一種不會引起位置偏移即可連接電氣元件的按壓頭。
為了解決上述問題，本發明之按壓頭，係將接著對象物朝向被接著對象物按壓，具備：變形構件，係因按壓力而變形、在變形狀態下具有復原力；以及複數根按壓棒，係分別豎設在該變形構件上，以前端按壓該接著對象物。
本發明之按壓頭，具有在已變形之該變形構件上維持該按壓棒之豎設狀態的保持構件。
本發明之按壓頭，該保持構件具有環狀框體；該各按壓棒係配置在該框體的環內側；該各按壓棒可相對該框體移動。
本發明之按壓頭，該保持構件具有複數個筒狀體；該各按壓棒係插入至該筒狀體；該各按壓棒可相對該筒狀體移動。
本發明之按壓頭，該變形構件具有以彈性體構成的按壓橡膠；該各按壓棒係豎設在該彈性體上。
本發明之按壓頭，該變形構件具有複數個彈簧；該各按壓棒係豎設在該彈簧上。
本發明之按壓裝置，具備：該按壓頭、裝載台、及使該按壓頭朝著該裝載台移動的移動機構。
本發明不引起位置偏移即可一次將不同高度的電氣元件連接至基板上。由於在將電氣元件朝向基板按壓時，亦可按壓邊緣部，故邊緣部不會產生孔洞。是以，使用本發明的按壓頭及按壓裝置，可獲得連接可靠性高的電氣裝置。
圖1之符號1係顯示本發明的按壓頭10，按壓頭10具有台座部12、保持構件11、及複數根按壓棒22。保持機構11具有環狀的框體16及格子狀的分隔構件17(圖2)。
台座部12呈板狀，框體16係在台座部12上配置成圍繞包含台座部12中心之區域，變形構件20則配置在被台座部12上之框體16所圍繞之區域。
分隔構件17係在變形構件20上組裝於框體16，以將變形構件20上之空間分割為複數個。
分隔構件17的格子，係由縱方向延伸的小格子與橫方向延伸的小格子構成，以分隔構件17分割的分割空間18係排列成行列狀。縱方向延伸之小格子的間隔大致相同，橫方向延伸之小格子的間隔亦大致相同，故各分割空間18之大小大致相同。
在分割空間18內部配置1根至複數根的上述按壓棒22。各按壓棒22的下端安裝在變形構件20上，上端則朝向相同方向。此處，變形構件20之表面平坦，各按壓棒22係與該表面呈垂直豎設。台座部12的表面與變形構件20的表面呈平行，是以，各按壓棒22亦與台座部12的表面呈垂直。
此處，配置於各分割空間18之按壓棒22為1根，各按壓棒22粗細相同。分割空間18之開口的大小與按壓棒22的截面積相同或稍大，是以，各按壓棒22的側面與分隔構件17的側面接觸、或如後述般施加來自橫方向的力量導致按壓棒22傾斜時，按壓棒22的側面會與分隔構件17的側面接觸。由於分隔構件17係固定於框體16，即使按壓棒22接觸而施加橫方向的力量，分隔構件17亦不會移動，因此按壓棒22能維持在變形構件20上豎設的狀態。
當按壓棒22與分隔構件17接觸時的摩擦係數小，即使按壓棒22與分隔構件17接觸時亦可在軸線方向移動。是以，按壓棒22能夠相對分隔構件17及框體16移動。
各按壓棒22的長度較分隔構件17的厚度長，各按壓棒22的前端由分隔構件17突出，如後述，以按壓頭10按壓按壓對象物時，按壓棒22的前端可接觸按壓對象物。
此處，由於各按壓棒22的長度分別相同，各按壓棒22的前端位於相同平面內，因此如後述，將按壓頭10抵接至具有不同厚度之電氣元件的按壓對象物時，首先，按壓棒22的前端會接觸最厚的電氣元件，並只有與該電氣元件接觸的按壓棒22被按壓。
各按壓棒22係由金屬及陶瓷等不會由於按壓力而彈性變形的非彈性材料構成，變形構件20係以彈性體等彈性材料構成的按壓橡膠，變形構件20可藉按壓力而彈性變形。
按壓棒22係相互分離，各按壓棒22可沿其軸線方向個別移動，變形構件20中，被按壓之按壓棒22所在之部分會被按壓而壓縮。
由於變形構件20可藉按壓力而彈性變形，故按壓頭10可相對按壓對象物進一步移動，當按壓頭10朝按壓對象物進一步移動時，壓縮後的變形構件20進一步被壓縮，按壓棒22亦與厚度較薄的電氣元件接觸，最後，按壓棒22的前端接觸所有不同厚度的電氣元件。在此狀態下，按壓頭10進一步朝按壓對象物移動時，與所有電氣元件接觸的按壓棒22會被按壓。
