JP7448584B2 - 半導体デバイスを接合するための可撓性のある焼結ツール - Google Patents
半導体デバイスを接合するための可撓性のある焼結ツール Download PDFInfo
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- JP7448584B2 JP7448584B2 JP2022076170A JP2022076170A JP7448584B2 JP 7448584 B2 JP7448584 B2 JP 7448584B2 JP 2022076170 A JP2022076170 A JP 2022076170A JP 2022076170 A JP2022076170 A JP 2022076170A JP 7448584 B2 JP7448584 B2 JP 7448584B2
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- 239000004065 semiconductor Substances 0.000 title claims description 92
- 238000005245 sintering Methods 0.000 title description 24
- 238000007789 sealing Methods 0.000 claims description 142
- 239000000758 substrate Substances 0.000 claims description 115
- 239000012530 fluid Substances 0.000 claims description 47
- 238000000034 method Methods 0.000 claims description 18
- 230000033001 locomotion Effects 0.000 claims description 10
- 238000004891 communication Methods 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 230000003213 activating effect Effects 0.000 claims 1
- 239000000463 material Substances 0.000 description 6
- 238000007792 addition Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000003779 heat-resistant material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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Description
12 半導体デバイス
13 ダイトップシステム(DTS)チップ
14 基板
16 プラットフォーム
18 コーナ
20 装置
30 スタンプホルダ組立体
32 スタンプ
32a 上側部分
32b 下側部分
33 スロット
34 スタンプホルダスリーブ
35 凹部
36 スタンプホルダ本体
37 カラー
37a 上面
37b 底面
39 ベース
40 封止プレート組立体
41 封止プレート肩部
42 隔膜
44 封止プレート
45 段差部
46 封止インサート
48 軟質部分
49 切抜部
50 半導体デバイス
52 基板
54 リリースフィルム
70 流体圧力発生器
80 プラットフォーム
82 陥凹部分
84 段差部
130 スタンプホルダ組立体
132 スタンプ
132a 上側部分
132b 下側部分
133 スロット
134 スタンプホルダスリーブ
135 凹部
136 スタンプホルダ本体
137 カラー
137b 下端
140 封止プレート組立体
142 隔膜
144 封止プレート
147 開口部
148 軟質部分
150 半導体デバイス
152 基板
154 リリースフィルム
156 保持プレート
160 圧力センサ
170 流体圧力発生器
180 プラットフォーム
182 陥凹部分
190 非可撓性の硬質ツール
192 硬質ツールセクション
194 軟質ツールセクション
Claims (17)
- プラットフォーム上に支持された基板に対して少なくとも1つの半導体デバイスを接合するための装置であって、前記装置は、
剛性のある複数の硬質部分と、前記硬質部分の間に位置する1つ以上の可撓性のある軟質部分と、を含む封止プレートであって、前記封止プレートは、前記基板が前記プラットフォーム上に支持されているとき、使用時に前記基板と接触するように構成された第1の側を有する、封止プレート、
を備える装置において、前記装置は、
前記第1の側とは反対の、前記封止プレートの第2の側を覆う隔膜と、
前記隔膜と流体連通している流体圧力発生器であって、前記流体圧力発生器は、流体圧力を前記隔膜に対して加えるように動作可能であり、前記流体圧力は、前記隔膜を作動させて1つ以上の前記軟質部分に接触させて前記軟質部分を圧縮するようにさらに動作可能であり、それにより、少なくとも1つの前記半導体デバイスを1つ以上の前記軟質部分と接触させて、接合中に、少なくとも1つの前記半導体デバイスに対して接合力を加える、流体圧力発生器と、を含み、
