TWI565224B - 壓電裝置及電子機器 - Google Patents
壓電裝置及電子機器 Download PDFInfo
- Publication number
- TWI565224B TWI565224B TW104142156A TW104142156A TWI565224B TW I565224 B TWI565224 B TW I565224B TW 104142156 A TW104142156 A TW 104142156A TW 104142156 A TW104142156 A TW 104142156A TW I565224 B TWI565224 B TW I565224B
- Authority
- TW
- Taiwan
- Prior art keywords
- temperature
- component
- temperature sensor
- piezoelectric
- terminal
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims description 42
- 229910052751 metal Inorganic materials 0.000 claims description 26
- 239000002184 metal Substances 0.000 claims description 26
- 238000007789 sealing Methods 0.000 claims description 8
- 238000005476 soldering Methods 0.000 claims description 2
- 239000013078 crystal Substances 0.000 description 90
- 230000010355 oscillation Effects 0.000 description 21
- 230000007935 neutral effect Effects 0.000 description 14
- 239000000463 material Substances 0.000 description 9
- 239000000919 ceramic Substances 0.000 description 8
- 230000005284 excitation Effects 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 239000000523 sample Substances 0.000 description 6
- 239000004020 conductor Substances 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000007769 metal material Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 229910000833 kovar Inorganic materials 0.000 description 2
- 238000004826 seaming Methods 0.000 description 2
- 238000010897 surface acoustic wave method Methods 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 235000014676 Phragmites communis Nutrition 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
- H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
- H03B5/30—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator
- H03B5/32—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03L—AUTOMATIC CONTROL, STARTING, SYNCHRONISATION OR STABILISATION OF GENERATORS OF ELECTRONIC OSCILLATIONS OR PULSES
- H03L1/00—Stabilisation of generator output against variations of physical values, e.g. power supply
- H03L1/02—Stabilisation of generator output against variations of physical values, e.g. power supply against variations of temperature only
- H03L1/022—Stabilisation of generator output against variations of physical values, e.g. power supply against variations of temperature only by indirect stabilisation, i.e. by generating an electrical correction signal which is a function of the temperature
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N2/00—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction
- H02N2/0005—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing non-specific motion; Details common to machines covered by H02N2/02 - H02N2/16
- H02N2/001—Driving devices, e.g. vibrators
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
- H03B1/00—Details
- H03B1/02—Structural details of power oscillators, e.g. for heating
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03L—AUTOMATIC CONTROL, STARTING, SYNCHRONISATION OR STABILISATION OF GENERATORS OF ELECTRONIC OSCILLATIONS OR PULSES
- H03L1/00—Stabilisation of generator output against variations of physical values, e.g. power supply
- H03L1/02—Stabilisation of generator output against variations of physical values, e.g. power supply against variations of temperature only
- H03L1/028—Stabilisation of generator output against variations of physical values, e.g. power supply against variations of temperature only of generators comprising piezoelectric resonators
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03L—AUTOMATIC CONTROL, STARTING, SYNCHRONISATION OR STABILISATION OF GENERATORS OF ELECTRONIC OSCILLATIONS OR PULSES