如上述，雖按壓棒22被按壓時，變形構件20之按壓棒22所在部分會被壓縮，但當變形構件20被壓縮時會產生復原力，可壓回按壓棒22。是以，可藉復原力按壓各電氣元件。
當電氣元件厚度不同、按壓對象物之表面有段差時，雖按壓棒22的前端接觸該段差的角落部分時，會產生橫方向的力量而使按壓棒22的前端偏移，但如上述，按壓棒22因分隔構件17而不會傾倒，可維持豎設狀態。
圖3之符號1係顯示具有上述按壓頭10之本發明的按壓裝置，該按壓裝置1除了按壓頭10外，亦具有裝載台25及移動機構28。
圖3之符號26係顯示裝載台25之配置按壓對象物的裝載面，按壓頭20係以按壓棒22的前端朝向裝載面26、按壓棒22前端所在之平面與裝載面26平行之方式安裝於移動機構28。是以，從各按壓棒22的前端至裝載面26的距離大致相同。
移動機構28可使按壓頭10在相對裝載面26呈大致垂直的方向移動，在按壓頭10移動時，各按壓棒22的前端與裝載面26之間的距離亦維持大致相同。
接著說明使用該按壓裝置1將不同厚度的電氣元件連接至基板的步驟。
圖4之符號5係顯示按壓對象物，按壓對象物5具有被接著對象物之基板30及接著對象物之電氣元件。此處，按壓對象物5具有不同厚度的電氣元件，圖4之符號40係顯示厚的電氣元件40，同圖中之符號45係顯示厚度較該電氣元件40薄的電氣元件45。
基板30具有基板本體31，在基板本體31表面繞設配線膜，以一部分配線膜構成連接部32。
在基板30之配置連接部32側之表面塗布糊狀的接著劑、或貼合膜狀的接著劑來形成接著劑層35，厚的電氣元件40及薄的電氣元件45係配置在基板30上的既定部位，電氣元件40,45的連接端子42,47係位在挾持接著劑層35之連接部32上。
接著劑層35形成為較電氣元件40,45大，其一部分由電氣元件40,45擠出，而露出於電氣元件40,45間。又，即使當接著劑層35沒有由電氣元件40,45擠出時，在後述按壓時，接著劑層35亦會被按壓而一部分從電氣元件40,45外周擠出。
將該按壓對象物5之配置電氣元件40,45側的面朝向按壓頭10而置放於裝載面26，為了在後述按壓時，不使接著劑層35進入按壓棒22之間，在按壓對象物5上配置相對接著劑層35接著性低的保護膜39(圖5(a))。
如上述，由於電氣元件40,45的厚度不同，故在按壓對象物5的表面會形成段差。
保護膜39係以樹脂膜般的可撓性膜構成，由於保護膜39沿按壓對象物5的表面形狀而變形，因此保護膜39的表面亦形成伴隨按壓對象物5之段差的段差。
如上述，由於按壓頭10在各按壓棒22的前端與裝載面26之間的距離維持大致相同之狀態下移動，因此當以移動機構28使按壓頭10接近裝載面26時，按壓棒22的前端會接觸厚的電氣元件40上的保護膜39，接著按壓棒22的前端會接觸薄的電氣元件45上的保護膜39(圖5(b))。
變形構件20之厚度，係可變形成最厚的電氣元件40及最薄的電氣元件45之厚度差以上，是以，所有電氣元件40,45係透過保護膜39被按壓棒22按壓。
此處，變形構件20的可變形量大於最厚的電氣元件40之厚度。是以，當按壓頭10進一步接近裝載面26時，按壓棒22不僅按壓電氣元件40,45，亦按壓接著劑層35之圍繞電氣元件40,45之部分(邊緣部份)。
雖在變形構件20變形前，所有按壓棒22的前端突出至框體16外側，但當所有按壓棒22抵接至按壓對象物5及裝載台25而被按壓、在軸線方向移動時，框體16的前端會接觸按壓對象物5及裝載台25。
此處，框體16的前端係會與基板30之配置電氣元件40,45之區域之外側接觸，為了防止因必要以上的負重導致電氣元件40,45損壞，在框體16的前端一接觸後，停止按壓頭10的移動(圖6(a))。
此時，按壓棒22的前端接觸厚的電氣元件40及薄的電氣元件45，壓縮變形構件20，厚的電氣元件40及薄的電氣元件45皆因復原力而被按壓。
