JP2010278156A - 電子部品のダイシング用粘着シート - Google Patents
電子部品のダイシング用粘着シート Download PDFInfo
- Publication number
- JP2010278156A JP2010278156A JP2009128190A JP2009128190A JP2010278156A JP 2010278156 A JP2010278156 A JP 2010278156A JP 2009128190 A JP2009128190 A JP 2009128190A JP 2009128190 A JP2009128190 A JP 2009128190A JP 2010278156 A JP2010278156 A JP 2010278156A
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- JP
- Japan
- Prior art keywords
- resin
- pressure
- dicing
- sensitive adhesive
- meth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000000463 material Substances 0.000 claims description 85
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Abstract
【解決手段】配線基板を有する電子部品をダイシングする際に用いられる電子部品のダイシング用粘着シートであって、少なくとも片面に粘着剤層を有する基材の120℃でのMFRが0g/10minであり、120℃での裂け性が5%〜300%であることを特徴とする電子部品のダイシング用粘着シート。
【選択図】なし
Description
本発明の電子部品のダイシング用粘着シートに用いられる基材の一態様として、SE樹脂80重量%〜10重量%及びMBS3元樹脂20重量%〜90重量%からなる層(A)の単層フィルムが挙げられる。
本発明の基材の他の態様として、前記層(A)と、前記SE樹脂100重量%〜80重量%及び前記MBS3元樹脂0重量%〜20重量%からなる層(B)とが、(A)/(B)/(A)の順で積層されてなる少なくとも3層からなるダイシング用基材が挙げられる。
本発明の基材の他の態様として、前記層(A)と、ポリエチレン系樹脂からなる層(C)とが、(A)/(C)で積層されてなる少なくとも2層からなる基材が挙げられる。
本発明の基材の他の態様として、前記した層(A)、層(B)及び層(C)とが、(A)/(B)/(C)の順で積層されてなる少なくとも3層からなる基材が挙げられる。
アクリル酸メチル20重量部とアクリル酸10重量部とアクリル酸2エチルヘキシル80重量部を共重合して得られた重量平均分子量80万の共重合体(固形分35%)100重量部、多官能アクリレート系オリゴマー(日本合成化学工業(株)製、UV−1700)100重量部、粘着付与剤としてヒドロキシル価が160 KOH mg/g〜170 KOH mg/gのテルペンフェノール樹脂(ヤスハラケミカル(株)製、YSポリスターN125)15重量部、界面活性剤としてリン酸エステル系界面活性剤(東邦化学工業(株)製、フォスファノールRL−210、アルキル基の炭素数18)0.4重量部(50℃に加熱したトルエンに固形分濃度が2%となるように溶解した溶液を配合)、架橋剤としてポリイソシアネート化合物(日本ポリウレタン工業(株)製、コロネートL)1重量部、光重合開始剤として2,2−ジメトキシ−2−フェニルアセトフェノン(チバ・スペシャルティ・ケミカルズ(株)製、イルガキュア(登録商標)651)3重量部配合した粘着剤層となる樹脂溶液を配合・調整し、シリコーン剥離処理した厚み38μmのポリエステルフィルムに乾燥後の厚みが20μmになるように塗工し、120℃で5分間乾燥した。その後、基材としてアクリルフィルム(ロンシール工業製、ACF−550、厚み150μm、120℃でのMFR=0g/10min、120℃での裂け性40%)にラミネートすることで、粘着シートを作製した。
実施例1において、基材としてSEBS樹脂(スチレン−ブタジエンブロック共重合体水素添加物(クレイトンポリマー社製、MD6945)70重量%とアクリル系樹脂((株)クラレ製、SA−1000−FR201)30重量%を使用して作製したフィルム(厚み150μm、120℃でのMFR=0g/10min、120℃での裂け性=120%)を使用した以外は実施例1と同様の操作にて粘着シートを作製した。
実施例1において、基材としてSEBS樹脂(スチレン−ブタジエンブロック共重合体水素添加物(クレイトンポリマー社製、MD6945)20重量%とアクリル系樹脂((株)クラレ製、SA−1000−FR201)80重量%を使用して作製したフィルム(厚み150μm、120℃でのMFR=0g/10min、120℃での裂け性40%)を使用した以外は実施例1と同様の操作にて粘着シートを作製した。
