JP4563362B2 - チップ実装法 - Google Patents
チップ実装法 Download PDFInfo
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- JP4563362B2 JP4563362B2 JP2006257284A JP2006257284A JP4563362B2 JP 4563362 B2 JP4563362 B2 JP 4563362B2 JP 2006257284 A JP2006257284 A JP 2006257284A JP 2006257284 A JP2006257284 A JP 2006257284A JP 4563362 B2 JP4563362 B2 JP 4563362B2
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- 238000000034 method Methods 0.000 title claims description 27
- 239000000758 substrate Substances 0.000 claims description 64
- 239000000853 adhesive Substances 0.000 claims description 52
- 230000001070 adhesive effect Effects 0.000 claims description 51
- 239000003795 chemical substances by application Substances 0.000 claims description 26
- 239000002245 particle Substances 0.000 claims description 24
- 230000004913 activation Effects 0.000 claims description 16
- 238000010438 heat treatment Methods 0.000 claims description 10
- 230000002706 hydrostatic effect Effects 0.000 claims description 9
- 239000010410 layer Substances 0.000 description 7
- 239000011521 glass Substances 0.000 description 6
- 238000003825 pressing Methods 0.000 description 6
- 230000008439 repair process Effects 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000011162 core material Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000002923 metal particle Substances 0.000 description 2
- 239000003094 microcapsule Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229920000768 polyamine Chemical class 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- -1 amine imides Chemical class 0.000 description 1
- HHEFNVCDPLQQTP-UHFFFAOYSA-N ammonium perchlorate Chemical compound [NH4+].[O-]Cl(=O)(=O)=O HHEFNVCDPLQQTP-UHFFFAOYSA-N 0.000 description 1
- 238000010539 anionic addition polymerization reaction Methods 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000010538 cationic polymerization reaction Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 229940042795 hydrazides for tuberculosis treatment Drugs 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 150000008442 polyphenolic compounds Chemical class 0.000 description 1
- 235000013824 polyphenols Nutrition 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/751—Means for controlling the bonding environment, e.g. valves, vacuum pumps
- H01L2224/75101—Chamber
- H01L2224/7511—High pressure chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/832—Applying energy for connecting
- H01L2224/83201—Compression bonding
- H01L2224/83209—Compression bonding applying isostatic pressure, e.g. degassing using vacuum or a pressurised liquid
Landscapes
- Wire Bonding (AREA)
Description
参考例1
(1)接着剤の作製