- H03L1/00—Stabilisation of generator output against variations of physical values, e.g. power supply
- H03L1/02—Stabilisation of generator output against variations of physical values, e.g. power supply against variations of temperature only
- H03L1/04—Constructional details for maintaining temperature constant
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15192—Resurf arrangement of the internal vias
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Oscillators With Electromechanical Resonators (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011054014A JP5747574B2 (ja) | 2011-03-11 | 2011-03-11 | 圧電デバイス及び電子機器 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201614955A TW201614955A (en) | 2016-04-16 |
TWI565224B true TWI565224B (zh) | 2017-01-01 |
Family
ID=46122348
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW100131346A TWI521860B (zh) | 2011-03-11 | 2011-08-31 | 壓電裝置及電子機器 |
TW104142156A TWI565224B (zh) | 2011-03-11 | 2011-08-31 | 壓電裝置及電子機器 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW100131346A TWI521860B (zh) | 2011-03-11 | 2011-08-31 | 壓電裝置及電子機器 |
Country Status (5)
Country | Link |
---|---|
US (5) | US8754718B2 (ko) |
JP (1) | JP5747574B2 (ko) |
KR (3) | KR101227837B1 (ko) |
CN (4) | CN202261167U (ko) |
TW (2) | TWI521860B (ko) |
Families Citing this family (43)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5747574B2 (ja) * | 2011-03-11 | 2015-07-15 | セイコーエプソン株式会社 | 圧電デバイス及び電子機器 |
DE102011088053B3 (de) * | 2011-12-08 | 2013-04-11 | Siemens Aktiengesellschaft | Messumformer |
US9230890B2 (en) | 2012-04-27 | 2016-01-05 | Lapis Semiconductor Co., Ltd. | Semiconductor device and measurement device |
JP5306512B1 (ja) * | 2012-04-27 | 2013-10-02 | ラピスセミコンダクタ株式会社 | 半導体装置、計測機器、及び補正方法 |
JP6017901B2 (ja) | 2012-09-14 | 2016-11-02 | ラピスセミコンダクタ株式会社 | 半導体装置および計測装置 |
CN103152006A (zh) * | 2013-03-05 | 2013-06-12 | 台晶(宁波)电子有限公司 | 一种具有热敏电阻的石英晶体谐振器 |
KR101532134B1 (ko) | 2013-06-03 | 2015-06-26 | 삼성전기주식회사 | 압전 소자 패키지 및 그 제조 방법 |
JP6190664B2 (ja) * | 2013-08-27 | 2017-08-30 | 日本電波工業株式会社 | 水晶発振器 |
JP6127889B2 (ja) * | 2013-10-04 | 2017-05-17 | 株式会社大真空 | 圧電デバイス |
JP6183156B2 (ja) * | 2013-10-30 | 2017-08-23 | セイコーエプソン株式会社 | パッケージ、振動デバイス、発振器、電子機器及び移動体 |
JP6289872B2 (ja) * | 2013-11-07 | 2018-03-07 | 京セラ株式会社 | 温度補償型水晶発振器 |
US9859193B2 (en) * | 2014-06-24 | 2018-01-02 | Ibis Innotech Inc. | Package structure |
US9801282B2 (en) * | 2014-06-24 | 2017-10-24 | Ibis Innotech Inc. | Package structure |
JP6618675B2 (ja) * | 2014-07-30 | 2019-12-11 | セイコーエプソン株式会社 | 振動デバイス、電子機器及び移動体 |
JP6572571B2 (ja) * | 2015-03-16 | 2019-09-11 | セイコーエプソン株式会社 | 発振器、電子機器および移動体 |
US10171090B2 (en) * | 2015-03-27 | 2019-01-01 | Seiko Epson Corporation | Oscillator, electronic apparatus, and moving object |
US9939315B2 (en) | 2015-08-08 | 2018-04-10 | Vibration Measurement Solutions, Inc. | Two-wire electronics interface sensor with integrated mechanical transducing and temperature monitoring capability |
JP6710914B2 (ja) * | 2015-08-28 | 2020-06-17 | セイコーエプソン株式会社 | 電子デバイス、電子機器及び移動体 |
JP6562320B2 (ja) * | 2015-10-20 | 2019-08-21 | 株式会社村田製作所 | 水晶振動子及びその温度制御方法、並びに水晶発振器 |
CN108352812B (zh) * | 2015-11-05 | 2022-03-22 | 株式会社村田制作所 | 压电振荡器和压电振荡器件 |
EP3379723A4 (en) * | 2015-12-24 | 2019-08-07 | Murata Manufacturing Co., Ltd. | PIEZOELECTRIC OSCILLATION DEVICE AND METHOD FOR MANUFACTURING THE SAME |
WO2018051800A1 (ja) * | 2016-09-16 | 2018-03-22 | 株式会社大真空 | 圧電振動デバイス |
US10718672B2 (en) * | 2017-01-20 | 2020-07-21 | Samsung Electro-Mechanics Co., Ltd. | Piezoelectric device package |
JP6925222B2 (ja) * | 2017-10-02 | 2021-08-25 | 京セラ株式会社 | 圧電振動子 |