當電氣元件40,45被按壓時，從電氣元件40,45與基板30之間壓退接著劑層35，連接端子42,47會在連接部32上直接、或透過後述導電性粒子接觸，電氣元件40,45電氣連接至基板30。此時，按壓棒22亦會接觸至上述邊緣部，由於邊緣部係因變形構件20的復原力而被按壓，故空氣不會進入邊緣部，因此不會產生孔洞。
此外，由於當按壓時如果將接著劑層35加以升溫，接著劑層35的流動性會提高，因此能以小的按壓力將電氣元件40,45電氣連接至基板30。
由於當按壓電氣元件40,45時，按壓棒22的前端亦會抵接至電氣元件40,45以外的部分，尤其是當接著劑層35的流動性提高時，接著劑層35容易進入按壓棒22之間，但由於如上述般保護膜39係配置於按壓對象物5上，因此按壓棒22不會直接接觸接著劑層35，接著劑層35不會進入按壓棒22之間。
按壓頭10及裝載台25設有加熱機構19,29。加熱機構19,29係預先通電，加溫裝載台25及按壓頭10，藉由熱傳導來加熱按壓對象物5。
接著劑層35，係由含有熱硬化性樹脂、以加熱而硬化的熱硬化性接著劑，或含有熱塑性樹脂、以加熱產生接著性的熱塑性接著劑構成。
當接著劑層35係以熱硬化性接著劑構成時，接著劑層35升溫至熱硬化性樹脂之熱聚合溫度以上時接著劑會硬化，以硬化後之接著劑層35將電氣元件40,45固定至基板30。
又，當接著劑層35係以熱塑性接著劑構成時，以接著劑層35將電氣元件40,45及基板30接著，加熱結束後接著劑層35冷卻固化時，電氣元件40,45係藉由固化後之接著劑層35固定至基板30。是以，電氣元件40,45可藉由硬化或固化後之接著劑層35機械性連接。
使按壓頭10遠離按壓對象物5而移動，當按壓棒22的前端離開按壓對象物5、將保護膜39由按壓對象物5上除去時，可以獲得圖7所示的電氣裝置2。該電氣裝置2，電氣元件40,45不僅電氣連接至基板30，亦可藉由硬化或固化後的接著劑層35機械性連接。如上述，由於在按壓時不會引起電氣元件40,45的位置偏移，且在邊緣部不會產生孔洞，因此該電氣裝置2的連接可靠性高。
以上雖說明保持構件11具有框體16及分隔構件17，按壓棒22係配置在以分隔構件17分割的分割空間18的情形，但本發明並不限於此。
將按壓棒22的間隔縮小至按壓棒22傾斜時會與相鄰的按壓棒22接觸，將按壓棒22群及框體16之間的距離縮小至群之最外周之按壓棒22傾斜時會與框體16接觸時，由於按壓棒22被互相相鄰的按壓棒22或框體16支撐而不會傾倒，因此即便沒有分隔構件17亦可以維持按壓棒22的豎設狀態。
以上雖說明變形構件20為按壓橡膠的情形，但本發明並不限於此。
圖8之符號55係顯示變形構件的另一例，該變形構件55具有複數個彈簧56。
保持構件57具有複數個筒狀體58，各筒狀體58係豎設在台座部12表面，各彈簧56位在筒狀體58內部且下端固定在台座部12。
筒狀體58的長度較彈簧56的長度長，筒狀體58的上端圍繞彈簧56的上部空間。按壓棒22逐一插入該上部空間，按壓棒22的下端安裝至彈簧56。是以，各按壓棒22位在筒狀體58內部且豎設在彈簧56上。
筒狀體58之圍繞彈簧56之上部空間之部分的長度較按壓棒22的長度短，按壓棒22的前端係由筒狀體58突出，而可接觸按壓對象物5，當按壓對象物5接觸按壓棒22的前端而被按壓時，安裝有該按壓棒22的彈簧56會壓縮，使按壓部22在軸線方向朝台座部12移動，且壓縮後的彈簧56會對按壓棒22施加復原力。
此保持構件57，各筒狀體58圍繞按壓棒22的一部分。筒狀體58之內部空間的截面積與按壓棒22的截面積相同或稍大，當對按壓棒22施加橫方向的力量使按壓棒22傾斜時，按壓棒22的側面會接觸筒狀體58的內壁面，使按壓棒22不會傾倒。
此處，筒狀體58係固定於台座部12，由於即使按壓棒22與筒狀體58接觸亦可在軸線方向移動，因此按壓棒22可相對筒狀體58移動。
