SG11201509734YA - Semiconductor wafer protective film and method of manufacturing semiconductor device - Google Patents
Semiconductor wafer protective film and method of manufacturing semiconductor deviceInfo
- Publication number
- SG11201509734YA SG11201509734YA SG11201509734YA SG11201509734YA SG11201509734YA SG 11201509734Y A SG11201509734Y A SG 11201509734YA SG 11201509734Y A SG11201509734Y A SG 11201509734YA SG 11201509734Y A SG11201509734Y A SG 11201509734YA SG 11201509734Y A SG11201509734Y A SG 11201509734YA
- Authority
- SG
- Singapore
- Prior art keywords
- protective film
- semiconductor device
- wafer protective
- semiconductor wafer
- manufacturing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/10—Esters
- C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/10—Homopolymers or copolymers of methacrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/14—Semiconductor wafers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1808—C8-(meth)acrylate, e.g. isooctyl (meth)acrylate or 2-ethylhexyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
- C09J2301/162—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer the carrier being a laminate constituted by plastic layers only
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
- C09J2433/006—Presence of (meth)acrylic polymer in the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
- H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013113448 | 2013-05-29 | ||
PCT/JP2014/063577 WO2014192630A1 (en) | 2013-05-29 | 2014-05-22 | Semiconductor wafer protection film and production method for semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201509734YA true SG11201509734YA (en) | 2015-12-30 |
Family
ID=51988663
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201509734YA SG11201509734YA (en) | 2013-05-29 | 2014-05-22 | Semiconductor wafer protective film and method of manufacturing semiconductor device |
Country Status (8)
Country | Link |
---|---|
US (1) | US9966297B2 (en) |
EP (1) | EP3007212B1 (en) |
JP (1) | JP6051302B2 (en) |
KR (1) | KR101817411B1 (en) |
CN (1) | CN105247661B (en) |
SG (1) | SG11201509734YA (en) |
TW (1) | TWI624526B (en) |
WO (1) | WO2014192630A1 (en) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10438831B2 (en) * | 2014-06-18 | 2019-10-08 | Lintec Corporation | Base film for dicing sheets and dicing sheet |
JP2016033953A (en) * | 2014-07-31 | 2016-03-10 | 日立化成株式会社 | Temporarily fixing resin composition, temporarily fixing resin film and temporarily fixing resin film sheet |
SG11201706108UA (en) * | 2015-01-30 | 2017-08-30 | Lintec Corp | Adhesive sheet for semiconductor processing |
US10340172B2 (en) * | 2015-07-03 | 2019-07-02 | Mitsui Chemicals Tohcello, Inc. | Semiconductor wafer surface protection film and method for manufacturing semiconductor device |
JP6570942B2 (en) * | 2015-09-18 | 2019-09-04 | 株式会社ディスコ | Dividing device and wafer dividing method |
US10913248B2 (en) * | 2015-11-26 | 2021-02-09 | Showa Denko Materials Co., Ltd. | Method for manufacturing electronic component, resin composition for temporary fixing, resin film for temporary fixing, and resin film sheet for temporary fixing |
JP6839925B2 (en) * | 2016-03-16 | 2021-03-10 | リンテック株式会社 | Semiconductor processing sheet |
JP6200611B1 (en) * | 2016-03-17 | 2017-09-20 | 古河電気工業株式会社 | Semiconductor wafer processing adhesive tape, semiconductor wafer processing adhesive tape manufacturing method, and semiconductor wafer processing method |
KR102167491B1 (en) * | 2016-03-31 | 2020-10-19 | 미쓰이 가가쿠 토세로 가부시키가이샤 | Adhesive film for semiconductor device manufacturing and method for manufacturing semiconductor device |
TW201901847A (en) * | 2017-05-11 | 2019-01-01 | 日商三井化學東賽璐股份有限公司 | Parts manufacturing tool and part manufacturing method |
US10090177B1 (en) * | 2017-08-25 | 2018-10-02 | Micron Technology, Inc. | Cold fluid semiconductor device release during pick and place operations, and associated systems and methods |
JP6859493B2 (en) * | 2019-03-27 | 2021-04-14 | 三井化学東セロ株式会社 | Sticking device |
US20210210440A1 (en) * | 2020-01-08 | 2021-07-08 | Texas Instruments Incorporated | Integrated circuit with metal stop ring outside the scribe seal |
WO2022009940A1 (en) * | 2020-07-10 | 2022-01-13 | 三井化学東セロ株式会社 | Protective film and back grinding method for semiconductor wafer |
Family Cites Families (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2601956B2 (en) | 1991-07-31 | 1997-04-23 | リンテック株式会社 | Removable adhesive polymer |
JP3012060B2 (en) * | 1991-11-14 | 2000-02-21 | 古河電気工業株式会社 | Adhesive tape for fixing semiconductor wafers |
JP4780828B2 (en) * | 2000-11-22 | 2011-09-28 | 三井化学株式会社 | Adhesive tape for wafer processing, method for producing the same and method for using the same |