前記封止プレートは、前記基板から離間された第1の位置と、前記封止プレートの第1の側の前記硬質部分と1つ以上の前記軟質部分とが、使用時に前記基板と接触するように構成された第2の位置と、の間で移動可能であり、それにより、前記流体圧力は、前記隔膜によって、前記封止プレートの前記硬質部分に前記基板に対して付与されるようにさらに構成されている、装置。 - 前記第2の位置において、前記封止プレートの前記第1の側の前記硬質部分は、前記プラットフォームと接触しており、かつ前記封止プレートの前記第1の側の前記軟質部分は、前記基板と接触している、請求項1に記載の装置。
- 前記封止プレートは、剛性のある前記硬質部分を形成する複数の封止インサートと、前記封止インサートに受け入れられる前記軟質部分と、を含み、前記封止インサートの各々は、前記軟質部分のうちの1つを受け入れるような寸法であり、かつ形状をしている切抜部を含む、請求項1に記載の装置。
- 前記軟質部分が接合中に圧縮されたとき、前記軟質部分を前記切抜部に固定するために、前記切抜部の底部端よりも大きな横断領域を前記切抜部に生成する段差部を、前記封止インサートの上端にさらに備える、請求項3に記載の装置。
- 前記封止インサートの各々は、前記封止インサートが前記基板と接触しているとき、別の封止インサートに対して変位可能である、請求項3に記載の装置。
- 前記封止インサートは、前記プラットフォームと前記基板との両方に同時に接触するように動作可能である、請求項3に記載の装置。
- 前記隔膜に接触するように、前記封止プレートの前記第2の側に配列された1つ以上のスタンプをさらに備え、前記スタンプまたは前記スタンプの各々は、圧力を、前記流体圧力発生器から1つ以上の前記軟質部分へと伝達するために、前記流体圧力発生器と前記隔膜との間に位置する、請求項1に記載の装置。
- 1つ以上の前記スタンプは、少なくとも前記流体圧力発生器により作用される第1の部分と、前記隔膜に接触するように動作可能な第2の部分と、をさらに備え、前記第1の部分は、前記第2の部分よりも大きな表面積を有する、請求項7に記載の装置。
- 前記スタンプは、前記スタンプから延在しているカラーをさらに含み、前記カラーは、前記スタンプがそれに沿って摺動可能なスロット内に位置する凹部の上面および底面と接触するように構成され、前記凹部は、前記カラーおよび前記スタンプの前記基板に対する動作範囲をさらに画定する、請求項7に記載の装置。
- 前記基板は、接合中に、前記プラットフォーム上で互いに離間された複数の単一化基板を備える、請求項1に記載の装置。
- 前記プラットフォームは、前記単一化基板が受け入れられる陥凹部分を含み、それにより、前記単一化基板の上面が、前記プラットフォームの上面と実質的に同じ高さにし、前記封止プレートの前記硬質部分は、前記単一化基板および前記プラットフォームと実質的に同時に接触するように構成される、請求項10に記載の装置。
- 前記陥凹部分に取り付けられる保持プレートをさらに備え、前記保持プレートは、前記陥凹部分に受け入れられる前記単一化基板を支持するための貫通孔を含む、請求項11に記載の装置。
- 前記装置は、前記基板に搭載されたさらなる1つ以上の半導体デバイスに対して接合圧力を加えるために、非可撓性の硬質ツールを組み込む硬質ツールセクションと、可撓性のある前記軟質部分を含む軟質ツールセクションと、をさらに含む、請求項1に記載の装置。
- 前記封止プレートによって加えられた圧力を測定するために、前記封止プレートに組み込まれた圧力センサをさらに備える、請求項1に記載の装置。
- 少なくとも1つの前記半導体デバイスと1つ以上の前記軟質部分との間に、前記封止プレートに隣接して位置付けられるリリースフィルムをさらに備える、請求項1に記載の装置。
- プラットフォーム上に支持された基板に対して少なくとも1つの半導体デバイスを接合する方法であって、前記方法は、
少なくとも1つの前記半導体デバイスを前記基板上に配列するステップと、
剛性のある複数の硬質部分と、前記硬質部分の間に位置する1つ以上の可撓性のある軟質部分と、を含む封止プレートを、前記基板から離間された第1の位置から、前記硬質部分と1つ以上の前記軟質部分とを含む前記封止プレートの第1の側が前記基板と接触する第2の位置へと移動させるステップと、
前記第1の側とは反対の前記封止プレートの第2の側を覆う隔膜に対して、流体圧力発生器を用いて流体圧力を生成するステップであって、前記流体圧力発生器は、前記隔膜と流体連通している、ステップと、を含み、
前記隔膜に対して加えられる前記流体圧力は、前記隔膜を作動させて前記流体圧力を前記硬質部分に前記基板に対して付与し、かつ、前記隔膜を1つ以上の前記軟質部分に接触させて前記軟質部分を圧縮し、それにより、少なくとも1つの前記半導体デバイスを1つ以上の前記軟質部分と接触させて、接合中に、少なくとも1つの前記半導体デバイスに対して接合力を加える、方法。 - 基板に対して接合される少なくとも1つの半導体デバイスを備える電子デバイスを製作する方法であって、前記方法は、
少なくとも1つの前記半導体デバイスを前記基板上に配列するステップと、
剛性のある複数の硬質部分と、前記硬質部分の間に位置する1つ以上の可撓性のある軟質部分と、を含む封止プレートを、前記基板から離間された第1の位置から、前記硬質部分と1つ以上の前記軟質部分とを含む前記封止プレートの第1の側が前記基板と接触する第2の位置へと移動させるステップと、
前記第1の側とは反対の前記封止プレートの第2の側を覆う隔膜に対して、流体圧力発生器を用いて流体圧力を生成するステップであって、前記流体圧力発生器は、前記隔膜と流体連通している、ステップと、を含み、
