WO2002042389A1 - Bande adhesive pour usinage de tranches et procedes de fabrication et d'utilisation associes - Google Patents
Bande adhesive pour usinage de tranches et procedes de fabrication et d'utilisation associes Download PDFInfo
- Publication number
- WO2002042389A1 WO2002042389A1 PCT/JP2001/010165 JP0110165W WO0242389A1 WO 2002042389 A1 WO2002042389 A1 WO 2002042389A1 JP 0110165 W JP0110165 W JP 0110165W WO 0242389 A1 WO0242389 A1 WO 0242389A1
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- Prior art keywords
- adhesive tape
- wafer
- layer
- pressure
- sensitive adhesive
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/006—Presence of polyolefin in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2453/00—Presence of block copolymer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
Definitions
- the present invention relates to an adhesive tape for processing a wafer, a method for producing the same, and a method for using the same. More specifically, in the semiconductor manufacturing process, in order to fix and hold the wafer when the wafer is cut into chips.
- the present invention relates to an adhesive tape for processing a wafer, a method of manufacturing and using the same.
- the backside of the wafer is ground and this wafer is cut into chips. After the (dicing) process, it is moved to the mounting process and mounted. In this dancing step, an adhesive tape for wafer processing is used to fix and hold the semiconductor wafer.
- UV-curable or electron-beam-curable adhesive tapes that control the adhesive force are used for this wafer processing adhesive tape. There is a problem that chips and cracks occur during cutting.
- adhesive tapes for wafer processing which have pressure-sensitive, ultraviolet or electron beam-curable adhesives, are inferior in processing stability and long-term storage stability during manufacturing. It requires an environment and has a short usable life.
- this type of adhesive tape for wafer processing if the adhesive layer deteriorates due to some fluctuation factors such as manufacturing conditions or storage conditions, defective chips due to the adhesive tape for wafer processing will occur. A large number of children were born.
- a film for a base layer is produced, then a surface treatment is applied, and a composition for an adhesive layer dissolved in a solvent is applied.
- a method of drying the solvent is used. In this method, an organic solvent is used for coating, and more energy is used in the drying step of the solvent, and the burden on the environment is large and the cost is high.
- Japanese Patent Application Laid-Open No. Hei 5-333541 discloses a method in which a groove having a predetermined depth is formed from the front side of a wafer. A method for manufacturing a semiconductor chip that is ground from the back side is disclosed.
- Japanese Patent Application Laid-Open No. 2000-62827 discloses that a groove having a notch depth shallower than the thickness of a wafer is formed from the wafer surface on which a circuit pattern is formed, and then the back surface of the wafer is ground.
- Surface protection sheet used when dividing into Definitive modulus discloses also be used for the has an adhesive layer 1. is 0 X 1 0 5 P a or more.
- Japanese Patent Application Laid-Open No. H10-224206 discloses that an adhesive having a storage elastic modulus in the range of 0 to 10 ° C. of 3 ⁇ 10 6 to: LX 1010 dyne cm 2. A holding sheet with layers is disclosed. However, during dicing, the effect of suppressing chips and cracks is determined only under very gradual evaluation conditions, where the size of chips or cracks generated in the chip is 75 m or less.
- Japanese Patent Application Laid-Open Nos. Hei 7-233334, Hei10-2985154, Japanese Patent Hei11-1136555, Hei11-1121 Japanese Patent Publication No. 19 and Japanese Patent Publication No. 11-116716 each disclose a surface protection film in which the adhesive layer contains a specific one-year-old refin copolymer.
- the adhesive layer contains a specific one-year-old refin copolymer.
- the present inventors have conducted intensive studies to solve the above-mentioned problems.
- the wafer is adhered to an adhesive tape via an adhesive layer having a specific elastic modulus in a temperature range where the wafer is processed, or an adhesive layer having a specific tand in that temperature range, and fixed and held.
- by using such a specific adhesive tape there is a possibility that the size of chips and cracks can be reduced and reduced to a level that could not be achieved with conventional adhesive tapes for wafer processing. This led to the present invention.
- an object of the present invention is to provide an adhesive tape for processing a wafer, in which the size of a chip or a crack is reduced as much as possible when the wafer is cut into chips, and the occurrence thereof can be suppressed. Furthermore, even if the wafer is processed without using special equipment, the adhesive on the wafer can be reduced because the contamination on the chip can be reduced, the long-term storage stability is excellent, and the load on the environment is small. Is to provide.
- Another object of the present invention is to provide a so-called environmentally-friendly method for producing an adhesive tape for wafer processing, which is capable of obtaining stable quality and minimizing harmful substances, wastes, energy, and the like generated in a manufacturing process. To provide.
- Another object of the present invention is to provide a method of using the pressure-sensitive adhesive tape for wafer processing which can exhibit the maximum performance. That is, the present invention relates to an adhesive tape having an adhesive layer on one surface of a base material layer, the silicon tape having a diameter of 6 inches and back-ground to a thickness of 400 m attached to the adhesive layer of the tape. The wafer is diced at a dicing speed of 70 mm / min using a dicer under a temperature range of 15 to 35 ° C, and the cutting water temperature is 20.
- an adhesive tape for wafer processing in which the number of chips having a maximum chip length or crack of 30 m or less is at least 90% or more of the total number of chips obtained from the silicon wafer.
- An adhesive tape for processing a wafer wherein the maximum length of the chip or crack of the chip is preferably 10 m or less, is a preferred embodiment of the present invention.
- the present invention also relates to an adhesive tape having an adhesive layer on one surface of a substrate layer, wherein the adhesive layer has a storage elastic modulus G ′ at 15 to 35 ° C. of 1 MPa or more.
- G ′ Storage elastic modulus
- the pressure-sensitive adhesive tape for wafer processing wherein the ratio tan, which is the ratio of the loss elastic modulus G "to the storage elastic modulus G 'at 15 to 35 ° C of the pressure-sensitive adhesive layer, is 0.05 or more, is preferably used in the present invention. It is a mode.
- the above-mentioned pressure-sensitive adhesive tape for processing a wafer, wherein the pressure-sensitive adhesive layer contains an olefin-based polymer as a main component, is a preferred embodiment of the present invention.
- the adhesive layer may be one or more of a polyolefin copolymer containing at least two types of one-year-old fins selected from a two- to twenty-one year-old olefin as main constituent units.
- the above-mentioned pressure-sensitive adhesive tape for processing a wafer, which contains a mixture of two or more kinds as a main component, is also a preferable embodiment of the present invention.
- the pressure-sensitive adhesive layer is composed of the high-olefin copolymer, a thermoplastic elastomer, and a co-oligomer of ethylene and another o-olefin, and the o-olefin copolymer forms a continuous phase.
- the above-described pressure-sensitive adhesive tape for processing a wafer, in which the thermoplastic elastomer forms a dispersed phase is also a preferred embodiment of the present invention.
- the thermoplastic elastomer is represented by the general formula A—B—A or A—B (A represents an aromatic vinyl polymer block or an olefin polymer block showing crystallinity, and B represents a gen polymer.
- the above-mentioned pressure-sensitive adhesive tape for processing a wafer which is a block copolymer represented by the following formula (5): It is.
- One of the above-mentioned copolymers of olefins is a copolymer obtained by copolymerizing propylene, 1-butene and 5-olefin having 5 to 12 carbon atoms.
- a preferred embodiment of the present invention "It is similar". ; '; : "., ⁇ ⁇ '
- the above-mentioned base material layer is composed of one or more layers, and contains an olefin-based copolymer as a main component.
- the pressure-sensitive adhesive tape has a probe force measured in accordance with the description in ⁇ Reference column of JISZ 0237 '' in a temperature range of 20 to 80 ° C, and the probe has a force of 0.01 to 1 ° C.
- the pressure-sensitive adhesive tape for wafer processing in the range of 1 N / 5 mm ⁇ is a preferred embodiment of the present invention.
