JP2007227622A - 実装方法 - Google Patents
実装方法 Download PDFInfo
- Publication number
- JP2007227622A JP2007227622A JP2006046649A JP2006046649A JP2007227622A JP 2007227622 A JP2007227622 A JP 2007227622A JP 2006046649 A JP2006046649 A JP 2006046649A JP 2006046649 A JP2006046649 A JP 2006046649A JP 2007227622 A JP2007227622 A JP 2007227622A
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- JP
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- Prior art keywords
- pressing
- rubber
- rubbers
- substrate
- electrical components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000000034 method Methods 0.000 title claims abstract description 25
- 229920001971 elastomer Polymers 0.000 claims abstract description 313
- 239000005060 rubber Substances 0.000 claims abstract description 309
- 239000000758 substrate Substances 0.000 claims abstract description 79
- 238000003825 pressing Methods 0.000 claims description 415
- 238000002788 crimping Methods 0.000 claims description 77
- 230000001681 protective effect Effects 0.000 claims description 49
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- 239000002184 metal Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 7
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- 238000006073 displacement reaction Methods 0.000 description 4
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- 238000005259 measurement Methods 0.000 description 2
- 239000002923 metal particle Substances 0.000 description 2
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- 229920002379 silicone rubber Polymers 0.000 description 2
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- 244000043261 Hevea brasiliensis Species 0.000 description 1
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- 230000007423 decrease Effects 0.000 description 1
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- 239000005061 synthetic rubber Substances 0.000 description 1
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- 239000002699 waste material Substances 0.000 description 1
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
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Abstract
【解決手段】第一、第二の押圧ゴム15、25で基板31の表面上と裏面上の電気部品32、33が同時に押圧されるので、基板31の表面と裏面への電気部品32、33の接続を一度に行うことができる。第一、第二の押圧ゴム15、25が変形するときには、その周囲はダム部材16で囲まれているので、第一、第二の押圧ゴム15、25はダム部材16でせき止められて広がらず、電気部品32、33の位置ずれがおこらない。電気部品32、33は仮圧着時と同じ位置で基板31に接続されるので、接続信頼性の高い電気部品30aが得られる。
【選択図】図3
Description
図14(a)の符号101は従来技術の圧着装置を示しており、圧着装置101は台座126と押圧ヘッド120とを有している。
また、片面に実装済みの電気部品116、118は、もう一方の面に電気部品116、118を接続するときに再度加熱押圧されることになり、加熱押圧が繰り返されることで電気部品116、118が損傷することがあった。
請求項2記載の発明は、請求項1記載の実装方法であって、前記電気部品は、前記基板表面と前記基板の裏面に配置された異方導電性フィルムの接着力によって配置されており、前記第一、第二の押圧ゴムで前記電気部品を押圧する際には、前記異方導電性フィルムを加熱する実装方法である。
請求項3記載の発明は、請求項1又は請求項2のいずれか1項記載の実装方法であって、前記第一、第二の押圧ゴムで前記電気部品を押圧する前に、前記第一の押圧ゴムと前記圧着対象物の間と、前記第二の押圧ゴムと前記圧着対象物の間に、前記異方導電性フィルムから剥離可能な保護フィルムを配置しておく実装方法である。
第一のヘッド本体11のうち、第一の押圧ゴム15の底面と密着した部分は第一の押圧板12であり、第一の押圧板12は軸3によって駆動装置2に取り付けられ、駆動装置2を動作させ、軸3を伸縮させると、第一の押圧ゴム15の表面を略水平に向けたまま、第一の押圧板12が第一の押圧ゴム15や第一のダム部材16と一緒に鉛直方向に上下移動するように構成されている。
第二の押圧ヘッド20は金属製の押圧板からなる第二のヘッド本体21(第二の押圧板)と、第二のヘッド本体21の表面に配置された第二の押圧ゴム25とを有しており、第二の押圧ヘッド20は第二のヘッド本体21側の面が作業台9と密着し、第二の押圧ゴム25側の面が上側に向けられている。従って、第二の押圧ヘッド20の上側の面には第二の押圧ゴム25の表面が露出している。
図4(a)の符号30は圧着対象物を示しており、圧着対象物30は基板31と、異方導電性フィルム35と、電気部品32、33とを有している。
第一の押圧ヘッド10の下降を続けると、圧着対象物30と第一の押圧ゴム15とが相対的に近づく。