JP2004043760A (en) * | 2001-08-27 | 2004-02-12 | Hitachi Chem Co Ltd | Adhesive sheet, semiconductor device, and production method for the sheet |
CN1916097B (en) * | 2001-08-27 | 2010-05-12 | 日立化成工业株式会社 | Adhesive sheet and semiconductor device and process for producing the same |
JP4271409B2 (en) * | 2002-05-22 | 2009-06-03 | リンテック株式会社 | Processing method for brittle materials |
JP4566527B2 (en) * | 2003-08-08 | 2010-10-20 | 日東電工株式会社 | Re-peelable adhesive sheet |
JP4776188B2 (en) * | 2004-08-03 | 2011-09-21 | 古河電気工業株式会社 | Semiconductor device manufacturing method and wafer processing tape |
JP5318324B2 (en) * | 2005-12-06 | 2013-10-16 | 東京応化工業株式会社 | Lamination method of support plate |
JP4849993B2 (en) * | 2006-08-14 | 2012-01-11 | 日東電工株式会社 | Adhesive sheet, method for producing the same, and method for cutting laminated ceramic sheet |
EP1921120B1 (en) * | 2006-11-10 | 2011-04-20 | Nitto Denko Corporation | Self-rolling laminated sheet and self-rolling pressure-sensitive adhesive sheet |
JP2009177033A (en) | 2008-01-25 | 2009-08-06 | Furukawa Electric Co Ltd:The | Circuit element forming method |
GB0904582D0 (en) * | 2008-09-24 | 2009-04-29 | Lumina Adhesives | Switchable adhesives |
JP5501060B2 (en) | 2009-04-02 | 2014-05-21 | 日東電工株式会社 | Method for laminating adhesive sheet for protecting semiconductor wafer, and adhesive sheet for protecting semiconductor wafer used in this laminating method |
US8871609B2 (en) * | 2009-06-30 | 2014-10-28 | Taiwan Semiconductor Manufacturing Company, Ltd. | Thin wafer handling structure and method |
JP5406110B2 (en) * | 2010-04-20 | 2014-02-05 | 日東電工株式会社 | Adhesive sheet for semiconductor wafer processing |
WO2011152045A1 (en) * | 2010-06-02 | 2011-12-08 | 三井化学東セロ株式会社 | Sheet for protecting surface of semiconductor wafer, semiconductor device manufacturing method and semiconductor wafer protection method using sheet |
JP5419226B2 (en) * | 2010-07-29 | 2014-02-19 | 日東電工株式会社 | Flip chip type film for semiconductor back surface and use thereof |
JP2012052038A (en) * | 2010-09-01 | 2012-03-15 | Nitto Denko Corp | Temporary fixing sheet for manufacturing process of electronic part |
JP5348147B2 (en) | 2011-01-11 | 2013-11-20 | 信越化学工業株式会社 | Temporary adhesive composition and method for producing thin wafer |
JP2012184369A (en) | 2011-03-08 | 2012-09-27 | Nitto Denko Corp | Self-adhesive tape or sheet |
JP5472206B2 (en) * | 2011-05-30 | 2014-04-16 | 東洋紡株式会社 | adhesive |
JP5872798B2 (en) * | 2011-06-14 | 2016-03-01 | 日東電工株式会社 | Re-peeling adhesive tape and method for producing the same |
WO2013006865A2 (en) * | 2011-07-07 | 2013-01-10 | Brewer Science Inc. | Methods of transferring device wafers or layers between carrier substrates and other surfaces |
JP5975621B2 (en) | 2011-11-02 | 2016-08-23 | リンテック株式会社 | Dicing sheet and semiconductor chip manufacturing method |
WO2013088686A1 (en) * | 2011-12-14 | 2013-06-20 | 三井化学株式会社 | Adhesive resin composition, laminate body, and self-peeling method |
JP2013181063A (en) * | 2012-02-29 | 2013-09-12 | Nitto Denko Corp | Self-rolling adhesive film |
JP5739372B2 (en) * | 2012-04-25 | 2015-06-24 | 信越化学工業株式会社 | Adhesive composition, adhesive sheet using the same, semiconductor device protecting material, and semiconductor device |
JP6059631B2 (en) * | 2012-11-30 | 2017-01-11 | 信越化学工業株式会社 | Wafer processing body, wafer processing member, wafer processing temporary adhesive, and thin wafer manufacturing method |
CN104756237A (en) * | 2012-12-28 | 2015-07-01 | 琳得科株式会社 | Dicing-sheet substrate film and dicing sheet |
-
2014
- 2014-05-22 CN CN201480030286.6A patent/CN105247661B/en active Active
- 2014-05-22 EP EP14805148.5A patent/EP3007212B1/en active Active
- 2014-05-22 JP JP2015519819A patent/JP6051302B2/en active Active
- 2014-05-22 KR KR1020157034911A patent/KR101817411B1/en active IP Right Grant
- 2014-05-22 US US14/894,879 patent/US9966297B2/en active Active
- 2014-05-22 SG SG11201509734YA patent/SG11201509734YA/en unknown
- 2014-05-22 WO PCT/JP2014/063577 patent/WO2014192630A1/en active Application Filing
- 2014-05-28 TW TW103118654A patent/TWI624526B/en active
Also Published As
Publication number | Publication date |
---|---|
KR101817411B1 (en) | 2018-01-10 |
JP6051302B2 (en) | 2016-12-27 |
TW201446933A (en) | 2014-12-16 |
CN105247661B (en) | 2018-09-21 |
US9966297B2 (en) | 2018-05-08 |
EP3007212A4 (en) | 2017-05-03 |
KR20160003865A (en) | 2016-01-11 |
CN105247661A (en) | 2016-01-13 |
US20160133500A1 (en) | 2016-05-12 |
WO2014192630A1 (en) | 2014-12-04 |
EP3007212A1 (en) | 2016-04-13 |
EP3007212B1 (en) | 2022-04-13 |
TWI624526B (en) | 2018-05-21 |
JPWO2014192630A1 (en) | 2017-02-23 |
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