- the base material layer, the pressure-sensitive adhesive layer, and 0 are formed by a coextrusion molding method.
- the present invention relates to a method for producing a pressure-sensitive adhesive tape having a base layer comprising one or more layers, and a pressure-sensitive adhesive layer laminated on one surface of the base layer, wherein the method comprises forming the base layer and the pressure-sensitive adhesive layer.
- the melt flow rate of the polymer to be melted (MFR, measured at a temperature of 230 ° C according to ASTMD 1238, at a load of 2.16 kg) is 5 to 40 g / 10 minutes, In addition, the MFR difference between adjacent layers is 10 g / 10 min or less, and the melting temperature is 2
- the present invention relates to a production method in which a multilayer die is used for molding by coextrusion at a temperature of 0 to 260 ° C. and a difference in melting temperature between adjacent layers is 30 ° C. or less.
- the present invention provides a method for bonding the above-mentioned pressure-sensitive adhesive tape for wafer processing and a wafer at 20 to 80 ° C., and then cutting the wafer into chips at 15 to 35 ° C.
- the present invention relates to a method of using an adhesive tape for processing a wafer, wherein the adhesive tape is stretched at 40 to 80 ° C., and thereafter, the chip is picked up at room temperature and peeled off from the adhesive tape.
- the wafer is a semiconductor wafer having a surface on which a circuit pattern is formed, and a method for using an adhesive tape for wafer processing in which the cutting is dicing is a preferred embodiment of the present invention. :; '
- FIG. 1 is a cross-sectional view showing one embodiment of the adhesive tape for processing a wafer of the present invention.
- FIG. 2 is a cross-sectional view showing another embodiment of the wafer processing adhesive tape of the present invention.
- FIG. 3 is a sectional view showing another embodiment of the adhesive tape for processing a wafer of the present invention.
- FIG. 4 is a cross-sectional view showing another embodiment of the wafer processing adhesive tape of the present invention.
- FIG. 5 is a cross-sectional view showing another embodiment of the wafer processing pressure-sensitive adhesive tape of the present invention.
- FIG. 6 is a cross-sectional view showing another embodiment of the wafer processing pressure-sensitive adhesive tape of the present invention.
- Fig. 7 shows the adhesive tape for wafer processing of the present invention wound up in a roll shape. It is a side view which shows the tied state.
- FIG. 8 is another side view showing a state in which the pressure-sensitive adhesive tape for wafer processing of the present invention is wound into a roll.
- Figure 9 is an external view of the chip as viewed from the adhesive tape side (upper figure), and an enlarged schematic view showing the chipped or cracked 5 (lower figure).
- FIG. 10 is an enlarged schematic view of a chip viewed from the side of the adhesive surface with respect to a chip or a crack generated in a part of a corner of the chip.
- FIG. 11 is an enlarged schematic view of a chip viewed from an adhesive surface side, with respect to a chip or a crack generated at a corner of the chip.
- Fig. 12 is a diagram showing the measurement results of the storage elastic modulus G ', the loss elastic modulus 0 ", and the tan (5 ⁇ ".) Of the adhesive layer.
- Figure '13 is an electron microscope cross-sectional photograph perpendicular to the flow direction of the adhesive layer.
- Figure 14 is a cross-sectional photograph of the electron microscope taken parallel to the flow direction of the adhesive layer.
- adhesive tape of the present invention the adhesive tape for processing a wafer of the present invention
- the production method of the present invention 20 its production method
- use of the present invention The method will be specifically described with reference to the accompanying drawings.
- FIG. 1 is a sectional view showing one embodiment of the pressure-sensitive adhesive tape of the present invention.
- the pressure-sensitive adhesive tape 10 of the present invention includes a base layer 1 and a pressure-sensitive adhesive layer 2 laminated on one surface of the base layer 1.
- the constituent components of the base material layer 1 are not particularly limited, and various thin layer products, for example, synthetic resin, paper, metal foil, natural resin, and the like can be used. Among them, in the present invention, those containing a non-halogen synthetic resin as a main component are preferable from the viewpoints of water resistance, heat resistance, ease of disposal, and the like.5 Specific examples include an olefin polymer, a polyamide, Examples include polyester, polyether, polycarbonate, and polyurethane.
- toxic gases such as sulfur oxides, nitrogen oxides, and halogen compounds represented by dioxins, for example, in the case of incineration after use, such as olefin-based polymers, polyesters, and polyesters.
- Synthetic resins made of carbon, hydrogen and oxygen, which do not generate methane, that is, synthetic resins that have a low environmental load are preferred.
- the substrate layer 1 holds and holds the wafer.It has a wide variety of characteristics to meet requirements such as strength, scalability after cutting into chips, its own productivity, and storage stability. In view of the fact that it can be given a function by compounding with other materials5, it is environmentally friendly, and when it is composed of multiple layers, it is easy to form strong adhesion to each other.
- a polymer containing an olefin polymer as a main component is particularly preferable.
- the olefin-based polymer is a polymer containing olefins in its constituent units, and may be, for example, a homopolymer of olefins or a copolymer of olefins. It may be a union, or may be a copolymer of olefin and a vinyl monomer, and is not particularly limited. Next, specific examples of such an olefin-based polymer will be described.
- Low density polyethylene ultra low density polyethylene, linear low density polyethylene, medium density polyethylene, high density polyethylene, Ultra high molecular weight polyethylene.
- Ethylene and a 3 to 12 carbon-a-olefins various vinyl compounds such as styrene, vinyl acetate, (meth) acrylic acid, (meth) acrylic acid ester, and maleic acid Copolymer. 5 In the side chain of the copolymer of ethylene and (meth) acrylic acid
- a copolymer generally called an ionomer comprising an ionic crosslinked polymer having metal ions such as Zn, Na, and K ions.
- Ndham type propylene ' Ethylene / butylene copolymer, ultra-high molecular weight polypropylene.
- Propylene and monoolefins having 4 to 12 carbon atoms various vinyl compounds such as styrene, vinyl acetate, (meth) acrylic acid, (meth) acrylic acid ester, and maleic acid Copolymer. (3) One year old refin polymer with 4 or more carbon atoms
- the term “main component” refers to a component that is contained in the largest proportion relative to other components.
- each layer can be configured to share and receive various characteristics required for the adhesive tape for wafer processing.
- the middle layer imparts elongation characteristics during application and tear resistance, and a weather stabilizer is added to provide weather resistance.
- the outermost layer has surface scratch resistance and a rolled-up protective film.
- the adjacent layer may be a layer made of any material as long as its constituent components can be firmly bonded by melt coextrusion.
- the main component of the outermost layer (surface layer) on the side opposite to the adhesive layer is an ethylene-based copolymer : coalesced. ';
- FIG. 2 is a cross-sectional view of another embodiment of the pressure-sensitive adhesive tape according to the present invention.
- the pressure-sensitive adhesive tape 10 of the present invention includes a base layer 1 composed of an intermediate layer 3 and a surface layer 4, and a pressure-sensitive adhesive layer 2 laminated on one surface of the intermediate layer 3.
- the constituent components of the intermediate layer those containing an olefin polymer as a main component are preferable. Further, the constituent components of the intermediate layer are composed of the above-mentioned olefin polymer and a thermoplastic elastomer, wherein the olefin polymer forms a continuous phase, and the thermoplastic elastomer is a dispersed phase.
- the olefin polymer forms a continuous phase
- the thermoplastic elastomer is a dispersed phase.
- the same polymer as described above is used. be able to.
- thermoplastic elastomer examples include polystyrene-based elastomer, polyolefin-based elastomer, polyamide-based elastomer, polyurethane-based elastomer, and polyester-based elastomer.
- polystyrene-based elastomers, polyolefin-based elastomers, and polyester-based elastomers are typically represented by sulfur oxides, nitrogen oxides or dioxins when incinerated after use.
