WO2002017483A1 - Dispositif de filtration d'ondes acoustiques de surface - Google Patents
Dispositif de filtration d'ondes acoustiques de surface Download PDFInfo
- Publication number
- WO2002017483A1 WO2002017483A1 PCT/JP2001/007042 JP0107042W WO0217483A1 WO 2002017483 A1 WO2002017483 A1 WO 2002017483A1 JP 0107042 W JP0107042 W JP 0107042W WO 0217483 A1 WO0217483 A1 WO 0217483A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- acoustic wave
- surface acoustic
- wave filter
- parallel arm
- electrode
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
- H03H9/1071—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
- H03H9/0557—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement the other elements being buried in the substrate
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/058—Holders; Supports for surface acoustic wave devices
- H03H9/059—Holders; Supports for surface acoustic wave devices consisting of mounting pads or bumps
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/64—Filters using surface acoustic waves
- H03H9/6423—Means for obtaining a particular transfer characteristic
- H03H9/6433—Coupled resonator filters
- H03H9/6483—Ladder SAW filters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/111,003 US6919777B2 (en) | 2000-08-21 | 2001-08-15 | Surface acoustic wave filter device |
DE60144236T DE60144236D1 (de) | 2000-08-21 | 2001-08-15 | Akustische oberflächenwellenanordnung |
EP01956904A EP1313218B1 (en) | 2000-08-21 | 2001-08-15 | Surface acoustic wave filter device |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000249954 | 2000-08-21 | ||
JP2000-249954 | 2000-08-21 | ||
JP2001225768A JP2002141771A (ja) | 2000-08-21 | 2001-07-26 | 弾性表面波フィルタ装置 |
JP2001-225768 | 2001-07-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2002017483A1 true WO2002017483A1 (fr) | 2002-02-28 |
Family
ID=26598175
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2001/007042 WO2002017483A1 (fr) | 2000-08-21 | 2001-08-15 | Dispositif de filtration d'ondes acoustiques de surface |
Country Status (7)
Country | Link |
---|---|
US (1) | US6919777B2 (ja) |
EP (2) | EP2284998A3 (ja) |
JP (1) | JP2002141771A (ja) |
KR (1) | KR100500006B1 (ja) |
CN (1) | CN1196258C (ja) |
DE (1) | DE60144236D1 (ja) |
WO (1) | WO2002017483A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7274129B2 (en) | 2003-04-08 | 2007-09-25 | Fujitsu Media Devices Limited | Surface acoustic wave device and method of fabricating the same |
CN1503451B (zh) * | 2002-11-22 | 2012-04-18 | 太阳诱电株式会社 | 滤波器元件以及包含它的滤波器器件、双工器和高频电路 |
CN1497845B (zh) * | 2002-10-21 | 2012-04-18 | 太阳诱电株式会社 | 表面声波滤波器和滤波器器件 |
JPWO2016114358A1 (ja) * | 2015-01-16 | 2017-08-17 | 株式会社村田製作所 | 基板、基板の製造方法及び弾性波装置 |
Families Citing this family (50)
