CN101350324A - 电气部件的安装方法 - Google Patents

电气部件的安装方法 Download PDF

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CN101350324A
CN101350324A CNA2008102144331A CN200810214433A CN101350324A CN 101350324 A CN101350324 A CN 101350324A CN A2008102144331 A CNA2008102144331 A CN A2008102144331A CN 200810214433 A CN200810214433 A CN 200810214433A CN 101350324 A CN101350324 A CN 101350324A
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electric component
mentioned
chip
pressure
circuit board
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CN101350324B (zh
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松村孝
安藤尚
蟹泽士行
须贺保博
工藤宪明
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Dexerials Corp
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Sony Chemicals Corp
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    • B30—PRESSES
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Abstract

本发明提供一种能够使用粘合剂来进行高可靠性的电气部件安装的安装方法和安装装置。本发明是具有使用各向异性粘合膜(7)来将IC芯片(20)热压接到布线基板(10)上的安装方法，当进行该热压接时，以规定的压力将IC芯片(20)的顶部区域按压向布线基板(10)，另一方面以比对IC芯片(20)的顶部区域的压力小的压力来对IC芯片(20)的侧部区域进行按压。作为热压接头(4)的压接部(6)使用橡胶硬度大于等于40且小于等于80的弹性体。作为各向异性导电粘合膜(7)使用含有溶融粘度大于等于1.0×102MPa·s且小于等于1.0×105MPa·s的粘接树脂(7b)的薄膜。

Description

电气部件的安装方法
本申请是下述申请的分案申请：
发明名称：电气部件的安装方法和安装装置
国际申请日：2004年7月8日
国家申请号：200480019837.5
技术领域
本发明涉及将例如半导体芯片等电气部件安装到布线基板上的技术，特别涉及使用粘合剂来安装电气部件的技术。
背景技术
以往，作为在印刷电路板等布线基板上直接安装裸芯片的方法，公知有使用在粘合剂中分散了导电粒子的各向异性导电粘合膜的方法。
在使用了各向异性导电粘合膜的安装方法中，在粘贴了各向异性导电粘合膜的基板上搭载了IC芯片之后，用陶瓷或金属制等平坦的压接头对IC芯片加压、加热，使各向异性导电粘合膜固化，进行热压接安装。
在使用这样的金属等的压接头来进行加压、加热的方法的情况下，也有下述问题：在进行热压接时，对IC芯片周围的粘合剂的胶瘤部分加热不足而成为连接可靠性低下的原因，此外多个IC芯片的安装也较困难。
于是，近年来为了解决这些问题，提出了使用由硅橡胶等的弹性体构成的热压接头来进行IC芯片的热压接的技术。
专利文献1：特开2000-79611号公报
专利文献2：特开2002-359264号公报