- thermoplastic elastomer composed of carbon, hydrogen, and oxygen, which does not generate toxic gases such as halogenated compounds, that is, a thermoplastic elastomer having a small burden on the environment.
- B represents a gen-polymer block or an olefin polymer block obtained by hydrogenating the gen-polymer block). This is desirable because it is easy to form a phase dispersed in a continuous phase composed of a refin-based polymer.
- polystyrene-based elastomer a block copolymer of a polystyrene block serving as a hard portion (crystal portion) and a gen-based monomer polymer block serving as a soft portion or a hydrogenated weight thereof is used. Coalescence is raised. More specifically, styrene / isoprene / styrene block copolymer (SIs), styrene / butadiene / styrene block copolymer (SBS), styrene / ethylene / butylene / styrene block.
- SIs isoprene / styrene block copolymer
- SIs styrene / butadiene / styrene block copolymer
- SBS styrene / ethylene / butylene / styrene block.
- copolymers examples include styrene copolymer (SEBS) and styrene 'ethylene' propylene 'styrene block copolymer (SEPS). These may be used alone or in combination of two or more.
- SEBS styrene copolymer
- SEPS styrene 'ethylene' propylene 'styrene block copolymer
- SAEPS styrene 'ethylene' propylene 'styrene block copolymer
- the polyolefin-based elastomer a polyolefin block which forms a polymer having high crystallinity such as polyethylene or polypropylene which becomes a hard portion, and a monomer copolymer block which shows an amorphous nature which becomes a soft portion. Block copolymer.
- the polymer chain of the olefin (crystalline) ′ is a copolymer chain of ethylene and butylene (amorphous), the copolymer chain of the olefin polymer (crystalline), a block copolymer, and a polypropylene.
- FIG. 3 is a sectional view showing another embodiment of the pressure-sensitive adhesive tape according to the present invention.
- the pressure-sensitive adhesive tape 10 of the present invention comprises a base layer 1 laminated in the order of a first intermediate layer 3a, a second intermediate layer 3b, and a surface layer 4, and a first intermediate layer 3 a consisting of adhesive layer 2 laminated on one side of a
- the base material layer 1 is composed of three layers, one or two of the first intermediate layer 3a and the second intermediate layer 3b is composed of an olefin polymer forming a continuous phase, and a dispersed phase.
- the thermoplastic elastomer is a thermoplastic elastomer.
- the second intermediate layer 3b is made of a olefin polymer forming a continuous phase and a thermoplastic elastomer forming a dispersed phase.
- the middle layer 3a Has a thickness of, for example, about 10 to 200 zm, and preferably 30 to 150 ⁇ m.
- the thickness of the intermediate layer 3b is, for example, about 1 to 100 ⁇ m, preferably 5 to 50 ⁇ m.
- the intermediate layer (the first intermediate layer 3a in FIG. 3) of the base material layer which is in contact with the adhesive layer is mainly composed of one or a mixture of two or more of the above-mentioned polymers containing the olefin. It may be contained as a component.
- the intermediate layer on the side in contact with the adhesive layer is not limited to a polymer containing hyolefin, but may be an oxygen atom-containing group other than hydrocarbons, unless it bleeds out to affect the adhesive layer.
- the resin functional groups to organic in the molecule ' may contain as a secondary component 1. '' ⁇ '
- the content of the 'polymer' including the fin in the intermediate layer in contact with the pressure-sensitive adhesive layer is usually 50 to 100% by weight: degree: Is about 70 to about L00% by weight.
- the main component of the outermost surface layer 4 of the base layer 1 is preferably an olefin polymer. Among them, an ethylene / (meth) acrylic acid copolymer is preferred. In this case, the content of the ethylene- (meth) acrylic acid copolymer in the outermost surface layer 4 of the base material layer 1 is usually about 50 to 100% by weight, preferably about 50 to 100% by weight. It is about 70 to 100% by weight, and examples of the component other than the main component include a mono-olefin (co) polymer.
- the main component of the surface layer is a mixture containing an ethylene • (meth) acrylic acid copolymer and a metal ion-crosslinked resin of polyethylene • ethylene • (meth) acrylic acid copolymer.
- a polymer containing the above-mentioned monoolefin, and a polyvinyl alcohol or an ethylene / vinyl alcohol copolymer is a small amount of a reactant (stripping agent) with a chain alkyl isocyanate, and an adhesive tape having a rewinding force of 5 N / 25 mm or less can be obtained.
- the outermost layer 54 of the base material layer 1 is composed of an ethylene '(meth) acrylic acid copolymer and an ethylene' (meth) acrylic acid copolymer.
- the content ratio of the metal ion crosslinked resin in the ethylene / (meth) acrylic acid copolymer is 1 to 50% by weight, and especially 3 to 40% by weight. Is preferred.
- a release agent such as a reaction product of a polyvinyl alcohol of the same type as styrene / vinyl alcohol copolymer with a long-chain alkyl isocyanate.
- the base material layer 1 may contain various additives generally used for a base material layer of this kind of pressure-sensitive adhesive tape for wafer processing. For example, various fillers, pigments, ultraviolet absorbers, antioxidants, heat stabilizers, lubricants, etc. may be contained within a range that does not affect wafer processing or chips.
- the thickness of the base material layer 1 is preferably about 10 to 200 m, and more preferably 30 m in terms of scratch resistance, bonding workability and price. ⁇ 150 / m is preferable.
- the thickness of the intermediate layer is preferably about 10 to 200 ⁇ m, more preferably 30 to 150 zm.
- the surface layer is preferably about 1 to 100 ⁇ m, more preferably about 5 to 50 zm.
- the pressure-sensitive adhesive tape of the present invention is a laminated film having a multilayer structure of two or more layers having a base material layer and five pressure-sensitive adhesive layers laminated on one surface of the base material layer, and has a thickness of 400 m as an adherend.
- the back-ground silicon wafer with a diameter of 6 inches is then adhered to an adhesive tape for wafer processing via an adhesive layer. Thereafter, the wafer is cut by a dicer at a dicing speed of 70 mm / min in a temperature range of 15 to 35 ° C and a 10 A full cut at a cutting water temperature of 20 ° C. When cutting into a mm square size chip, the ticks are used.
- the maximum number of cracks or cracks that can be generated from the processed surface of the silicon wafer is 30; ':... M: or less, preferably 10 ° m or less. It is at least 90% or more of the total number of chips. At this level, there is almost no chip failure due to chipping or cracking during wafer processing, and it is possible to achieve a quality close to the wax fixing method.
- the incidence of rejects in the dicing process depends on the maximum length of chips or cracks, but it is reliable to set chips or cracks that do not affect the final assembled product. It is important to ensure the quality.
- the pressure-sensitive adhesive tape of the present invention even if the maximum length of a chip or a crack is set to 30 m or less, preferably 10 zm or less, as a criterion for significantly improving the reliability of the final product. Rate of passing At least 90% can be achieved.
- the standards and pass rates of the present invention are levels that satisfy both the reliability and productivity of products used in harsh environments, such as electronic devices for mopiles and IC cards as semiconductor products.
- the method for measuring the maximum length of chipping or cracking of the chip was based on the method described below.
- a 6-inch P-type silicon mirror with a back surface and a finished roughness of # 200 and a thickness of 400 zm Prepare one hundred eighty '.
- NB C—ZH2500 (size 27 HEDD) allows a specific machining speed, for example, 300 rpm rotation / min, 20 cutting speed of 70 mmZ min. For example, full cut to a depth of 30 ⁇ m.
- pressurized E measures the distance of chipping or cracking generated from chippers surface.
- FIG. 9 is an external view of a chip 20 obtained by cutting a silicon wafer into a rectangle of 3 mm square as viewed from the side of the adhesive tape.
- the lower part of Fig. 9 shows the chip 2 2 or crack generated on the straight machining surface of insert 20.