以上雖說明以彈簧56構成變形構件55，且以筒狀體58構成保持構件57之情形，但本發明並不限於此，以複數個按壓橡膠構成變形構件55，以複數個筒狀體58構成保持構件57，並在1個筒狀體58內部配置1個或2個以上的按壓橡膠亦可。
又，在以彈簧56構成變形構件55時，以具有框體16、或具有框體16及分隔構件17雙方的保持構件57來構成保持構件11亦可。再者，於按壓棒22沒有傾倒之顧慮時，無論變形構件20,55為按壓橡膠或彈簧，均可不設置保持構件。
以上雖說明透過保護膜39使按壓棒22接觸按壓對象物5的情形，但本發明並不限於此，在接著劑層35的流動性低，接著劑沒有進入按壓棒22間之顧慮時，直接使按壓棒22的前端接觸按壓對象物5亦可。
按壓棒22，例如在與軸線垂直的方向切斷時的截面形狀為正方形或長方形，雖一邊的長度為50 μm以上100 μm以下，但本發明並不特別限於此，亦可使用截面形狀為圓形及橢圓形者。
又，如圖9所示，以彈性體等彈性材料所構成的保護蓋23覆蓋按壓棒22的前端，在以按壓棒22按壓按壓對象物5時，透過該保護蓋23來按壓按壓對象物5亦可。
雖使用於接著劑之熱硬化性樹脂及熱塑性樹脂的種類並沒有特別限定，但熱硬化性樹脂可使用環氧樹脂、丙烯酸樹脂、氨基甲酸酯樹脂等中1種類以上，熱塑性樹脂可使用例如苯氧基樹脂、聚乙烯醇樹脂等中1種類以上。
又，亦可使用在熱硬化性接著劑中添加熱塑性樹脂而提升接著性者。
又，亦可使用於上述接著劑中添加導電性粒子之異向導電性接著劑(ACF、ACP)，亦可使用無添加導電性粒子者(NCF、NCP)。
亦可將加熱機構19,29僅設置在裝載台25及按壓頭10其中一方。又，在裝載台25及按壓頭10皆不設置加熱機構，從配置在外部之加熱機構照射紅外線以加熱接著劑層35亦可。
變形構件20只要能藉由以按壓棒22按壓所有電氣元件40,45而變形即可。例如變形構件20具有按壓橡膠時，該按壓橡膠的厚度只要是最厚的電氣元件40的厚度的10倍以上25倍以下，即可按壓所有電氣元件40,45。舉一例而言，在最厚的電氣元件(IC晶片)40的厚度為0.4mm時，矽氧橡膠所構成之按壓橡膠的厚度為10mm。
構成按壓橡膠之彈性材料並未特別限定，但舉一例而言，可使用橡膠硬度(依據JIS S 6050)為40、80的彈性體。
橡膠硬度係以JIS S 6050：2002之「6.試驗方法」所記載之方法測定。其內容如下述。
使用於試驗之材料，係使用製造後經過24小時以上者。又，化學分析共通之一般事項係依據JIS K 0050。硬度試驗使用硬度試驗機，對保持水平之試片表面，使試驗機之壓針成為鉛垂而接觸加壓面，立即以正數讀取刻度。此外，試片之測定部位係將表面整體3等分，對每一等分的中央部分逐一進行測定，以其中央值做為試片之硬度。
此外，硬度試驗機係指壓針形狀為直徑5.08mm±0.02mm之半球狀的彈簧硬度試驗機。壓針之高度，當刻度為0時係2.54±0.22mm，當刻度為100時係0mm。刻度與彈簧力之關係如下述表1。
此外，對橡膠硬度分別為40、60、80之彈性體，在測定溫度30℃~240℃的範圍內每隔30℃測定橡膠硬度，其結果，橡膠硬度的變化為±2。由於此值可說是測定誤差範圍，故可知橡膠硬度為不因溫度變化而受影響的值。
使用於按壓橡膠之彈性體，雖可使用天然橡膠、合成橡膠任一種，但自耐熱性、耐壓性的觀點來看，較佳為使用矽氧橡膠。
保護膜39只要是相對構成接著劑層35之接著劑的接著性低者則無特別限定，可使用例如將鐵氟龍(註冊商標)般的氟樹脂膜、聚四氟乙烯成形為膜狀者、或將矽氧橡膠成形為膜狀者。
又，只要按壓棒22的前端可與按壓對象物5接觸，則按壓棒22的前端不由框體16的前端突出亦可，按壓棒22的前端與框體16的前端面高相同亦可，按壓棒22的前端位於框體16所圍繞的空間內部亦可。
框體16的形狀亦不限於環狀，只要可以防止按壓棒22的傾斜，在環上形成1個以上的缺口亦可。