但是，在这样的现有技术中，存在下述问题：由于作为IC芯片和基板的连接部分的凸块部分与图形之间的压力不足，因此不能进行充分的连接，不能充分确保初始导通电阻和老化后的连接可靠性。
发明内容
本发明是为了解决这样的现有技术的课题而作成的，其目的在于提供一种能够使用粘合剂来进行高可靠性的电气部件安装的安装方法和安装装置。
为了达成上述目的而作成的本发明是具有使用粘合剂将电气部件热压接到布线基板上的工序的电气部件安装方法，当进行该热压接时，以规定的压力将上述电气部件的顶部区域按压向上述布线基板，另一方面以比对上述顶部区域的压力小的压力来对上述电气部件的侧部区域进行按压。
再有，在本发明中，所谓“电气部件”的“侧部区域”是指IC芯片等电气部件自身的侧部和电气部件的周围的例如粘合剂部分。
在本发明中，当进行该热压接时，以规定温度对上述电气部件一侧进行加热，同时以比上述规定温度高的温度对上述布线基板一侧进行加热，这也是有效的。
此外，在本发明中，将由规定的弹性体构成的压接部按压到上述电气部件的顶部和侧部上，这也是有效的。
进而，在本发明中，作为上述热压接用的上述压接部使用橡胶硬度大于等于40且小于等于80的弹性体，这也是有效的。
另外，在本发明中，当进行该热压接时，将上述粘合剂加热成其溶融粘度为大于等于1.0×102mPa·s且小于等于1.0×105mPa·s，这也是有效的。
另外，在本发明中，作为上述粘合剂使用在粘结树脂中分散有导电粒子的各向异性导电粘合膜，这也是有效的。
另外，在本发明中，对上述电气部件的顶部区域和侧部区域同时进行按压，这也是有效的。
另一方面，本发明具备热压接头，该热压接头具有由橡胶硬度大于等于40且小于等于80的弹性体构成的压接部，该装置构成为：使上述压接部以规定的压力对配置在布线基板上的电气部件进行按压。
在本发明中，上述热压接头的压接部的厚度大于等于该电气部件的厚度，这也是有效的。
此外，在本发明中，上述热压接头的压接部的大小大于该电气部件的面积，这也是有效的。
进而，在本发明中，上述热压接头的压接部的大小大于配置有多个电气部件的区域的面积，这也是有效的。
另外，在本发明中，具有支撑该布线基板的基座，在上述基座设有加热器，这也是有效的。
在本发明方法中，当进行热压接时，以规定的压力将电气部件的顶部区域按压向布线基板，另一方面以比对顶部区域的压力小的压力来对电气部件的侧部区域进行按压，因此，能够对电气部件与布线基板的连接部分施加上足够的压力，另一方面，能够对电气部件周围的胶瘤部分也加压以便不产生空隙，由此能够使用例如各向异性导电粘合膜来进行高可靠性的IC芯片等的连接。
特别地，在本发明中，只要当进行该热压接时，以规定温度对电气部件一侧进行加热，同时利用例如设置在支撑基座上的加热器来以比上述规定温度高的温度对布线基板一侧进行加热，就能够对电气部件的周围的胶瘤部分进行充分的加热，因此能够进一步防止空隙的产生。
此外，在本发明中，只要将由规定的弹性体构成的压接部按压到电气部件的顶部和侧部上，就能够容易地对电气部件的顶部区域和侧部区域以规定的压力差来进行加压。
进而，作为压接部使用橡胶硬度大于等于40且小于等于80的弹性体，从而能够对电气部件的顶部区域和侧部区域以最佳的压力进行加压，此外，当进行该热压接时，将上述粘合剂加热成溶融粘度为大于等于1.0×102mPa·s且小于等于1.0×105mPa·s，从而能够更可靠地排除热压接时连接部分中的粘接树脂并防止空隙的产生，能够进行可靠性更高的连接。
另外，根据本发明的装置，具备热压接头，该热压接头具有由橡胶硬度大于等于40且小于等于80的弹性体构成的压接部，该装置构成为：使上述压接部以规定的压力对配置在布线基板上的电气部件进行按压，从而能够获得可进行高可靠性的连接的结构简单的安装装置。
特别地，在本发明中，在热压接头的压接部的厚度大于等于该电气部件的厚度的情况下，此外，在热压接头的压接部的大小大于该电气部件的面积的情况下，能够更可靠地对电气部件的顶部区域和侧部区域以最佳的压力进行加压。