実施例1において、基材として、A層のアクリルフィルム(ロンシール工業(株)製、ACF−550、厚み50μm、120℃でのMFR=0g/10min、120℃での裂け性40%)と、B層のEVA樹脂(三井・デュポンケミカル(株)製、エバフレックスP1007)を使用して作製したフィルム(厚み100μm、120℃でのMFR=3g/10min、120℃での裂け性=流動状態のため測定不能)を貼り合わせた総厚150μmの基材を使用し、A層の上に粘着剤層を設けたこと以外は実施例1と同様の操作にて粘着シートを作製した。
実施例1において、基材としてEVA樹脂(三井・デュポンケミカル(株)製、エバフレックスP1007)を使用して作製したフィルム150μm(120℃でのMFR=3g/10min、120℃での裂け性=流動状態のため測定不能)を使用した以外は実施例1と同様の操作にて粘着シートを作製した。
実施例1において、基材としてPVCフィルム150μm(アキレス(株)製、アキレスタイプC+、120℃でのMFR=0g/10min、120℃での裂け性400%)を用いた以外は実施例1と同様の操作にて粘着シートを作製した。
実施例1において、基材としてPETフィルム150μm(東レ(株)製、ルミラー(登録商標)S10、120℃でのMFR=0mg/10min、120℃での裂け性2%)を使用した以外は実施例1と同様の操作にて粘着シートを作製した。
本発明の基材のMFRは、ASTM D1238にて測定したメジャリングフローレイトのことを示す。測定条件を下記に示す。
測定装置:メルトインデクサーII型(テスター産業(株)製)
測定温度:120℃
溶出加重:5kg
溶出口径:2.0955mm
溶出口長さ:8mm
本発明の基材の裂け性は、切り込みを入れた試験片を測定温度下にて一定の引張速度で引っ張り、完全に破断したときの伸度を指標として用いた。この場合の破断伸度は、試験片の破断長さ(全長)/試験片初期長さ×100により計算した。破断伸度が小さいほど、裂けやすいことを示し、破断伸度が大きいほど裂けにくいことを示す。測定条件を下記に示す。
測定装置:万能引張試験機((株)島津製作所製)
引張速度:50mm/min
測定温度:120℃
放置時間:測定前に測定温度下で30分静置した。
試験片サイズ:幅10mm×長さ100mm×厚み150μm
切り込み:試験片の長さ方向中央部、幅方向端部に長さ1mmの切り込みを、長さ方向に垂直に入れた。
半導体パッケージの封止樹脂面にテープ貼り付け装置(日東精機(株)製、M−286N)を用いて、速度60mm/sec、テーブル温度45℃にて粘着シートを貼り付けた後に、ダイシング装置((株)DISCO製、DFG−651)を用いて半導体パッケージ上からダイシングを行った。ダイシング条件を下記に示す。
ブレード回転数:38000rpm
ダイシング速度:100mm/sec
切り込み深さ:70μm(基材への切り込み深さ)
ブレード:レジンブレード((株)DISCO製、外形:580mm、刃厚:300μm)
半導体パッケージ:LGAパッケージ(サイズ横5cm×縦5cm×厚み0.4mm)
ダイシングサイズ:1mm×1mm
切削冷却水の水量:1.5L/min
ダイシングした半導体パッケージの全ダイシングラインを光学顕微鏡を用いて観察し、半導体パッケージ表面に露出している糸状屑の本数を測定した。
Claims (2)
- 配線基板を有する電子部品をダイシングする際に用いられる電子部品のダイシング用粘着シートであって、
少なくとも片面に粘着剤層を有する基材の120℃でのMFRが0g/10minであり、120℃での裂け性が5%〜300%であることを特徴とする電子部品のダイシング用粘着シート。 - 前記基材が少なくとも2層以上から構成されており、前記電子部品を貼着保持する粘着剤層に接する側の基材の120℃でのMFRが0g/10minであり、120℃での裂け性が5%〜300%であることを特徴とする請求項1に記載の電子部品のダイシング用粘着シート。
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JP2012207163A (ja) * | 2011-03-30 | 2012-10-25 | Sumitomo Bakelite Co Ltd | 半導体ウエハ等加工用粘着テープ |
JP2013104044A (ja) * | 2011-11-16 | 2013-05-30 | Three M Innovative Properties Co | 熱膨張性接着シートおよびその製造方法 |
WO2014050658A1 (ja) * | 2012-09-25 | 2014-04-03 | 住友ベークライト株式会社 | ダイシングフィルム |
JP2015183034A (ja) * | 2014-03-20 | 2015-10-22 | 株式会社カネカ | ホットメルト型接着フィルムおよび成型体 |
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