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EP1315297A3 (en) * | 2001-10-29 | 2010-02-17 | Panasonic Corporation | Surface acoustic wave filter element, surface acoustic wave filter and communication device using the same |
JP2004120016A (ja) * | 2002-09-20 | 2004-04-15 | Fujitsu Media Device Kk | フィルタ装置 |
EP1570513A4 (en) * | 2002-11-27 | 2007-11-14 | Micro Components Ltd | Microelectronics packaging and components |
JP4144509B2 (ja) * | 2003-01-16 | 2008-09-03 | 株式会社村田製作所 | ラダー型フィルタ、分波器、通信装置 |
JP3843983B2 (ja) * | 2003-03-20 | 2006-11-08 | セイコーエプソン株式会社 | 圧電振動子 |
US8896397B2 (en) | 2003-04-16 | 2014-11-25 | Intellectual Ventures Fund 77 Llc | Surface acoustic wave device and method of adjusting LC component of surface acoustic wave device |
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JP3778902B2 (ja) * | 2003-04-28 | 2006-05-24 | 富士通メディアデバイス株式会社 | 分波器及び電子装置 |
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KR100552482B1 (ko) * | 2003-11-28 | 2006-02-15 | 삼성전자주식회사 | Rf 듀플렉서 |
JP2005203889A (ja) * | 2004-01-13 | 2005-07-28 | Fujitsu Media Device Kk | 弾性表面波デバイス |
WO2006003787A1 (ja) | 2004-06-30 | 2006-01-12 | Murata Manufacturing Co., Ltd. | バランス型弾性波フィルタ及び弾性波フィルタ装置 |
JP4518870B2 (ja) * | 2004-08-24 | 2010-08-04 | 京セラ株式会社 | 弾性表面波装置および通信装置 |
WO2006067935A1 (ja) * | 2004-12-24 | 2006-06-29 | Murata Manufacturing Co., Ltd. | 分波器 |
US20070126111A1 (en) * | 2005-05-26 | 2007-06-07 | Uri Mirsky | Microelectronic packaging and components |
JP4294632B2 (ja) | 2005-10-26 | 2009-07-15 | 富士通メディアデバイス株式会社 | 弾性表面波装置 |
JP4585431B2 (ja) * | 2005-11-15 | 2010-11-24 | 富士通メディアデバイス株式会社 | 分波器 |
WO2007088683A1 (ja) * | 2006-02-02 | 2007-08-09 | Murata Manufacturing Co., Ltd. | フィルタ装置 |
CN102017408B (zh) | 2008-05-07 | 2014-04-30 | 株式会社村田制作所 | 弹性波滤波装置 |
JP5355958B2 (ja) * | 2008-07-31 | 2013-11-27 | 太陽誘電株式会社 | フィルタ、分波器および通信機器 |
RU2497272C2 (ru) * | 2008-10-31 | 2013-10-27 | Эппл Инк. | Полосовой режекторный фильтр, телекоммуникационная базовая станция и терминал, дуплексер и способ согласования импедансов |
JP5237138B2 (ja) | 2009-01-27 | 2013-07-17 | 太陽誘電株式会社 | フィルタ、デュープレクサ、通信モジュール |
DE102009034101B4 (de) * | 2009-07-21 | 2017-02-02 | Epcos Ag | Filterschaltung mit verbesserter Filtercharakteristik |
JP5354028B2 (ja) * | 2010-01-28 | 2013-11-27 | 株式会社村田製作所 | 弾性表面波フィルタ装置 |
JP2011205625A (ja) * | 2010-03-02 | 2011-10-13 | Panasonic Corp | ラダー型フィルタ |
JP5333403B2 (ja) | 2010-10-12 | 2013-11-06 | 株式会社村田製作所 | 弾性表面波フィルタ装置 |
DE102010055649B4 (de) * | 2010-12-22 | 2015-07-16 | Epcos Ag | Duplexer und Verfahren zum Herstellen eines Duplexers |
WO2012132093A1 (ja) * | 2011-03-31 | 2012-10-04 | 株式会社村田製作所 | 弾性波装置 |
US8816567B2 (en) | 2011-07-19 | 2014-08-26 | Qualcomm Mems Technologies, Inc. | Piezoelectric laterally vibrating resonator structure geometries for spurious frequency suppression |
EP2741426B1 (en) | 2011-08-01 | 2017-12-20 | Murata Manufacturing Co., Ltd. | High-frequency module |