进而，在本发明中，在热压接头的压接部的大小大于配置有多个电气部件的区域的面积的情况下，能够同时以高可靠性对多个电气部件进行连接，由此，能够大幅提高安装效率。
根据本发明，就能使用粘合剂来进行高可靠性的电气部件的安装。
附图说明
图1是表示本发明的安装装置的实施方式的主要部分和热压接工序的概略结构图。
图2是表示本发明的安装装置的实施方式的主要部分和热压接工序的概略结构图。
图3是表示本发明的其他实施方式的概略结构图。
符号的说明
1安装装置
2基座
3加热器
4热压接头
6压接部
6a压接面
7各向异性导电粘合膜(粘合剂)
7c胶瘤部分
10布线基板
20IC芯片(电气部件)
20b顶部
具体实施方式
下面，参照附图来详细说明本发明的电气部件的安装方法和安装装置的优选的实施方式。
图1和图2是表示本实施方式的安装装置的主要部分和热压接工序的概略结构图。
如图1所示，本实施方式的安装装置1具备：载放形成有布线图形10a的布线基板10的基座2、以及对设有凸块20a的IC芯片(电气部件)20进行加压及加热的热压接头4。
这里，基座2由规定的金属构成，在其内部设有加热用的加热器3。
另一方面，热压接头4具有规定的金属构成的头主体5，在其内部设有未图示的加热用的加热器。
此外，在头主体5的与基座2对置的部分形成有凹部5a，在该凹部5a，以与凹部5a密接的方式装配有由板状的弹性体构成的压接部6。
本实施方式的压接部6配置成其压接面6a水平。而且，压接部6的压接面6a构成为比IC芯片20的顶部20b的面积大。
另外，压接部6的厚度设定成大于等于IC芯片20的厚度。
另一方面，本发明并不特别限定压接部6的弹性体的种类，但从提高连接可靠性的观点出发，优选使用橡胶硬度大于等于40且小于等于80的弹性体。
橡胶硬度不到40的弹性体会有对IC芯片20的压力不充分而且初始导通电阻和连接可靠性差的不理想情况，橡胶硬度大于80的弹性体会有对胶瘤部分的压力不充分而且在粘合剂的粘接树脂中产生空隙从而连接可靠性差的不理想情况。
另外，在本说明书中，作为橡胶硬度使用根据JISS 6050的规格。
作为这样的弹性体可以使用天然橡胶、合成橡胶的任一种，但从耐热性、耐压性的观点出发优选使用硅橡胶。
为了在具有这种结构的本实施方式中进行IC芯片20的安装，如图1所示，将布线基板10配置在基座2上，在该布线基板10上载放各向异性导电粘合膜7。
该各向异性导电粘合膜7是在粘接树脂7a中分散了导电粒子7b。
再有，只要粘接树脂7a中分散的导电粒子7b的量是少量的，那么作为本发明所使用的粘合剂的溶融粘度就不会因导电粒子7b的分散的有无而受到影响。
而且，在这种各向异性导电粘合膜7上载放IC芯片20，经由未图示的保护膜，将热压接头4的压接面6a推压到IC芯片20的顶部20b上，以规定的条件进行虚压接，进而按以下条件进行主压接。
本发明中，在主压接时，以规定温度对IC芯片20一侧进行加热，同时以比上述规定温度高的温度对布线基板10一侧进行加热。
具体是控制热压接头4的加热器使压接部6的温度成为100℃左右，控制基座2的加热器3使各向异性导电粘合膜7的粘接树脂7a的温度成为压接部6的温度200℃左右。
由此，当进行该热压接时，对各向异性导电粘合膜7进行加热使其溶融粘度大于等于1.0×102mPa·s且小于等于1.0×105mPa·s。
这里，在热压接时的各向异性导电粘合膜7的溶融粘度不足1.0×102mPa·s的情况下，会有热压接时的粘接树脂7a的流动性大、产生空隙、初始导通电阻和连接可靠性差的不理想情形，在溶融粘度大于1.0×105mPa·s的情况下，会有热压接时在连接部分不能彻底排除粘接树脂7a、产生空隙、初始导通电阻和连接可靠性差的不理想情形。
再有，主压接时的压力以对每一个IC芯片100N的程度加压15秒左右。