前記隔膜に対して加えられる前記流体圧力は、前記隔膜を作動させて前記流体圧力を前記硬質部分に前記基板に対して付与し、かつ、前記隔膜を1つ以上の前記軟質部分に接触させて前記軟質部分を圧縮し、それにより、少なくとも1つの前記半導体デバイスを1つ以上の前記軟質部分と接触させて、接合中に、少なくとも1つの前記半導体デバイスに対して接合力を加える、方法。
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004119594A (ja) | 2002-09-25 | 2004-04-15 | Canon Inc | 一括接合装置 |
WO2006082744A1 (ja) | 2005-02-02 | 2006-08-10 | Sony Chemical & Information Device Corporation | 電気部品の実装装置 |
JP2007005707A (ja) | 2005-06-27 | 2007-01-11 | Sony Corp | 部品接合方法および部品接合用治具 |
JP2009016544A (ja) | 2007-07-04 | 2009-01-22 | Panasonic Corp | 半導体素子実装装置および実装方法 |
WO2014123413A1 (en) | 2013-02-06 | 2014-08-14 | Boschman Technologies Bv | Semiconductor die encapsulation or carrier-mounting method, and corresponding semiconductor die encapsulation or carrier-mounting apparatus |
JP2014179419A (ja) | 2013-03-14 | 2014-09-25 | Alpha- Design Kk | 電子部品の接合方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU2002342490A1 (en) | 2002-07-23 | 2004-02-09 | Elmicron Ag | Method for fastening microtool components to objects |
US6821813B2 (en) * | 2002-12-19 | 2004-11-23 | Taiwan Semiconductor Manufacturing Co., Ltd. | Process for bonding solder bumps to a substrate |
DE102005058794A1 (de) | 2005-12-09 | 2007-06-14 | Semikron Elektronik Gmbh & Co. Kg | Vorrichtung und getaktetes Verfahren zur Drucksinterverbindung |
US8278142B2 (en) * | 2008-05-22 | 2012-10-02 | Texas Instruments Incorporated | Combined metallic bonding and molding for electronic assemblies including void-reduced underfill |
DE102015120156B4 (de) | 2015-11-20 | 2019-07-04 | Semikron Elektronik Gmbh & Co. Kg | Vorrichtung zur materialschlüssigen Verbindung von Verbindungspartnern eines Leistungselekronik-Bauteils und Verwendung einer solchen Vorrichtung |
NL2015895B1 (en) | 2015-12-02 | 2017-06-28 | Besi Netherlands Bv | Device and method for thermal compression bonding electronic components on a carrier. |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004119594A (ja) | 2002-09-25 | 2004-04-15 | Canon Inc | 一括接合装置 |
WO2006082744A1 (ja) | 2005-02-02 | 2006-08-10 | Sony Chemical & Information Device Corporation | 電気部品の実装装置 |
JP2007005707A (ja) | 2005-06-27 | 2007-01-11 | Sony Corp | 部品接合方法および部品接合用治具 |
JP2009016544A (ja) | 2007-07-04 | 2009-01-22 | Panasonic Corp | 半導体素子実装装置および実装方法 |
WO2014123413A1 (en) | 2013-02-06 | 2014-08-14 | Boschman Technologies Bv | Semiconductor die encapsulation or carrier-mounting method, and corresponding semiconductor die encapsulation or carrier-mounting apparatus |
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