CN105122645B (zh) * | 2013-04-11 | 2018-02-13 | 株式会社村田制作所 | 高频模块 |
JP6187583B2 (ja) * | 2013-04-11 | 2017-08-30 | 株式会社村田製作所 | 高周波モジュール |
WO2015019980A1 (ja) * | 2013-08-06 | 2015-02-12 | 株式会社村田製作所 | 高周波モジュール |
WO2015019722A1 (ja) * | 2013-08-06 | 2015-02-12 | 株式会社村田製作所 | 高周波モジュール |
CN104467734B (zh) * | 2014-11-07 | 2017-10-20 | 深圳华远微电科技有限公司 | Gps和bds用声表面波滤波器及其小型化封装工艺 |
JP6365436B2 (ja) | 2015-06-24 | 2018-08-01 | 株式会社村田製作所 | 弾性波装置 |
DE102015114751A1 (de) * | 2015-09-03 | 2017-03-09 | Epcos Ag | SAW Filter |
KR20180003868A (ko) | 2016-07-01 | 2018-01-10 | 삼성전기주식회사 | 벌크 탄성파 필터 |
WO2018061949A1 (ja) * | 2016-09-29 | 2018-04-05 | 株式会社村田製作所 | 弾性波フィルタ装置、マルチプレクサ、高周波フロントエンド回路及び通信装置 |
WO2018061950A1 (ja) * | 2016-09-29 | 2018-04-05 | 株式会社村田製作所 | 弾性波フィルタ装置、マルチプレクサ、高周波フロントエンド回路及び通信装置 |
CN107342749B (zh) * | 2017-06-05 | 2020-08-28 | 锐迪科微电子科技(上海)有限公司 | 一种带通滤波器 |
JP2020098969A (ja) | 2018-12-17 | 2020-06-25 | 株式会社村田製作所 | 90゜ハイブリッドカプラを用いたフィルタ回路 |
JP7252770B2 (ja) * | 2019-02-01 | 2023-04-05 | 太陽誘電株式会社 | 高周波デバイスおよびマルチプレクサ |
JP7352855B2 (ja) * | 2019-08-21 | 2023-09-29 | 株式会社村田製作所 | 分波器 |
CN112398457A (zh) * | 2020-11-24 | 2021-02-23 | 广东广纳芯科技有限公司 | 声表面波滤波器及其制造方法 |
CN113839646B (zh) * | 2021-09-29 | 2024-04-09 | 北京超材信息科技有限公司 | 声表面波装置阻抗匹配器 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0541284A1 (en) | 1991-10-28 | 1993-05-12 | Fujitsu Limited | Surface acoustic wave filter |
JPH1093382A (ja) | 1996-09-17 | 1998-04-10 | Oki Electric Ind Co Ltd | 表面弾性波フィルタ回路パターンの構造 |
EP0853381A2 (en) | 1997-01-10 | 1998-07-15 | Murata Manufacturing Co., Ltd. | Surface acoustic wave filter |
EP0897218A2 (en) | 1997-08-07 | 1999-02-17 | Murata Manufacturing Co., Ltd. | Surface acoustic wave filter |
JP2000223989A (ja) | 1999-01-29 | 2000-08-11 | Kyocera Corp | 弾性表面波装置 |
JP2001160731A (ja) * | 1999-12-01 | 2001-06-12 | Kyocera Corp | 弾性表面波装置 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63263809A (ja) * | 1987-04-21 | 1988-10-31 | Murata Mfg Co Ltd | 表面波装置 |
JP2673993B2 (ja) | 1990-07-02 | 1997-11-05 | 日本無線株式会社 | 表面弾性波装置 |
JP3152418B2 (ja) * | 1991-10-28 | 2001-04-03 | 富士通株式会社 | 弾性表面波フィルタ |
US5459368A (en) * | 1993-08-06 | 1995-10-17 | Matsushita Electric Industrial Co., Ltd. | Surface acoustic wave device mounted module |
JP2905094B2 (ja) * | 1994-07-01 | 1999-06-14 | 富士通株式会社 | 分波器パッケージ |
GB2296614B (en) * | 1994-12-23 | 1999-09-15 | Advanced Saw Prod Sa | Saw filter |
JP3895397B2 (ja) * | 1996-05-30 | 2007-03-22 | 日本無線株式会社 | Sawフィルタの基板実装方法 |
JP3735418B2 (ja) * | 1996-08-28 | 2006-01-18 | 日本無線株式会社 | 弾性表面波デバイスおよびこれを使用する通信装置 |
JP3380417B2 (ja) * | 1997-02-12 | 2003-02-24 | 沖電気工業株式会社 | 有極型弾性表面波フィルタ |
JP3982876B2 (ja) * | 1997-06-30 | 2007-09-26 | 沖電気工業株式会社 | 弾性表面波装置 |
JPH11122072A (ja) * | 1997-10-14 | 1999-04-30 | Fujitsu Ltd | 弾性表面波装置 |
