SG11201605303XA - Silicon wafer pre-alignment device and method therefor - Google Patents

Silicon wafer pre-alignment device and method therefor

Info

Publication number
SG11201605303XA
SG11201605303XA SG11201605303XA SG11201605303XA SG11201605303XA SG 11201605303X A SG11201605303X A SG 11201605303XA SG 11201605303X A SG11201605303X A SG 11201605303XA SG 11201605303X A SG11201605303X A SG 11201605303XA SG 11201605303X A SG11201605303X A SG 11201605303XA
Authority
SG
Singapore
Prior art keywords
silicon wafer
alignment device
method therefor
wafer pre
therefor
Prior art date
Application number
SG11201605303XA
Inventor
Weiwang Sun
Gang Wang
Chunxia Huang
Songli Hu
Jie Jiang
Ruzhan Lu
Jiyuan Mou
Original Assignee
Shanghai Microelectronics Equi
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201310752191.2A external-priority patent/CN104752297B/en
Priority claimed from CN201410367501.3A external-priority patent/CN105336654B/en
Application filed by Shanghai Microelectronics Equi filed Critical Shanghai Microelectronics Equi
Publication of SG11201605303XA publication Critical patent/SG11201605303XA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/22—Connection or disconnection of sub-entities or redundant parts of a device in response to a measurement
SG11201605303XA 2013-12-31 2014-12-26 Silicon wafer pre-alignment device and method therefor SG11201605303XA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN201310752191.2A CN104752297B (en) 2013-12-31 2013-12-31 A kind of TSV silicon wafer pre-alignment devices and its method
CN201410367501.3A CN105336654B (en) 2014-07-29 2014-07-29 A kind of prealignment device for adapting to kinds of processes type silicon chip
PCT/CN2014/095105 WO2015101220A1 (en) 2013-12-31 2014-12-26 Silicon wafer pre-alignment device and method therefor

Publications (1)

Publication Number Publication Date
SG11201605303XA true SG11201605303XA (en) 2016-08-30

Family

ID=53493211

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201605303XA SG11201605303XA (en) 2013-12-31 2014-12-26 Silicon wafer pre-alignment device and method therefor

Country Status (7)

Country Link
US (1) US10276418B2 (en)
EP (1) EP3091567B1 (en)
JP (1) JP6268297B2 (en)
KR (1) KR101882823B1 (en)
SG (1) SG11201605303XA (en)
TW (1) TWI533428B (en)
WO (1) WO2015101220A1 (en)

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DE102015219810A1 (en) * 2015-10-13 2017-04-13 Dr. Johannes Heidenhain Gmbh X-Y table with a position measuring device
US10692227B2 (en) 2017-01-05 2020-06-23 Kla-Tencor Corporation Determination of sampling maps for alignment measurements based on reduction of out of specification points
CN109725506B (en) * 2017-10-31 2020-11-13 上海微电子装备（集团）股份有限公司 Substrate pre-alignment method and device and photoetching machine
KR102450580B1 (en) 2017-12-22 2022-10-07 삼성전자주식회사 Semiconductor Device having a Structure for Insulating Layer under Metal Line
CN110349878A (en) * 2018-04-02 2019-10-18 锡宬国际有限公司 Slim wafer communication front-end equipment and the slim wafer front end processing method for applying it
KR101921021B1 (en) * 2018-04-06 2018-11-21 (주)이즈미디어 Rotating inspector for camera module
CN108615699B (en) * 2018-05-29 2023-11-07 深圳信息职业技术学院 Wafer alignment system and method and optical imaging device for wafer alignment
US10790237B2 (en) * 2018-09-14 2020-09-29 Lam Research Corporation Fiducial-filtering automatic wafer centering process and associated system
CN110943021B (en) * 2018-09-21 2022-05-31 上海微电子装备（集团）股份有限公司 Pre-alignment device and method
CN111312611B (en) * 2018-12-11 2022-09-30 武汉新芯集成电路制造有限公司 Wafer bonding method, control unit and system
US10867822B1 (en) 2019-07-26 2020-12-15 Yaskawa America, Inc. Wafer pre-alignment apparatus and method
US20220005721A1 (en) * 2020-07-02 2022-01-06 Mpi Corporation Method of aligning wafer
US11263755B2 (en) * 2020-07-17 2022-03-01 Nanya Technology Corporation Alert device and alert method thereof
CN114582780B (en) * 2022-03-01 2022-12-23 江苏京创先进电子科技有限公司 Method and device for removing ring of Taiko wafer
CN114373693B (en) * 2022-03-22 2022-06-03 广州粤芯半导体技术有限公司 Method for improving scanning success rate of Taiko wafer at position of loading table of machine table
CN117038548B (en) * 2023-10-08 2024-02-13 内蒙古晶环电子材料有限公司 Wafer slicing device and wafer detection method

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JPS63100723A (en) 1986-10-17 1988-05-02 Nikon Corp Alignment device
JPH0645226A (en) 1992-07-24 1994-02-18 Canon Inc Positioning apparatus and manufacture of semiconductor device using the same
JPH113853A (en) 1997-06-10 1999-01-06 Canon Inc Method and device for detecting position
JP2002313887A (en) 2001-04-12 2002-10-25 Nikon Corp Detection of transfer atitude of wafer and method and device for pre-aligning wafer
JP2002329769A (en) 2001-04-27 2002-11-15 Lintec Corp Alignment equipment
DE102004025150B4 (en) 2004-05-21 2019-05-09 Mattson Technology, Inc. Orientation of a semiconductor substrate on a rotating device
CN100355055C (en) 2005-10-28 2007-12-12 清华大学 Method for controlling pre-aligning of silicon wafer
CN100446210C (en) 2005-12-09 2008-12-24 北京圆合电子技术有限责任公司 Silicon chip transmitting system with CCD sensor and transmitting method thereof
JP2008192840A (en) * 2007-02-05 2008-08-21 Tokyo Electron Ltd Vacuum processing apparatus, method for vacuum processing and storage medium
CN101436004B (en) * 2008-12-01 2011-12-21 上海微电子装备有限公司 Method for pre-aligning silicon chip
JP5381118B2 (en) 2009-01-21 2014-01-08 東京エレクトロン株式会社 Probe device
US8514395B2 (en) * 2009-08-25 2013-08-20 Nikon Corporation Exposure method, exposure apparatus, and device manufacturing method
JP5524550B2 (en) * 2009-09-15 2014-06-18 株式会社ニコン Substrate bonding apparatus, substrate bonding method, and device manufacturing method
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CN102543808A (en) 2010-12-29 2012-07-04 沈阳新松机器人自动化股份有限公司 Wafer pre-alignment method
CN103219269A (en) 2012-01-19 2013-07-24 中国科学院沈阳自动化研究所 Wafer pre-locating device based on machine vision and method thereof
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CN103050427A (en) * 2012-12-27 2013-04-17 上海交通大学 Wafer pre-alignment method

Also Published As

Publication number Publication date
JP6268297B2 (en) 2018-01-24
EP3091567A1 (en) 2016-11-09
KR20160103125A (en) 2016-08-31
KR101882823B1 (en) 2018-07-27
US20160329229A1 (en) 2016-11-10
WO2015101220A1 (en) 2015-07-09
TW201535655A (en) 2015-09-16
US10276418B2 (en) 2019-04-30
TWI533428B (en) 2016-05-11
EP3091567B1 (en) 2018-08-08
EP3091567A4 (en) 2016-12-14
JP2017503349A (en) 2017-01-26

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