- FIG. 23 is an enlarged schematic view of the chip, as viewed from the side of the adhesive tape side, with respect to 23.
- the notch 22 indicates the portion peeled off from the chip by oblique lines, and the crack 23 indicates the crack generated in the chip and is indicated by a thick solid line.
- FIG 11 are enlarged schematic views of the chip 20 viewed from the side of the adhesive tape with respect to the notch 22 or crack 23 generated on the corner-processed surface of the chip 20. .
- the cutting direction in the same direction (horizontal) crosses the direction (vertical) perpendicular to the silicon wafer flat line, and the chipping or cracking tends to be maximum.
- FIG. 10 is an example in which the chip 22 of the coach shows a long side shape, and the chip 2 ′′: '-' .: The maximum length 24 of the chip 22 is shown. In chip 20, the distance from the vertical or horizontal machining surface of the tip of the chip is longer: the maximum length of the chip is 24.
- FIG. 11 shows an example in which a crack 23 at a part of a corner shows a continuous crack, and the maximum length 24 of the crack 23 on the chip 20 is shown.
- the adhesive layer 2 of the present invention has a storage elastic modulus G ′ of 1 MPa or more, preferably 1 to 200 MPa in the range of 15 to 35 ° C. 0 which is an environment for processing a wafer. It is. Furthermore, it is desirable that tan 5 which is a ratio of the loss elastic modulus G ′′ to the storage elastic modulus G ′ is in the range of 0.05 or more. It is possible to suppress the occurrence of chipping or cracking of the chip 5 by minimizing the occurrence rate of chipping or cracking by suppressing the amplification of the generated internal stress due to the resonance phenomenon, and to minimize the size thereof.
- the adhesive layer 2 of the adhesive tape of the present invention is laminated on one surface of the base material layer 1. It is preferable to use a polymer containing an olefin polymer as its main component. Furthermore, at least two types of monoolefins selected from mono-olefins having 2 to 12 carbon atoms are used as main unit components. — One or more types of mixtures of the orthofin copolymers Those containing as the main component are preferred.
- thermoplastic elastomer is composed of the above-mentioned monoolefin copolymer, a thermoplastic elastomer, and a copolymer of ethylene and another ⁇ -olefin, and the —olefin copolymer forms a continuous phase, and the thermoplastic elastomer contains One in which a dispersed phase is formed is preferred.
- FIG. 13 is a cross-sectional photograph perpendicular to the flow direction of the adhesive layer
- FIG. 14 is a cross-sectional photograph parallel to the flow direction of the adhesive layer.
- olefins having 2 to 12 carbon atoms examples include ethylene, propylene, 1-butene, 1-pentene, 3-methyl-l-butene, 1-hexene, and 4-methyl- 1 —Pentene, 3 —Methyl 1 —Pentene, 1 —Heptene, 1 —Octene, 1 —Decene,
- an adhesive layer containing a copolymer obtained by copolymerizing three components of propylene, 11-butene and a monoolefin having 5 to 12 carbon atoms is preferable.
- it has a structural unit composition of 10 to 85 mol% of propylene, 3 to 60 mol% of 1-butene and 10 to 85 mol% of a olefin having 5 to 12 carbon atoms.
- An adhesive layer containing a copolymer is preferred because of its excellent adhesive properties at around room temperature.
- an 'adhesive' layer containing a copolymer containing 5 to 70 mol% of the structural unit composition is preferred.
- the adhesive layer contains a copolymer obtained by copolymerizing the three components of propylene, 1-butene and 5-olefin having 5 to 12 carbon atoms, it occupies the adhesive layer.
- the content of this copolymer is usually at least 20% by weight, preferably at least 30% by weight.
- thermoplastic elastomer examples include polystyrene-based elastomer, polyolefin-based elastomer, polyamide-based elastomer, polyurethane-based elastomer, and polyester-based elastomer.
- a block copolymer as a structural element is represented by the general formula ABA or AB.
- A represents an aromatic vinyl polymer block or an olefin polymer block exhibiting crystallinity
- B represents a gen polymer block or an olefin polymer block obtained by hydrogenating the same. Is shown.
- the hard part As a polystyrene-based elastomer, the hard part (crystal part) A block copolymer of a polystyrene block to be used and a block of a gen-based monomer to be a soft portion, or a hydrogenated polymer thereof. More specifically, styrene / isoprene / styrene block copolymer (SIS), styrene / butadiene / styrene block copolymer (SBS), styrene / ethylene / butylene / styrene block copolymer Examples thereof include a polymer (SEBS) and styrene 'ethylene propylene. Styrene block copolymer (SEPS). These may be used alone or in combination of two or more.
- SIS isoprene / styrene block copolymer
- SBS styrene / butad
- a styrene-isoprene-styrene-broker copolymer is obtained by converting a styrene-based polymer block to an average molecular weight of about 1.2; The peak is converted to the average molecular weight and contains about 1000 to 300 000.
- the content ratio of the styrene polymer block / isoprene polymer block in the SIS is usually 5 to 50 Z 50 to 95, preferably 10 to 30 by weight. 70 to 90.
- Styrene-ethylene-propylene-styrene block copolymer is obtained by hydrogenating styrene-isoprene-styrene block copolymer.
- Specific examples of the SIS include those marketed by JSR Corporation under the trade name: JSR SIS or by Shell Chemical Company under the trade name: Clayton D.
- Specific examples of SEPS include those commercially available from Kuraray Co., Ltd. under the trade name of SEPTON.
- a polyolefin block which forms a polymer having high crystallinity such as polyethylene or polypropylene, which is a hard part, and an amorphous monomer which becomes a soft part are used.
- a block copolymer with a polymer block is exemplified. Specifically Is an olefin polymer chain (crystalline) '' a copolymer chain of ethylene and butylene (amorphous).
- a specific example is a product marketed by JSR Corporation as a product name: DYNAR 0 N.
- polyester elastomer is specifically mentioned as “polybutylene terephthalate”.
- the content of the thermoplastic elastomer in the pressure-sensitive adhesive layer is usually 0 to 60% by weight, preferably , 5 to 50% by weight.
- the pressure-sensitive adhesive layer 2 is formed by copolymerizing three components of a monoolefin having 2 to 12 carbon atoms.
- the pressure-sensitive adhesive layer may contain another ⁇ -olefin copolymer in addition to the ⁇ -olefin copolymer.
- the total content is preferably 50% by weight or more.
- the other one-year-old olefin copolymer a copolymer composed of at least two kinds of one-year-old olefins selected from ethylene, propylene, 1-butene and 11-hexene is preferable.
- the fin copolymer include ethylene-propylene copolymer, ethylene '1-butene copolymer, ethylene' 1-hexene copolymer, propylene 1-butene copolymer, and propylene '1-hexene Examples thereof include copolymers and 1-butene / 1-hexene copolymers.
- Specific examples of the copolymer include those commercially available from Mitsui Chemicals, Inc. under the trade name: Yuhma-1A, Tahuma-1P, and the like.
- the above-mentioned co-oligomer of ethylene and another monoolefin is a low molecular weight halo copolymer of ethylene and another monoolefin, and is a liquid at ordinary temperature.
- One-olefins having 3 to 20 carbon atoms such as 1-hexadecene, 1-octanedecene, and 4-methyl-1-pentene.
- ⁇ -olefins having 3 to 14 carbon atoms are preferable.
- This cooligomer has the following formula Having a structural unit represented by In the above formula, I or C n H 2 n + 1 ( n is a positive integer) is a hydrocarbon group represented by, x, y and P are positive integers.
- the co-oligomer usually has a number average molecular weight in the range of 100 to 100,000, preferably a number average molecular weight in the range of 200 to 500,000.
- the content of ethylene units in the co-oligomer is usually 30 to 70 mol%, preferably 40 to 60 mol%.