JPH11163218A (ja) * | 1997-11-21 | 1999-06-18 | Japan Radio Co Ltd | パッケージ構造 |
JPH11227429A (ja) | 1998-02-16 | 1999-08-24 | Kiichiro Ishibashi | 2段式チェーン金具、並びに伸縮タイヤチェーン。 |
JP3206548B2 (ja) * | 1998-05-14 | 2001-09-10 | 株式会社村田製作所 | 表面波フィルタ、共用器、通信機装置 |
JPH11340779A (ja) | 1998-05-22 | 1999-12-10 | Murata Mfg Co Ltd | 弾性表面波フィルタ、デュプレクサおよび通信機装置 |
JP3482957B2 (ja) * | 1998-11-13 | 2004-01-06 | 松下電器産業株式会社 | 弾性表面波フィルタ |
JP3860364B2 (ja) * | 1999-08-11 | 2006-12-20 | 富士通メディアデバイス株式会社 | 弾性表面波装置 |
JP3363870B2 (ja) * | 2000-05-29 | 2003-01-08 | 沖電気工業株式会社 | 弾性表面波分波器 |
-
2001
- 2001-07-26 JP JP2001225768A patent/JP2002141771A/ja active Pending
- 2001-08-15 KR KR10-2002-7005155A patent/KR100500006B1/ko active IP Right Grant
- 2001-08-15 CN CNB018031676A patent/CN1196258C/zh not_active Expired - Lifetime
- 2001-08-15 US US10/111,003 patent/US6919777B2/en not_active Expired - Lifetime
- 2001-08-15 EP EP10173569A patent/EP2284998A3/en not_active Withdrawn
- 2001-08-15 DE DE60144236T patent/DE60144236D1/de not_active Expired - Lifetime
- 2001-08-15 WO PCT/JP2001/007042 patent/WO2002017483A1/ja not_active Application Discontinuation
- 2001-08-15 EP EP01956904A patent/EP1313218B1/en not_active Expired - Lifetime
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0541284A1 (en) | 1991-10-28 | 1993-05-12 | Fujitsu Limited | Surface acoustic wave filter |
JPH05183380A (ja) * | 1991-10-28 | 1993-07-23 | Fujitsu Ltd | 弾性表面波フィルタ |
JPH1093382A (ja) | 1996-09-17 | 1998-04-10 | Oki Electric Ind Co Ltd | 表面弾性波フィルタ回路パターンの構造 |
EP0853381A2 (en) | 1997-01-10 | 1998-07-15 | Murata Manufacturing Co., Ltd. | Surface acoustic wave filter |
EP0897218A2 (en) | 1997-08-07 | 1999-02-17 | Murata Manufacturing Co., Ltd. | Surface acoustic wave filter |
JP2000223989A (ja) | 1999-01-29 | 2000-08-11 | Kyocera Corp | 弾性表面波装置 |
JP2001160731A (ja) * | 1999-12-01 | 2001-06-12 | Kyocera Corp | 弾性表面波装置 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1497845B (zh) * | 2002-10-21 | 2012-04-18 | 太阳诱电株式会社 | 表面声波滤波器和滤波器器件 |
CN1503451B (zh) * | 2002-11-22 | 2012-04-18 | 太阳诱电株式会社 | 滤波器元件以及包含它的滤波器器件、双工器和高频电路 |
US7274129B2 (en) | 2003-04-08 | 2007-09-25 | Fujitsu Media Devices Limited | Surface acoustic wave device and method of fabricating the same |
JPWO2016114358A1 (ja) * | 2015-01-16 | 2017-08-17 | 株式会社村田製作所 | 基板、基板の製造方法及び弾性波装置 |
Also Published As
Publication number | Publication date |
---|---|
US6919777B2 (en) | 2005-07-19 |
EP2284998A2 (en) | 2011-02-16 |
JP2002141771A (ja) | 2002-05-17 |
CN1394389A (zh) | 2003-01-29 |
KR100500006B1 (ko) | 2005-07-12 |
EP2284998A3 (en) | 2011-03-16 |
EP1313218A4 (en) | 2009-08-05 |
US20030058066A1 (en) | 2003-03-27 |
DE60144236D1 (de) | 2011-04-28 |
KR20020043236A (ko) | 2002-06-08 |
EP1313218B1 (en) | 2011-03-16 |
EP1313218A1 (en) | 2003-05-21 |
CN1196258C (zh) | 2005-04-06 |
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