如图2所示，在本实施方式中，通过利用由橡胶硬度大于等于40且小于等于80的弹性体构成的压接部来进行加压，从而以规定的压力将IC芯片20的顶部20b按压向布线基板10，另一方面，能够以比对顶部20b的压力小的压力来对IC芯片20的侧部的胶瘤部分7c进行按压，由此，对IC芯片20和布线基板10的连接部分能够施加足够的压力，另一方面，对IC芯片20的周围的胶瘤部分7c也能够以不产生空隙的方式来进行加压。
其结果是，根据本实施方式，就能够使用各向异性导电粘合膜7来进行高可靠性的IC芯片20等的连接。
特别地，在本实施方式中，当进行该热压接时，以规定的温度对IC芯片20一侧进行加热，同时以比该规定温度高的温度对布线基板10一侧进行加热，从而能够对IC芯片20周围的胶瘤部分7c进行充分的加热，确实防止空隙的产生。
进而，当进行热压接时，由于将粘合剂各向异性导电粘合膜7加热成其溶融粘度大于等于1.0×102mPa·s且小于等于1.0×105mPa·s，所以就能够更确实地排除热压接时连接部分中的粘接树脂7a并防止空隙的产生，能够进行可靠性更高的连接。
另一方面，根据本实施方式的安装装置1，能够得到可进行高可靠性的连接的结构简单的安装装置。
特别地，根据本实施方式，因为压接部6的厚度大于等于IC芯片20的厚度，所以能够确实地对IC芯片20的顶部的20b和侧部的胶瘤部分7c以最佳的压力进行加压。
图3是表示本发明的其他实施方式的概略结构图，以下对与上述实施方式对应部分标注同一符号并省略其详细说明。
如图3所示，本实施方式的安装装置1A与上述实施方式在下述方面存在不同，即，其构成为：压接部6的大小大于配置了多个(例如2个)例如厚度不同的IC芯片20、21的区域的面积。
在这种情况下，压接部6本身的橡胶硬度为大于等于40且小于等于80，和上述实施方式一样。
根据具有这种结构的本实施方式，能够同时以高可靠性进行多个特别是厚度不同的I C芯片20、21的连接，由此能够大幅提高安装效率。关于其他的结构以及作用效果由于与上述实施方式相同，因此省略其详细说明。
再有，本发明不限于上述实施方式，能够进行各种各样的变更。
例如，在上述实施方式中，以使用各向异性导电粘合膜来安装IC芯片的情况作为例子进行了说明，但本发明不限于此，也可以使用不含有导电粒子的粘合剂。
另外，在上述实施方式中，以安装具有凸块电极的IC芯片的情况作为例子进行了说明，但也能适用于不具有凸块电极的IC芯片。
实施例
下面，将本发明的实施例与比较例一同做详细的说明。
<实施例1>
作为布线基板，在玻璃钢基板上形成宽75μm、间距150μm的铜(Cu)图形，在其上面使用实施了镀镍金的刚性基板，作为IC芯片，准备形成有间距150μm的凸块电极的、大小6×6mm、厚度0.4mm的芯片。
而且，使用安装了由大小60×60mm、厚度10mm、橡胶硬度40的硅橡胶构成的压接部的热压接头，作为各向异性导电粘合膜，使用在溶融粘度1.0×105mPa·s的粘接树脂中分散了导电粒子的薄膜，将IC芯片热压接到布线基板上。
在这种情况下，控制基座的温度使压接部的温度为100℃、各向异性导电粘合膜的温度为200℃3，用压力100N/IC(278N/cm2)加压、加热15秒内。
<实施例2>
除了使用由橡胶硬度80的硅橡胶构成的压接部以外，其余以与实施例1相同的条件进行热压接。
<比较例1>
除了使用由橡胶硬度小于等于10的硅橡胶构成的压接部以外，其余以与实施例1相同的条件进行热压接。
<比较例2>
除了使用由橡胶硬度为120的硅橡胶构成的压接部以外，其余以与实施例1相同的条件进行热压接。
<实施例3>
除了使用在溶融粘度为1.0×102mPa·s的粘接树脂中分散有导电粒子的各向异性导电粘合膜以外，其余以与实施例1相同的条件进行热压接。
<比较例3>
除了使用在溶融粘度为5mPa·s的粘接树脂中分散有导电粒子的各向异性导电粘合膜以外，其余以与实施例1相同的条件进行热压接。
<比较例4>
除了使用在溶融粘度为1.0×109mPa·s的粘接树脂中分散有导电粒子的各向异性导电粘合膜以外，其余以与实施例1相同的条件进行热压接。
<比较例5>
除了使用厚度比IC芯片薄(0.2mm)的由硅橡胶构成的压接部以外，其余以与实施例1相同的条件进行热压接。