- the content of the cooligomer in the pressure-sensitive adhesive layer is usually 0 to 20% by weight, preferably 0 to 10% by weight. %.
- the pressure-sensitive adhesive tape of the present invention as a component of the pressure-sensitive adhesive layer, in addition to the ⁇ -olefin copolymer obtained by copolymerizing the three components of halofine having 2 to 12 carbon atoms,
- the use of the hy-refin copolymer is advantageous in that the glass transition temperature is reduced, the initial adhesive strength can be adjusted to an appropriate range, and the low-temperature adhesive property can be improved.
- the glass transition temperature becomes low. This is advantageous in that the initial adhesive strength can be adjusted to an appropriate range and the viscosity can be adjusted to an appropriate range.
- the glass transition temperature is lowered, and the initial adhesive strength is adjusted to an appropriate range. This is advantageous in that it can be adjusted and the low-temperature adhesive property can be improved.
- various sub-components other than the above-mentioned olefin copolymer, a thermoplastic elastomer, and a co-oligomer of ethylene and other olefins are further contained. May be included in a range that does not impair the object of the present invention.
- it may contain a plasticizer such as a liquid butyl rubber, and a duckfire such as a polyterpene.
- a plasticizer such as a liquid butyl rubber
- a duckfire such as a polyterpene.
- those having an adhesive functional group and an unsaturated bond cause a change in the adhesive strength with time after application (heating, pressurization, humidity, ultraviolet rays, etc.). It is preferable to adjust the type, the blending amount, and the like so as not to cause the occurrence.
- the adhesive layer of the adhesive tape of the present invention may contain various additives generally blended with the material of this kind of adhesive layer.
- it may contain various fillers, pigments, ultraviolet absorbers, antioxidants, heat stabilizers, lubricants, and the like.
- the thickness of the pressure-sensitive adhesive layer is generally about 1 to 50 zm, preferably about 5 to 30 m.
- the total thickness of the adhesive tape is usually about 30 to 200 zm, and is preferably 10 to 60 to: L8 in terms of scratch resistance, sticking workability and price. About 0 ⁇ m: ;
- the pressure-sensitive adhesive tape of the present invention has a tensile modulus in the range of 100 to 500 MPa. ''.: '' '-.
- 0 preferably falls within the range of ⁇ ⁇ / ⁇ ⁇ ⁇ ⁇ ⁇ .
- the adhesive strength of an adhesive tape is measured by sticking at 23 ° C, but in the case of the adhesive tape of the present invention, it is preferably 20 to 80 ° C in order to enhance the adhesion to an adherend. It is preferable that the heating is adjusted within the range described above.
- Probe input force is 0.01 N / 5 m
- the adhesive tape of the present invention and the wafer can be firmly adhered to each other, there is no chip fly at the time of processing the wafer, the length and occurrence rate of chips or cracks can be minimized, No adhesion It is considered that a good effect is given to the point.
- the probe tack force is 1 N / 5 mm ⁇ or less, the adhesive tape of the present invention and the chip can be easily peeled off, so that a good effect on pick-up properties is provided.
- the pressure-sensitive adhesive tape of the present invention does not require a special device in the method of curing the pressure-sensitive adhesive layer using light or an electron beam to reduce the adhesive force when peeling beer after the pressure-sensitive adhesive. Also, it is easy to peel off from the tape.
- this adhesive tape has no adhesive residue on the chip after peeling, and has no adhesion of components or the like that hinder the subsequent bonding step and molding step. .
- FIG. 4 is a cross-sectional view showing another embodiment of the pressure-sensitive adhesive tape for wafer processing according to the present invention.
- the adhesive tape 10 for wafer processing of the present invention comprises a base layer 1, an adhesive layer 2 laminated on the surface of the base layer 1, and a release tape 5 on the adhesive layer 2 side. Is provided.
- FIG. 5 is a sectional view showing another embodiment of the pressure-sensitive adhesive tape for processing a wafer according to the present invention.
- an adhesive tape for wafer processing 10 of the present invention comprises a base layer 1 composed of an intermediate layer 3 and a surface layer 4 and an adhesive layer 2 ′ laminated on the surface of the intermediate layer 3.
- the release tape 5 is provided on the adhesive layer 2 side.
- FIG. 6 is a sectional view showing another embodiment of the pressure-sensitive adhesive tape for processing a wafer according to the present invention.
- the wafer processing pressure-sensitive adhesive tape 10 of the present invention comprises a base layer 1, which is laminated in the order of a first intermediate layer 3 a, a second intermediate layer 3 b, a surface layer 4, and an intermediate layer 3.
- An adhesive layer 2 is laminated on the surface of a, and a release tape 5 is provided on the adhesive layer 2 side.
- FIG. 7 shows an adhesive tape 10 for processing a wafer according to the present invention as it is.
- FIG. 8 is a view showing a state in which the tape is wound around a roll 6 and stored.
- FIG. 8 shows a state in which a release tape 5 is adhered to the adhesive layer side of the adhesive tape 10 for wafer processing of the present invention, and wound around the roll 6 for storage. It is a figure showing the state performed.
- the release tape for example, a tape having a release layer made of a UV-curable siloxane-based crosslinking compound on a thermoplastic film is used. Since the unevenness of the release tape is transferred to the surface of the adhesive layer, a tape having a surface roughness of 1 ⁇ m or less and having smoothness is preferable.
- the thickness of the release tape should be such that it does not hinder the wrapping around the mouth, and should be as thin as possible from the viewpoint of reducing the amount of waste disposal, for example, 5 to 200 m, preferably 10 to 100 m. ⁇ : L 0 0 m.
- the method for producing the pressure-sensitive adhesive tape of the present invention includes the steps of melting and heating the base' material 'layer (the surface layer and the intermediate layer) and the material constituting the pressure-sensitive adhesive layer, and co-extrusion, thereby forming a multilayer having a predetermined thickness. It is performed by a method of manufacturing a laminated film having a structure, and is preferable because of high efficiency *, energy saving, and low cost.
- the pressure-sensitive adhesive tape of the present invention can also be produced by a method such as laminating a pressure-sensitive adhesive layer on a base material layer by melt extrusion.
- the production method of the present invention is a method for producing a pressure-sensitive adhesive tape having a substrate layer comprising one or more layers, and a pressure-sensitive adhesive layer laminated on one surface of the substrate layer.
- the melt flow rate of the polymer constituting the adhesive layer (measured at a temperature of 230 ° C and a load of 21.18 N according to MFR, ASTMD 1238) is 5 to 410 minutes.
- the MFR difference between adjacent layers is lOg / 10 minutes or less
- the melting temperature is 200 to 260 ° C
- the melting temperature difference between adjacent layers is 30 ° C
- a coextrusion molding method using a multilayer die for example, a method in which the melts of the respective layers are combined in layers beforehand, fed into a flat die, and adhered in the die (feed block method).
- the molten material is sent to another manifold in the flat die, and at a common location in the die (generally in front of the die lip entrance), the layers are joined in layers to form a single piece. .Send to the die and glue it inside the die (many-manifold method), and a method combining feed 'block method and many-manifold method.
- the thickness of each layer composed of different materials is equal. This is preferable because it has good surface properties and can form a multi-layer structure.
- the melting temperature is 200 to 260 and the difference in melting temperature between adjacent layers is 30 ° C or less, the thickness of each layer made of different materials becomes uniform, This is preferable in that a multilayer structure can be formed with good quality and no generation of foreign matter.
- the method of use of the present invention is that, after the pressure-sensitive adhesive tape for wafer processing and the wafer are pressure-bonded at 20 to 80 ° C, the wafer is cut into chips at 15 to 35 ° C, Next, the method includes a method in which the pressure-sensitive adhesive tape is expanded at 40 to 80 ° C., and thereafter, the chip is picked up at room temperature and peeled off from the pressure-sensitive adhesive tape.
- the wafer may be any general solid one.