フェノキシ樹脂(PKHA、ユニオンカーバイド社製高分子量エポキシ樹脂)とマイクロカプセル型潜在性硬化剤を含有する液状エポキシ樹脂(ノバキュアHP−3942HP、旭化成製、エポキシ当量185)の比率を30/70とし、酢酸エチルの30重量%溶液を得た。この溶液に、粒径3±0.2μmのポリスチレン系粒子にNi/Auの厚さ0.2/0.02μmの金属被覆を形成した導電性粒子を2体積%添加し混合分散した。5mm×11mmで厚み0.8mmのガラスエポキシ基板(FR−4グレ−ド)上に、高さ18μmの銅の回路を有し、回路端部が後記するICチップのバンプピッチに対応した接続電極を有するガラスエポキシ基板の接続領域に、前記分散液をスクリ−ン印刷で塗布し、100℃で20分乾燥し、電極上の厚みが20μmの接着剤層を得た。この接着層のDSCによる活性温度は120℃である。
前記の接着剤付き基板に、ICチップ3個(高さ0.3、0.55、1.0mm)を配置し、CCDカメラによる電極の位置合わせを行った。接着剤は室温でも若干の粘着性がある状態であり、室温で接着面に押しつけることで基板に簡単に保持でき、チップの仮付け基板を得た。チップの仮付け基板を、プレッシャ−クッカ試験機の圧力釜に入れて、120℃、20kgf/mm2、10分間空気圧で処理後に室温に冷却して取出した。
(3)評価
各チップの電極と基板電極は良好に接続が可能であった。接着剤はチップ近傍のみに存在しているので、基板表面に不要接着剤はほとんどなかった。本参考例では、高さの異なるICチップ3個を基板面に接続できた。
参考例1と同様であるが、チップの仮付け基板を得た後で電極間の電気的接続を検査する中間検査工程を設けた。まず、70℃、10kgf/mm2で、スプリング装置で加圧しながら各接続点の接続抵抗をマルチメータで測定検査したところ、1個のICチップが異常であった。そこで異常チップを剥離して新規チップで前記同様の接続を行ったところ良好であった。本実施例では接着剤の硬化反応が不十分な状態なので、チップの剥離や、その後のアセトンを用いた清浄化も極めて簡単であり、リペア作業が容易であった。また、チップの周囲の余剰接着剤も同様にアセトンで簡単に除去可能であった。以上の通電検査工程およびリペア工程の後で、参考例1と同様圧力釜に入れて処理したところ、良好な接続特性を示した。接着剤の硬化後であると、チップの剥離や、その後の溶剤による清浄化が極めて困難であるが、本参考例によれば、狭い基板状に多数のチップが存在する場合も、リペア作業が極めて容易であった。
参考例1と同様であるが、図3例示のような両面基板とした。各チップの電極と基板電極は良好に接続が可能であった。なお本参考例では圧力釜の処理の際、チップの仮付け基板の下側になる面は、耐熱性の粘着テ−プでチップを接着剤面に押しつけて補強し、基板からチップ剥離のないようにした。
参考例1と同様であるが、接着剤の種類を変えた。すなわち、導電粒子を未添加とした。この場合も各チップの電極と基板電極は良好に接続が可能であった。
バンプとガラスエポキシ基板の回路端部が直接接触し、接着剤で固定されているためと見られる。
3 接着剤 4 電極A
5 電極B 6 密閉容器
7 吸排気孔 8 定盤
9 加圧型
Claims (3)
- 基板上の電極形成面とチップ電極間に導電粒子未添加であり且つ潜在性硬化剤を含む接着剤を介在させ、基板の電極とこれに相対峙するチップの電極を位置合わせし潜在性硬化剤の活性温度以下で仮接続した状態で、吸排気孔を有する密閉容器内の静水圧下において潜在性硬化剤の活性化温度以上で加熱し両電極を直接接触させ接着剤で固定し、基板上に複数個のチップを実装することを特徴とするチップ高さの異なる場合または基板の両面に実装する場合のチップ実装法。
- 基板上の電極形成面とチップ電極間に導電粒子未添加であり且つ潜在性硬化剤を含む接着剤を介在させ、基板の電極とこれに相対峙するチップの電極を位置合わせし潜在性硬化剤の活性温度以下で仮接続した状態で導通検査を行った後、吸排気孔を有する密閉容器内の静水圧下において潜在性硬化剤の活性化温度以上で加熱し両電極を直接接触させ接着剤で固定し、基板上に複数個のチップを実装することを特徴とするチップ高さの異なる場合または基板の両面に実装する場合のチップ実装法。
- 実装する基板が複数枚であることを特徴とする請求項1または2に記載のチップ実装法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006257284A JP4563362B2 (ja) | 2006-09-22 | 2006-09-22 | チップ実装法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006257284A JP4563362B2 (ja) | 2006-09-22 | 2006-09-22 | チップ実装法 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20687696A Division JP4032317B2 (ja) | 1996-08-06 | 1996-08-06 | チップ実装法 |
Publications (2)
Publication Number | Publication Date |
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JP2007019541A JP2007019541A (ja) | 2007-01-25 |
JP4563362B2 true JP4563362B2 (ja) | 2010-10-13 |
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JP2006257284A Expired - Fee Related JP4563362B2 (ja) | 2006-09-22 | 2006-09-22 | チップ実装法 |
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JP (1) | JP4563362B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP5310355B2 (ja) * | 2009-07-24 | 2013-10-09 | 住友ベークライト株式会社 | 電子部品の製造方法および電子部品 |
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- 2006-09-22 JP JP2006257284A patent/JP4563362B2/ja not_active Expired - Fee Related
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