(评价)
对上述实施例和比较例的由压接部的橡胶硬度决定的可靠性以及由粘接树脂的溶融粘度决定的可靠性进行评价。将其结果表示在表1、2中。
[表1]
表1.由压接部的橡胶硬度决定的可靠性评价
Figure A20081021443300101
Figure A20081021443300111
(注)树脂溶融粘度＝1.0×105mPa·s
[表2]
表2.由粘接树脂的溶融粘度决定的可靠性评价
Figure A20081021443300112
(注)橡胶硬度＝40
在这种情况下，初始导通电阻通过4端子法来测定图形间的电阻值，其值不到1Ω用○表示，大于等于1Ω用×表示。
对于连接可靠性，在温度85℃、相对湿度85％的条件下，在24小时老化后进行规定曲线的回流处理(以1～4℃/S升温→150℃±10℃，30s±10s余热区→以1～4℃/S升温→峰值温度235℃±5℃，10s±1s软焊区→以1～4℃/S冷却)的电阻值不到1Ω用○表示，大于等于1Ω用×表示。
另外，关于空隙的有无，通过超声波显微镜来确认，未认定产生空隙的用○表示，认定产生空隙的用×表示。
从表1可明确看出，压接部的橡胶硬度为40的实施例1和80的实施例2初始导通电阻和连接可靠性均良好，此外也不产生空隙。
另一方面，压接部的橡胶硬度不足40的比较例1中，对IC芯片的压力不充分，初始导通电阻和连接可靠性差，橡胶硬度大于80的比较例2中，对胶瘤部分的压力不充分，在粘合剂的粘接树脂中产生空隙，连接可靠性差。
此外，各向异性导电粘合膜的粘接树脂的溶融粘度是1.0×102mPa·s的实施例3和溶融粘度是1.0×105mPa·s的实施例1的初始导通电阻和连接可靠性均良好，此外也不产生空隙。
一方面，使用溶融粘度不满1.0×102mPa·s的粘接树脂的比较例3中，热压接时粘接树脂的流动性大、产生空隙、初始导通电阻和连接可靠性差，使用溶融粘度大于1.0×105mPa·s的粘接树脂的比较例4中，进行热压接时，在连接部分不能彻底排除粘接树脂，产生空隙，初始导通电阻和连接可靠性差。
另一方面，关于使用厚度薄于IC芯片的压接部的比较例5，在胶瘤部分不能加压，产生空隙，初始导通电阻和连接可靠性差。
本发明可用于在制造例如小型电子设备时将半导体芯片等电气电子部件安装到印刷布线基板上来制作电路基板的用途中。

Claims (4)

1.一种电气部件的安装方法，将电气部件安装到布线基板上，其特征在于：
具有使用粘合剂将电气部件热压接到布线基板上的工序，
当进行该热压接时，以规定的压力将上述电气部件的顶部区域按压向上述布线基板，另一方面以比对上述顶部区域的压力小的压力来对上述电气部件的侧部区域进行按压，进而，将上述粘合剂加热成其溶融粘度为大于等于1.0×102mPa·s且小于等于1.0×105mPa·s。
2.如权利要求1所述的电气部件的安装方法，其特征在于：
当进行该热压接时，以规定温度对上述电气部件一侧进行加热，同时以比上述规定温度高的温度对上述布线基板一侧进行加热。
3.如权利要求1所述的电气部件的安装方法，其特征在于：
作为上述粘合剂使用在粘结树脂中分散有导电粒子的各向异性导电粘合膜。
4.如权利要求1所述的电气部件的安装方法，其特征在于：
对上述电气部件的顶部区域和侧部区域同时进行按压。
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US20090230171A1 (en) 2009-09-17
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US7703657B2 (en) 2010-04-27
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US20060113356A1 (en) 2006-06-01
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