- an insulator, glass, ceramic, hard plastic, etc. as a semiconductor, silicon, germanium, selenium, tellurium, etc .; semiconductors such as GaAs, Gap, InSb, etc.
- Binary compound semiconductor ternary compound semiconductor such as AlGaAs; A 1 G a I n A s 4-element compound semiconductor such as; S n 0 2, Z n O, etc. T i 0 2, Y 2 0 5 such as a metal oxide semiconductor, such as those made of other metal oxides Is mentioned.
- the thickness of the wafer, the number 1 0 ⁇ 111 to count mm, the area of Weha is, some 5 by the number 1 0 mm 2 ⁇
- Number 1 0 0 0 0 mm 2 can be used, shape round, square, rectangular, etc. Any of these may be used.
- the tape and the wafer By pressing the pressure-sensitive adhesive tape and the wafer according to the present invention at 20 to 80 ° C., the tape and the wafer can be closely adhered to each other without any gap, and deterioration of the tape and the wafer due to heating can be prevented. Can be. Also, when the wafer is cut into chips at 15 to 35 ° C: E, the adhesive tape can be expanded at 40 to 8.0 ° C:: '' without using special cooling or heating equipment. By doing so, it is possible to increase the chip spacing evenly from the cutting groove of the tape : 'No tearing occurs.
- the wafer is a semiconductor wafer having a circuit pattern formed on a surface thereof, and the cutting is dicing.
- the adhesive tape of the present invention forms a groove having a notch depth smaller than the wafer thickness from the surface of the semiconductor wafer on which the circuit pattern is formed, and then grinds the back surface of the semiconductor wafer. As well as reducing the thickness, it can be applied to surface protection sheets used in the backside grinding of wafers, which are ultimately divided into individual chips.
- viscoelasticity MFR
- probe tacking force temperature dependency of adhesive force
- unwinding force The length and incidence of rye, chips and cracks, chip debris, expandability, and pick-up properties were tested and evaluated by the following measurement methods.
- the measurement was carried out using a probe tack tester M0DELTM1 manufactured by Toyo Seiki Seisaku-Sho, Ltd. in accordance with the protocol test described in the reference column of JIS Z0237-1991.
- a probe tack tester M0DELTM1 manufactured by Toyo Seiki Seisaku-Sho, Ltd. in accordance with the protocol test described in the reference column of JIS Z0237-1991.
- a probe with a diameter of 5 mm was brought into contact with the adhesive surface of the test piece with a load of 10 gf for 10 seconds, and the probe was moved vertically.
- the film was peeled off at a speed of 10 mm / sec, and the required force (unit: N / 5 mm 0) was measured.
- the test was repeated for five test pieces, and the average value was expressed as the probe tack force.
- Adhesion strength measurement method described in JISZ 0 2 3 7-1 9 9 1 It measured according to. However, the test piece was stuck on the silicon mirror surface at 23 ° C, placed in an environment of 23 ° C and 50 ° C for 30 minutes, and then peeled 180 degrees against the silicon mirror surface. The adhesive strength (unit: N / 25 mm) was measured, and the temperature dependence was evaluated according to the following criteria.
- a silicon wafer P type, thickness of 400 4m, diameter of 6 inches
- Disco MDFTF-2-6-1-1H Disco MDFTF-2-6-1-1H
- DAD320 made by DISCO
- the blade NBC-ZH250, size: 27HEDD
- a chip with a scattering rate of 0.3% or less for both the 5 mm square and lmm squares is considered acceptable (indicated by ⁇ ), and only one of the 0.5 mm square and 1 mm square chips has a scattering rate of 0.3. % Or less is judged as pass (indicated by ⁇ ), and the chip size of 0.5 mm square or 1 mm square is judged as rejected (indicated by X) when the scattering rate exceeds 0.3% for both cases. . -'' ; ''''
- Chips or cracks generated from the cutting surface of the insert are shown in Fig. 9. As shown in the figure, the vertical distance from the cut surface to the tip of the chip or crack is measured as the chip or crack length, and the maximum value is the maximum chip or crack length ( ⁇ ⁇ m ). However, the length of the chip or crack generated in a part of the corner was measured by a method schematically shown in FIGS. 10 and 11.
- a silicon wafer (P-type, thick type) was passed through the adhesive tape for wafer processing, which is a test piece, at a bonding temperature that does not generate chip fly using a mounter (HS-7800 manufactured by Huggle Electronics). 400 mm in diameter and 6 inches in diameter) were fixed to a frame (MDFTF-2-6-1-H made by Disco). After that, Daisa (made by Disco) DAD320), the rotation speed of the blade (NBC-ZH-250, size: 27HEDD) is 300,000 rpm, the cutting speed is 70 mmZ, and the cutting depth is full cut.
- the cutting water volume (using constant temperature water at 20 ° C) is 1.5 L / min from 5 nozzles on the wafer surface and 1.0 LZ min from the rotating blade falling nozzle. Dicing was performed on a 3 mm square chip.
- a silicon wafer (P-type, thickness 4) was mounted on a test piece using adhesive tape for wafer processing at a bonding temperature at which chip flies did not occur, using Yuichi MOUNG (HS-7800 manufactured by Huygle Electronics).
- a diameter of 0 ⁇ m and a diameter of 6 inches was fixed to a frame (MDFTF-2-6-1-H made by Disco). After that, it is set on a dicer (DAD320 made by DISCO), and the blade (NBC-ZH-250, size: 2027HEDD) has a rotation speed of 300000 rotations / minute and a cutting speed of 70 mm.
- the depth of cut is to cut the film to a depth of 3 with a full cut.
- the amount of cutting water (using constant temperature water at 20 ° C) is 1.5 L / min from the nozzle on the wafer surface, and the rotating blade falling nozzle And 1.0 LZ min., And diced into 3 mm square chips.
- the wafer-processing adhesive tape after dicing was heated to 60 ° C, and the wafer was adhered to the adhesive.
- Straighten the tape The interval between the chips stuck on the adhesive tape was extended by pushing up to a stroke of 2 O mm with a columnar pressing tool having a diameter of 180 mm.
- the scalability is evaluated as passing if all of the following three criteria (a) to (c) are satisfied (indicated by ⁇ ), and rejecting if any one of the criteria cannot be achieved (using X) Shown).
- Criterion (a) The thickness of the adhesive tape in contact with the end of the pressing tool is 90% or more of the thickness of the non-contact portion. That is, do not neck.
- a silicon wafer (P-type, thick type) was mounted on a mounting board (HS-7800 manufactured by HYGLE ELECTRONICS) at a sticking temperature at which chip flies did not occur, through a wafer processing adhesive tape as a test piece.
- a diameter of 400 ⁇ m and a diameter of 6 inches was fixed to a frame (MDFTF-2-6-1-H made by DISCO). After that, it is set on a dicer (DISCO DAD320), and the blade (NBC-ZH-250, size: 27HEDD) has a rotation speed of 300 rpm and a cutting speed of 70 rpm.
- the depth of cut is 30 zm at a depth of 30 mm, and the amount of cutting water (using constant temperature water at 20 ° C) is 1.5 L / min from the nozzle on the wafer surface, and the rotating blade It was diced into a 3 mm square chip at 1.0 L / min from the nozzle.
- the adhesive tape of the UV curing type after die single processing, UV irradiation apparatus 6 0 seconds light using a (DISCO manufactured DUV100) was irradiated to the adhesive tape (amount of about 3 6 O mJ / cm 2) .