基板30的種類並無特別限定，可以使用玻璃基板及玻璃環氧樹脂基板般的硬性基板、可撓性配線板等各種基板。電氣元件40,45的種類亦沒有特別限定，可以使用IC晶片、阻抗元件、電容器等各種電氣元件。又，基板之間的連接亦可以使用本發明的按壓頭。
1．．．按壓裝置
5．．．按壓對象物
10．．．按壓頭
11,57．．．保持構件
16．．．框體
20,55．．．變形構件
22．．．按壓棒
25．．．裝載台
30．．．基板(被接著對象物)
40,45．．．電氣元件(接著對象物)
56．．．彈簧
58．．．筒狀體
圖1係本發明之按壓頭一例的截面圖。
圖2係本發明之按壓頭一例的俯視圖。
圖3係顯示本發明之按壓裝置的截面圖。
圖4係顯示按壓對象物的截面圖。
圖5(a)、(b)係將電氣元件連接至基板之步驟的前半部分。
圖6(a)係將電氣元件連接至基板之步驟的後半部分。
圖7係顯示使用本發明之按壓裝置製造之電氣裝置一例的截面圖。
圖8係本發明之按壓頭另一例的截面圖。
圖9係顯示按壓棒前端的側視圖。
圖10係說明習知技術之按壓頭的截面圖。
1．．．按壓裝置
5．．．按壓對象物
10．．．按壓頭
11．．．保持構件
12．．．台座部
16．．．框體
19,29．．．加熱機構
20．．．變形構件
22．．．按壓棒
25．．．裝載台
26．．．裝載面
28．．．移動機構
30．．．基板(被接著對象物)
31．．．基板本體
32．．．連接部
35．．．接著劑層
39．．．保護膜
40,45．．．電氣元件(接著對象物)
42,47．．．連接端子

Claims (12)

  1. 一種按壓頭，係將接著對象物朝向被接著對象物按壓，具備：變形構件，係因按壓力而變形、在變形狀態下具有復原力；複數根按壓棒，係分別豎設在該變形構件上，以前端按壓該接著對象物；以及保持構件，具有在已變形之該變形構件上維持該按壓棒之豎設狀態；該保持構件具有環狀框體；該各按壓棒係配置在該框體的環內側；該各按壓棒可相對該框體移動。
  2. 如申請專利範圍第1項之按壓頭，其中，該環狀為圓形。
  3. 如申請專利範圍第1項之按壓頭，其中，於該框體形成有缺口。
  4. 如申請專利範圍第3項之按壓頭，其中，該缺口為複數個。
  5. 如申請專利範圍第1項之按壓頭，其中，該變形構件具有以彈性體構成的按壓橡膠；該各按壓棒係豎設在該彈性體上。
  6. 如申請專利範圍第5項之按壓頭，其中，按壓配置於基板上之不同高度之電氣元件；該按壓橡膠之厚度為最厚電氣元件之厚度之10倍以上 25倍以下。
  7. 一種按壓頭，係將接著對象物朝向被接著對象物按壓，具備：變形構件，係因按壓力而變形、在變形狀態下具有復原力；複數根按壓棒，係分別豎設在該變形構件上，以前端按壓該接著對象物；以及保持構件，具有在已變形之該變形構件上維持該按壓棒之豎設狀態；該保持構件具有複數個筒狀體；該各按壓棒係插入至該筒狀體；該各按壓棒可相對該筒狀體移動。
  8. 一種按壓裝置，具備：申請專利範圍第1或7項之按壓頭、裝載台、及使該按壓頭朝著該裝載台移動的移動機構。
  9. 一種按壓頭，係將接著對象物朝向被接著對象物按壓，具備：變形構件，係因按壓力而變形、在變形狀態下具有復原力；以及複數根按壓棒，係分別豎設在該變形構件上，以前端按壓該接著對象物；該變形構件具有複數個彈簧；該各按壓棒係豎設於彈簧上；該各按壓棒與該接著對象物接觸之前端位於相同平 面。
  10. 如申請專利範圍第9項之按壓頭，其中，該各按壓棒係分別配置於筒狀體之內部。
  11. 如申請專利範圍第10項之按壓頭，其中，該筒狀體係固定於配置有該彈簧之台座部。
  12. 一種按壓裝置，具備：申請專利範圍第9項之按壓頭、裝載台、及使該按壓頭朝著該裝載台移動的移動機構。
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