TWI368285B - Contact bonding device - Google Patents
Contact bonding deviceInfo
- Publication number
- TWI368285B TWI368285B TW096104695A TW96104695A TWI368285B TW I368285 B TWI368285 B TW I368285B TW 096104695 A TW096104695 A TW 096104695A TW 96104695 A TW96104695 A TW 96104695A TW I368285 B TWI368285 B TW I368285B
- Authority
- TW
- Taiwan
- Prior art keywords
- bonding device
- contact bonding
- contact
- bonding
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
- B30B15/02—Dies; Inserts therefor; Mounting thereof; Moulds
- B30B15/022—Moulds for compacting material in powder, granular of pasta form
- B30B15/024—Moulds for compacting material in powder, granular of pasta form using elastic mould parts
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- B30B5/02—Presses characterised by the use of pressing means other than those mentioned in the preceding groups wherein the pressing means is in the form of a flexible element, e.g. diaphragm, urged by fluid pressure
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- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00013—Fully indexed content
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01005—Boron [B]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01024—Chromium [Cr]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2924/01—Chemical elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/0665—Epoxy resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19106—Disposition of discrete passive components in a mirrored arrangement on two different side of a common die mounting substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Fluid Mechanics (AREA)
- Wire Bonding (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Measuring Fluid Pressure (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006033745A JP4996859B2 (ja) | 2006-02-10 | 2006-02-10 | 圧着装置 |
Publications (2)
Publication Number | Publication Date |
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TW200739772A TW200739772A (en) | 2007-10-16 |
TWI368285B true TWI368285B (en) | 2012-07-11 |
Family
ID=38345229
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW096104695A TWI368285B (en) | 2006-02-10 | 2007-02-09 | Contact bonding device |
Country Status (8)
Country | Link |
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US (2) | US20090014498A1 (zh) |
EP (3) | EP2230073A1 (zh) |
JP (1) | JP4996859B2 (zh) |
KR (1) | KR101235532B1 (zh) |
CN (1) | CN101379603B (zh) |
HK (1) | HK1126315A1 (zh) |
TW (1) | TWI368285B (zh) |
WO (1) | WO2007091635A1 (zh) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
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JP5164499B2 (ja) * | 2007-09-27 | 2013-03-21 | デクセリアルズ株式会社 | 電子部品の実装方法及び電子部品実装基板 |
JP2009141269A (ja) * | 2007-12-10 | 2009-06-25 | Sony Chemical & Information Device Corp | 電気部品の実装方法及び実装装置 |
JP5614217B2 (ja) * | 2010-10-07 | 2014-10-29 | デクセリアルズ株式会社 | マルチチップ実装用緩衝フィルム |
JP2013033925A (ja) * | 2011-07-01 | 2013-02-14 | Tokyo Electron Ltd | 洗浄方法、プログラム、コンピュータ記憶媒体、洗浄装置及び剥離システム |
CN103200780A (zh) * | 2012-01-09 | 2013-07-10 | 苏州世鼎电子有限公司 | 铜箔线路与罩体基板的热压贴合方法 |
DE102013003527A1 (de) * | 2013-03-04 | 2014-09-04 | Danfoss Silicon Power Gmbh | Vorrichtung zum Niedertemperatur-Drucksintern, Verfahren zum Niedertemperatur-Drucksintern und leistungselektronische Baugruppe |
JP2015046573A (ja) * | 2013-07-31 | 2015-03-12 | 日東電工株式会社 | 貼着治具および電子装置の製造方法 |
US9910646B2 (en) * | 2015-12-26 | 2018-03-06 | Intel Corporation | Technologies for native code invocation using binary analysis |
TWI638160B (zh) * | 2017-12-29 | 2018-10-11 | 鴻勁精密股份有限公司 | Gland module, test device with gland module and test classification device thereof |