- the adhesive tape for wafer processing after dicing was heated to 60 ° C using a pick-and-place device (DE35, manufactured by Huigle Elect Mouth Nikus) to extend the chip spacing. After that, the capture rate (%) under the condition of picking up 0.3 seconds after pushing up the pin was investigated, and then the pickup performance was evaluated based on the standard. Three pickups of ninety-nine chips (one tray) were performed three times, and if all could be picked up, the result was passed (indicated by ⁇ ). If even one was not picked up, the result was rejected (indicated by X). (Example 1)
- each layer constituting the adhesive tape 10 The following materials were used as the material of each layer constituting the adhesive tape 10. That is, the constituents of the base material layer 1 are “propylene”, “ethylene”, 1-butene random copolymer (r—PP; ethylene component 5 mol%, 1-butene component 5 mol%) 80 weight And 20 parts by weight of styrene-ethylene-butylene-styrene block copolymer (SEBS; Tuftek TM H1052 manufactured by Asahi Kasei Kogyo Co., Ltd.).
- SEBS styrene-ethylene-butylene-styrene block copolymer
- the components constituting the adhesive layer 2 include propylene '1-butene' 4-methyl-11-pentene copolymer (PB (4-MP); 50% by mole of propylene component, 20% by mole of 1-butene component, 4 Monomethyl-1-pentene component (30 mol%) 100 parts by weight was used.
- FIG. 12 shows the results of storage elastic modulus G ′, loss elastic modulus G ′′, and tan S of the pressure-sensitive adhesive layer measured according to the method for measuring viscoelasticity.
- the MFR of each layer was adjusted by mixing the same resin of different MFR, and the adhesive layer: 15 g / 10 minutes, and the base layer: I 5 g / 10 minutes.
- the material of each layer was melted by an extruder equipped with a full light type screw.
- the molding conditions (melting temperature) are as follows: adhesive layer: 230 ° C, base layer: 230 ° C, and these two layers of molten resin are stacked in a multilayer die. (Co-extrusion temperature: 230 ° C;).
- a release tape (Toseguchi Co., Ltd., Tose Rose Separate TM SPT-18, thickness 37 ⁇ m) is provided on the adhesive layer surface, and then the tape is released. And wound it up.
- the pressure-sensitive adhesive tape thus obtained is obtained by laminating a single-layer base material layer and a pressure-sensitive adhesive layer, and providing a release tape on the pressure-sensitive adhesive layer side.
- the total thickness was 90 m.
- the obtained adhesive tape for processing wafers was 0.1 N / 5 mm ⁇ , at 4 ° C at an application temperature of 60 ° C. It was 0 ⁇ 0 1 N / 5 mm ⁇ at C 'and 0 N / 5 mm at 2: 0. ° C. 'As a result ⁇ ⁇ ⁇ 6.0. C was set to the optimal 'sticking temperature'. '.:': '':
- the unwinding force from the roll was 0. 0 S N / S S mm, and the roll was light and easy to handle.
- Table 3 shows the results of the above measurements or evaluations.
- the adhesive tape was heated to 60 ° C and attached to the wafer, and the maximum length and occurrence rate of chip fly, chipping or cracking, Table 4 shows the results of tests for chip contamination, expandability, and pick-up.
- the criterion (a) is 98%
- the criterion (b) is 400 m
- the criterion (c) is 1.1. showed that. ⁇
- 'Adhesive tape same as the material of each layer constituting 1.0, as:' Component of base layer 1: ', the same r-PP80 parts by weight as in Example 1, and: styrene A hydrogenated product of a styrene / styrene block copolymer (SEPS; Septon TM 2063 manufactured by Kuraray Co., Ltd.) was used in an amount of 20 parts by weight.
- SEPS styrene / styrene block copolymer
- As the components of the adhesive layer 2 5 parts by weight of PB (4-MP) 95 as in Example 1 and a co-oligomer of ethylene and —olefin (LEO; LUCANT TM HC manufactured by Takai Chemical Co., Ltd.) 20) 5 parts by weight.
- Table 3 shows the three points at, 35 ° C.
- an adhesive tape was formed in the same manner as in Example 1, and a release tape (Toseguchi Separation TM SPT-18, manufactured by Toseguchi Co., Ltd., thickness: 37 mm) was used. After being provided on the surface of the adhesive layer, it was slit and wound up.
- a release tape Toseguchi Separation TM SPT-18, manufactured by Toseguchi Co., Ltd., thickness: 37 mm
- Tables 3 and 4 show the measurement and evaluation results of the obtained adhesive tape for wafer processing.
- Example 3 Low-density polyethylene (LDPE; density: 0.92 g / cm 3 ) was used as a component of the surface layer 4 of the base layer 1 as a material of each layer constituting the adhesive tape 10.
- LDPE Low-density polyethylene
- Example 3 Low-density polyethylene (LDPE; density: 0.92 g / cm 3 ) was used as a component of the surface layer 4 of the base layer 1 as a material of each layer constituting the adhesive tape 10.
- LDPE Low-density polyethylene
- a hydrogenated product of a styrene block copolymer (SEPS; Septon TM 2063 manufactured by Kuraray Co., Ltd.) was used in an amount of 20 parts by weight.
- SEPS styrene block copolymer
- PB 4-MP
- LEO styrene / isoprene / styrene block copolymer
- the adhesive layer tape was formed in the same manner as in Example 1 except that the surface layer, the intermediate layer, and the co-extrusion temperature were set to 2.2′ ⁇ . ° ⁇ .
- Tables 3 and 4 show the measurement and evaluation results of the obtained adhesive tape for wafer processing.
- each layer constituting the adhesive tape 10 0 of the base layer 1
- the same LDPE as in Example 3 was used as a component of the surface layer 4, and a component of the intermediate layer 3 of the base layer 1 was used as Example 1.
- the same PB (4-MP) as 650 parts by weight, SIS 15 parts by weight, LEO 5 parts by weight, and the ethylene propylene copolymer (EP —A: Density 0 ⁇ 87 g / cm 3 ) 20 parts by weight was used.
- Ri by the conditions shown in Table 1, by forming a pressure-sensitive adhesive tape in the same manner as in Example 1, the release tape (Higashiseguchi Co., Toserosepare Isseki TM
- Tables 3 and 4 show the measurement and evaluation results of the obtained adhesive tape for wafer processing.
- each layer constituting the adhesive tape 10 As a material of each layer constituting the adhesive tape 10, as a component of the surface layer 4 of the base layer 1, 95 parts by weight of the same LDPE as in Example 3 and a metal oxide of an ethylene / methacrylic acid copolymer , 'On' cross-linked resin (Ionoma ';Mitsui' High Milan TM 1 manufactured by Dupont Polychemicals Co., Ltd.
- Tables 3 and 4 show the measurement and evaluation results of the obtained adhesive tape for wafer processing.
- the material of each layer constituting the adhesive tape 10 is the base layer 1
- 5 parts by weight of LDPE same as in Example 5 5 parts by weight of ionomer, ethylene / methacrylic acid copolymer (EMAA; Mitsui's Nuclear TM manufactured by Dupont Polychemica Nore Co., Ltd.) N 110 C) 10 parts by weight was used.
- the components of the intermediate layer 3 of the base material layer 60 parts by weight of the above LDPE, 20 parts by weight of EMAA, and 20 parts by weight of EP-A as in Example 4 were used.
- As the components of the adhesive layer 2 40 parts by weight of PB (4-MP), 30 parts by weight of EP-A, 20 parts by weight of SIS, and 10 parts by weight of LEO were used as in Example 4.
- PB (4-MP) 5 parts by weight of ethylene / methacrylic acid copolymer
- EP-A ethylene / methacrylic acid copolymer
- each layer constituting the adhesive tape 10 As a material of each layer constituting the adhesive tape 10, the same LDPE as in Example 3 was used as a component of the surface layer 4 of the base material layer 1, and a component of the intermediate layer 3 of the base material layer 1 was used as in Example 4. The same HSBR (15 parts by weight) and the same r-PP (85 parts by weight) as in Example 1 were used. As a component of the adhesive layer 2, 50 parts by weight of PB (4-MP), 30 parts by weight of EP-A, and 20 parts by weight of CECB same as in Example 5 were used.