ここでは、第二のヘッド本体21にヒータ8が内蔵されており、ヒータ8に通電することで圧着対象物30が所定温度に加熱され、加熱によって異方導電性フィルム35の流動性が高くなっている。
従って、電気部品32、33は基板31に硬化又は固化した異方導電性フィルム35を介して機械的に固定され、電気装置30aが得られる。
第二の押圧ヘッド20の第二の押圧ゴム25が配置された側の面を下側に向けて配置し、第一の押圧ヘッド10を、第二の押圧ヘッド20の下方位置で凹部17が形成された面を上側に向けて配置し、凹部17の底面、即ち第一の押圧ゴム15の表面に圧着対象物30を配置してから、第一、第二の押圧ヘッド10、20のいずれか一方又は両方を移動させて、第一、第二の押圧ゴム15、25を相対的に近づけ、第二の押圧ゴム25の表面を圧着対象物30に押し付けてもよい。
このように、第一、第二の押圧ゴム15、25は水平方向には広がらず、広がったとしてもその広がり量は無視できる程小さいから、電気部品32、33の位置ずれが起こり難い。
図7の符号6は本発明に用いる圧着装置の第三例を示しており、この圧着装置6は第一、第二の押圧ヘッド10、60を有している。第一、第二の押圧ヘッド10、60は、第一、第二のヘッド本体11、61と、第一、第二の押圧ゴム15、65とを有している。
圧着対象物30を押圧するときの圧力は、異方導電性フィルム35や電気部品32、33の厚さや、異方導電性フィルム35の加熱温度によって設定されている。
熱硬化性樹脂と熱可塑性樹脂の種類は特に限定されないが、熱硬化性樹脂としては、エポキシ樹脂、アクリル樹脂、ウレタン樹脂等を1種類以上用いることができ、熱可塑性樹脂としては例えばフェノキシ樹脂、ポリビニルアルコール等を1種類以上用いることができる。
Claims (3)
- 第一、第二の押圧板と、
前記第一、第二の押圧板上に配置された第一、第二の押圧ゴムとを有する圧着装置の、
前記第一、第二の押圧ゴムの間に、電気部品が基板の表面と裏面にそれぞれ配置された圧着対象物を配置し、
前記第一、第二の押圧ゴムで前記電気部品を押圧し、前記各電気部品を前記基板に固定する電気部品の実装方法であって、
前記第一、第二の押圧ゴムの周囲の表面よりも高い位置にダム部材を位置させた状態で前記圧着対象物を前記第一、第二の押圧ゴムで押圧し、
前記押圧により変形する前記第一、第二の押圧ゴムの側面を前記ダム部材で堰き止める実装方法。 - 前記電気部品は、前記基板表面と前記基板の裏面に配置された異方導電性フィルムの接着力によって配置されており、
前記第一、第二の押圧ゴムで前記電気部品を押圧する際には、前記異方導電性フィルムを加熱する請求項1記載の実装方法。 - 前記第一、第二の押圧ゴムで前記電気部品を押圧する前に、前記第一の押圧ゴムと前記圧着対象物の間と、前記第二の押圧ゴムと前記圧着対象物の間に、前記異方導電性フィルムから剥離可能な保護フィルムを配置しておく請求項1又は請求項2のいずれか1項記載の実装方法。
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US12/194,796 US8048254B2 (en) | 2006-02-23 | 2008-08-20 | Mounting method |
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JP2013048292A (ja) * | 2008-07-02 | 2013-03-07 | Panasonic Corp | 基板間の接続方法、フリップチップ実装体及び基板間接続構造 |
WO2010016170A1 (ja) | 2008-08-08 | 2010-02-11 | ソニーケミカル&インフォメーションデバイス株式会社 | 圧着装置、圧着方法、実装体および押圧板 |
EP2309834A1 (en) * | 2008-08-08 | 2011-04-13 | Sony Chemical & Information Device Corporation | Compression bonding device, compression bonding method, package, and pressing plate |
EP2309834A4 (en) * | 2008-08-08 | 2011-09-14 | Sony Chem & Inf Device Corp | COMPRESSION ASSEMBLY DEVICE, COMPRESSION ASSEMBLY METHOD, HOUSING AND PRESSURE PLATE |
US8296939B2 (en) | 2008-08-08 | 2012-10-30 | Sony Chemical & Information Device Corporation | Mounting method using dilatancy fluid |
US9318353B2 (en) | 2011-04-27 | 2016-04-19 | Dexerials Corporation | Method of manufacturing connection structure |
WO2013069522A1 (ja) | 2011-11-07 | 2013-05-16 | デクセリアルズ株式会社 | 接続装置、接続構造体の製造方法、チップスタック部品の製造方法及び電子部品の実装方法 |
KR20140100488A (ko) | 2011-11-07 | 2014-08-14 | 데쿠세리아루즈 가부시키가이샤 | 접속 장치, 접속 구조체의 제조 방법, 칩 스택 부품의 제조 방법 및 전자 부품의 실장 방법 |
US9196599B2 (en) | 2011-11-07 | 2015-11-24 | Dexerials Corporation | Connection device, method for manufacturing connection structure, method for manufacturing stacked chip component and method for mounting electronic component |
JP2019083285A (ja) * | 2017-10-31 | 2019-05-30 | 株式会社村田製作所 | 回路基板、無線通信デバイス、および回路基板の作製方法 |
Also Published As
Publication number | Publication date |
---|---|
KR101004229B1 (ko) | 2010-12-24 |
KR20080098617A (ko) | 2008-11-11 |
TW200739773A (en) | 2007-10-16 |
US8048254B2 (en) | 2011-11-01 |
JP4832107B2 (ja) | 2011-12-07 |
CN101390207A (zh) | 2009-03-18 |
EP1988570A1 (en) | 2008-11-05 |
WO2007097223A1 (ja) | 2007-08-30 |
EP1988570A4 (en) | 2010-02-10 |
HK1126320A1 (en) | 2009-08-28 |
TWI376757B (en) | 2012-11-11 |
US20090038753A1 (en) | 2009-02-12 |
CN101390207B (zh) | 2011-04-27 |
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