CN108710225B (zh) * | 2018-05-24 | 2021-01-26 | 京东方科技集团股份有限公司 | 一种绑定设备及其控制方法 |
US20220009797A1 (en) * | 2018-11-07 | 2022-01-13 | Unitika Ltd. | Water purification cartridge |
WO2021168344A1 (en) * | 2020-02-21 | 2021-08-26 | Skate One Corp. | Apparatus and method for pressing a workpiece |
CN113870704B (zh) * | 2021-09-27 | 2023-06-02 | 上海天马微电子有限公司 | 显示装置 |
CN114103088B (zh) * | 2021-11-26 | 2022-07-08 | 惠州深科达智能装备有限公司 | 一种导电膜贴附方法及设备 |
KR20240078859A (ko) * | 2022-11-28 | 2024-06-04 | (주)미래컴퍼니 | 전고체전지 제조장치 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3557446A (en) * | 1968-12-16 | 1971-01-26 | Western Electric Co | Method of forming printed circuit board through-connections |
SE408383B (sv) * | 1976-04-08 | 1979-06-11 | Asea Ab | Press for formning av platar och dylikt med hjelp av en formdyna, som under formningsskedet er innesluten i en kavitet, som bildas av en ovre och en undre verktygsdel av vilka minst en er rorligt anordnad i ett ... |
JP2001501547A (ja) * | 1992-06-12 | 2001-02-06 | アルミナム カンパニー オブ アメリカ | 非平面を有する多層構造の製造方法 |
JP2925946B2 (ja) * | 1994-09-19 | 1999-07-28 | 沖電気工業株式会社 | 異方導電性フィルムを用いた半導体装置の実装方法及びそのための装置 |
US5707480A (en) * | 1995-09-19 | 1998-01-13 | International Business Machines Corporation | Apparatus for forming multiple cavity products |
JP3456146B2 (ja) * | 1998-06-11 | 2003-10-14 | 松下電器産業株式会社 | バンプ付電子部品のボンディング装置およびボンディング方法 |
JP4077982B2 (ja) * | 1998-06-26 | 2008-04-23 | 日機装株式会社 | 加圧成形用型 |
JP4157672B2 (ja) * | 1999-09-06 | 2008-10-01 | 日機装株式会社 | 加圧成形装置 |
JP4513235B2 (ja) | 2001-05-31 | 2010-07-28 | ソニー株式会社 | フリップチップ実装装置 |
JP4718734B2 (ja) * | 2001-09-12 | 2011-07-06 | 日機装株式会社 | 回路素子の実装方法 |
US20040238115A1 (en) | 2001-09-12 | 2004-12-02 | Hisao Matsuno | Circuit device mounting method and press |
JP4064808B2 (ja) * | 2001-12-25 | 2008-03-19 | 東芝松下ディスプレイテクノロジー株式会社 | 熱圧着装置及び熱圧着方法 |
JP3949072B2 (ja) * | 2003-03-26 | 2007-07-25 | 日機装株式会社 | 加圧装置 |
JP3921459B2 (ja) * | 2003-07-11 | 2007-05-30 | ソニーケミカル&インフォメーションデバイス株式会社 | 電気部品の実装方法及び実装装置 |
JP4925669B2 (ja) * | 2006-01-13 | 2012-05-09 | ソニーケミカル&インフォメーションデバイス株式会社 | 圧着装置及び実装方法 |
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2006
- 2006-02-10 JP JP2006033745A patent/JP4996859B2/ja not_active Expired - Fee Related
-
2007
- 2007-02-08 EP EP10168899A patent/EP2230073A1/en not_active Withdrawn
- 2007-02-08 EP EP10168917A patent/EP2239131A1/en not_active Withdrawn
- 2007-02-08 CN CN2007800049726A patent/CN101379603B/zh not_active Expired - Fee Related
- 2007-02-08 WO PCT/JP2007/052217 patent/WO2007091635A1/ja active Application Filing
- 2007-02-08 KR KR1020087019439A patent/KR101235532B1/ko not_active IP Right Cessation
- 2007-02-08 EP EP07713933A patent/EP1983564A4/en not_active Withdrawn
- 2007-02-09 TW TW096104695A patent/TWI368285B/zh not_active IP Right Cessation
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2008
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2009
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2010
- 2010-04-02 US US12/753,533 patent/US8241455B2/en not_active Expired - Fee Related
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CN101379603B (zh) | 2011-05-25 |
US20090014498A1 (en) | 2009-01-15 |
CN101379603A (zh) | 2009-03-04 |
KR20080101895A (ko) | 2008-11-21 |
WO2007091635A1 (ja) | 2007-08-16 |
EP2239131A1 (en) | 2010-10-13 |
HK1126315A1 (en) | 2009-08-28 |
JP2007214434A (ja) | 2007-08-23 |
KR101235532B1 (ko) | 2013-02-21 |
US8241455B2 (en) | 2012-08-14 |
US20100186894A1 (en) | 2010-07-29 |
TW200739772A (en) | 2007-10-16 |
EP1983564A4 (en) | 2012-07-04 |
EP1983564A1 (en) | 2008-10-22 |
EP2230073A1 (en) | 2010-09-22 |
JP4996859B2 (ja) | 2012-08-08 |
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