- a pressure-sensitive adhesive tape was formed in the same manner as in Example 1, and a release tape (manufactured by Higashi Seguchi Co., Ltd., TOCELOSPARE ISETSU TM SPT-18, thickness 37 m) was provided on the surface of the adhesive layer, and then slit and wound.
- a release tape manufactured by Higashi Seguchi Co., Ltd., TOCELOSPARE ISETSU TM SPT-18, thickness 37 m
- Table 3 and Table 3 show the measurement and evaluation results of the obtained adhesive tape for wafer processing. See Figure 4. (Example 8)
- each layer constituting the adhesive tape 10 As a material of each layer constituting the adhesive tape 10, the same LDPE as in Example 3 was used as a component of the surface layer 4 of the base layer 1, and a component of the intermediate layer 3 of the base layer 1 was used as the component of Example 1. 90 parts by weight of r-PP and 10 parts by weight of CEBC as in Example 5 were used. As the components of the adhesive layer 2, 40 parts by weight of PB (4-MP), 5 parts by weight of EP-A, 20 parts by weight of SIS and 5 parts by weight of LEO5 were used as in Example 4.
- each layer constituting the adhesive tape 10 As a material of each layer constituting the adhesive tape 10, as a component of the 20 surface layer 4 and the first intermediate layer 3a of the base layer 1, 90 parts by weight of LDPE same as in Example 6, and 10 parts by weight of EMAA was used. As the components of the second intermediate layer 3b of the base material layer 1, the same r-PP60 parts by weight and 40 parts by weight of HSBR as in Example 7 were used. As the components of the adhesive layer 2, the same PB (4-MP) 85 parts by weight, SIS 1025 parts by weight, and LEO 5 parts by weight as in Example 3 were used.
- each layer constituting the adhesive tape 10 As a material of each layer constituting the adhesive tape 10, the same LDPE as in Example 3 was used as a component of the surface layer 4 and the first intermediate layer 3 a of the base layer 1, and the second layer of the base layer 1 was used. 60 parts by weight of linear low-density polyethylene (LLDPE; density: 0.94 gZ cm 3 ) and ethylene'vinyl acetate copolymer (EVA; Mitsui'de 10 DuPont Polychemicals) as components of the intermediate layer 3b Evaflex TM P-14- 7)-: '40 parts by weight '. As the component of the adhesive layer 2, LEO '5' part by weight was used, such as 80 parts by weight of ⁇ 4- ( ⁇ -) ⁇ , 15 parts by weight of CEBC, and the like.
- LEO '5' part by weight As the component of the adhesive layer 2, LEO '5' part by weight was used, such as 80 parts by weight of ⁇ 4- ( ⁇ -) ⁇ , 15 parts
- an adhesive tape 15 was formed in the same manner as in Example 1, and a release tape (manufactured by Higashi Seguchi Co., Ltd., Tocerosepare TM SPT-18, thickness 31 j) was used. After being provided on the surface of the adhesive layer, it was slit and wound up.
- a release tape manufactured by Higashi Seguchi Co., Ltd., Tocerosepare TM SPT-18, thickness 31 j
- Tables 3 and 4 show the measurement and evaluation results of the obtained adhesive tape for wafer processing.
- EMMA Ethylene-methyl methacrylate copolymer
- methyl methacrylate component content 10% by weight, melting point: 100 ° C
- a thickness of 8 was used as the base layer of the adhesive tape.
- an acrylic copolymer a copolymer of n-butyl acrylate and acrylic acid
- a urethane acrylate having a molecular weight of 800 120 parts by weight of triglyceride, 1 part by weight of curing agent (diisocyanate type), and 1 part by weight of ultraviolet ray curing initiator (benzophenone type): 5 parts by weight, etc.
- the composition was applied so as to have a thickness of 10 zm ; thus, a pressure-sensitive adhesive tape was obtained. Tables 3 and 4 show the measurement and evaluation results of this adhesive tape.
- an ethylene / methyl methacrylate copolymer (EMMA; methyl methacrylate component content: 10% by weight, melting point: 100 °) with a thickness of 140 ⁇ m C)
- an acrylic copolymer (copolymer of n-butyl acrylate and acrylic acid) of 100 parts by weight and a urethane acrylate having a molecular weight of 800 as an adhesive layer.
- Tables 3 and 4 show the measurement and evaluation results of this adhesive tape.
- Example 1 60 0 3 0 ⁇ oom 2 40 o 4 oo ⁇ o
- Example 3 20 o 8 oooo
- Example 4 20 o 10 oooo
- Example 5 20 23 o 0 0.
- Example 6 h 0 0 1 ⁇ ⁇ ⁇
- Example 7 20 0 16 16 0 o ⁇ 0
- Example 8 20 o 20 0 ooom 9 20 0 g 0 ooo Example 10 20 O 6 0 ooo Comparative Example 1 20 X 40 35 X X Comparative Example 2 20 ⁇ > 50 90 o ⁇ X Comparative Example 3 20 ⁇ > 50 60 X o X Comparative Example 4 20 ⁇ > 50 100 o X ⁇ Comparative Example 5 20 mm> 50 100 ooo
- the adhesive tape for wafer processing of the present invention can reduce the size of chips and cracks of the wafer to 30 m or less and reduce the incidence thereof during the cutting process by dicing the wafer. In addition, it is possible to suppress the occurrence of chip defects during processing. In addition, since the wafer can be fixedly held with a low propellant force, cutting can be performed without specially using a special device such as a light or electron beam curing device.
- the pressure-sensitive adhesive tape of the present invention having a multilayer structure with good uniformity of thickness and surface property of each layer made of different materials and less generation of foreign matter can be produced in a simple manufacturing process. : Can be manufactured with good properties.
- the chip can be peeled from the pressure-sensitive adhesive tape of the present invention without using a special device for reducing the adhesive strength.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Dicing (AREA)
- Laminated Bodies (AREA)
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP01997530A EP1347025B1 (en) | 2000-11-22 | 2001-11-21 | Use of a wafer processing adhesive tape |
US11/003,373 US7358158B2 (en) | 2000-11-22 | 2004-12-06 | Wafer machining adhesive tape, and its manufacturing method and using method |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000-356807 | 2000-11-22 | ||
JP2000356807A JP4780828B2 (ja) | 2000-11-22 | 2000-11-22 | ウエハ加工用粘着テープ及びその製造方法並びに使用方法 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10181726 A-371-Of-International | 2001-11-21 | ||
US11/003,373 Division US7358158B2 (en) | 2000-11-22 | 2004-12-06 | Wafer machining adhesive tape, and its manufacturing method and using method |
Publications (1)
Publication Number | Publication Date |
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WO2002042389A1 true WO2002042389A1 (fr) | 2002-05-30 |
Family
ID=18828980
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2001/010165 WO2002042389A1 (fr) | 2000-11-22 | 2001-11-21 | Bande adhesive pour usinage de tranches et procedes de fabrication et d'utilisation associes |
Country Status (6)
Country | Link |
---|---|
US (2) | US20030054643A1 (ja) |
EP (1) | EP1347025B1 (ja) |
JP (1) | JP4780828B2 (ja) |
CN (1) | CN1333030C (ja) |
TW (1) | TW574341B (ja) |
WO (1) | WO2002042389A1 (ja) |
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Also Published As
Publication number | Publication date |
---|---|
US20030054643A1 (en) | 2003-03-20 |
CN1395602A (zh) | 2003-02-05 |
US7358158B2 (en) | 2008-04-15 |
EP1347025A4 (en) | 2005-04-06 |
CN1333030C (zh) | 2007-08-22 |
EP1347025A1 (en) | 2003-09-24 |
TW574341B (en) | 2004-02-01 |
JP4780828B2 (ja) | 2011-09-28 |
JP2002155249A (ja) | 2002-05-28 |
US20050153127A1 (en) | 2005-07-14 |
EP1347025B1 (en) | 2007-02-14 |
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