JP6987589B2 (ja) * | 2017-10-02 | 2022-01-05 | 京セラ株式会社 | 水晶振動子 |
JP7144942B2 (ja) * | 2017-12-27 | 2022-09-30 | 日本電波工業株式会社 | 水晶振動子 |
CN109981102B (zh) * | 2017-12-27 | 2024-09-13 | 日本电波工业株式会社 | 晶体振荡器 |
WO2019160051A1 (ja) * | 2018-02-15 | 2019-08-22 | 株式会社村田製作所 | Icチップ及びそれを備えた電子装置 |
CN109560668B (zh) * | 2019-01-23 | 2024-09-24 | 宁波菲仕技术股份有限公司 | 一种液冷电机壳体和液冷电机 |
DE202019100449U1 (de) * | 2019-01-25 | 2020-04-30 | Wago Verwaltungsgesellschaft Mbh | Halterungseinrichtung, Schaltschrank und Ausleseeinrichtung |
JP7275638B2 (ja) * | 2019-02-22 | 2023-05-18 | セイコーエプソン株式会社 | 発振器、電子機器および移動体 |
JP7331376B2 (ja) * | 2019-02-22 | 2023-08-23 | セイコーエプソン株式会社 | 発振器、電子機器および移動体 |
JP2020137023A (ja) * | 2019-02-22 | 2020-08-31 | セイコーエプソン株式会社 | 発振器、電子機器および移動体 |
JP7375331B2 (ja) | 2019-04-26 | 2023-11-08 | セイコーエプソン株式会社 | 振動デバイスおよび電子機器 |
JP7434724B2 (ja) | 2019-05-23 | 2024-02-21 | セイコーエプソン株式会社 | 振動デバイス、電子機器および移動体 |
JP7306095B2 (ja) * | 2019-06-21 | 2023-07-11 | 株式会社大真空 | 圧電デバイス及び圧電デバイスの製造方法 |
JP7306096B2 (ja) * | 2019-06-21 | 2023-07-11 | 株式会社大真空 | 圧電デバイス及び圧電デバイスの製造方法 |
US10783174B1 (en) | 2020-03-20 | 2020-09-22 | Coupang Corp. | Systems and methods for collection, management, and distribution of data using a crowdsourced knowledge database |
IT202000007009A1 (it) * | 2020-04-02 | 2021-10-02 | St Microelectronics Srl | Sensore di temperatura ambientale accoppiabile a una scheda di circuito stampato con incapsulamento perfezionato |
KR102418152B1 (ko) * | 2020-07-17 | 2022-07-06 | 윤병묵 | 진동 센서 장치 |
WO2022044360A1 (ja) * | 2020-08-31 | 2022-03-03 | 有限会社マクシス・ワン | 恒温槽型水晶発振器 |
US20240258990A1 (en) * | 2021-09-24 | 2024-08-01 | Daishinku Corporation | Piezoelectric vibration device |
WO2023131847A1 (en) * | 2022-01-05 | 2023-07-13 | Rakon Limited | Temperature stabilized frequency control device |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5500628A (en) * | 1995-01-24 | 1996-03-19 | Motorola, Inc. | Double-sided oscillator package and method of coupling components thereto |
US7382204B2 (en) * | 2005-03-28 | 2008-06-03 | Nihon Dempa Kogyo Co., Ltd. | Constant temperature crystal oscillator |
US7471162B2 (en) * | 2006-04-24 | 2008-12-30 | Nihon Dempa Kogyo Co., Ltd. | Surface mount type temperature-compensated crystal oscillator |
US20090212878A1 (en) * | 2008-02-21 | 2009-08-27 | Junichi Arai | Oven-controlled crystal oscillator |
Family Cites Families (64)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3629588A1 (de) * | 1986-08-30 | 1988-03-03 | Franz Dipl Ing Leitl | Kristalloszillator-kompensationsschaltung |
JP3147134B2 (ja) | 1992-11-30 | 2001-03-19 | 三菱マテリアル株式会社 | チップ型サーミスタ及びその製造方法 |
JP4019473B2 (ja) | 1997-11-13 | 2007-12-12 | エプソントヨコム株式会社 | 電子デバイス |
JPH11330858A (ja) * | 1998-05-11 | 1999-11-30 | Toyo Commun Equip Co Ltd | 圧電発振器 |
US6229249B1 (en) | 1998-08-31 | 2001-05-08 | Kyocera Corporation | Surface-mount type crystal oscillator |
JP3285847B2 (ja) | 1998-08-31 | 2002-05-27 | 京セラ株式会社 | 表面実装型水晶発振器 |
US6229404B1 (en) * | 1998-08-31 | 2001-05-08 | Kyocera Corporation | Crystal oscillator |
JP2001077627A (ja) | 1999-09-02 | 2001-03-23 | Toyo Commun Equip Co Ltd | 温度補償圧電発振器 |
JP2002271142A (ja) | 2001-03-13 | 2002-09-20 | Nippon Dempa Kogyo Co Ltd | 表面実装型の水晶発振器及びその製造方法 |
JP2002359103A (ja) | 2001-05-31 | 2002-12-13 | Mitsubishi Materials Corp | チップ型サーミスタ |
JP2003258554A (ja) * | 2002-02-28 | 2003-09-12 | Kinseki Ltd | 温度補償型圧電発振器 |
JP5024317B2 (ja) | 2002-03-25 | 2012-09-12 | セイコーエプソン株式会社 | 電子部品および電子部品の製造方法 |
JP4378980B2 (ja) | 2002-03-25 | 2009-12-09 | セイコーエプソン株式会社 | 制御端子付き電子部品 |
JP2004222206A (ja) * | 2003-01-17 | 2004-08-05 | Murata Mfg Co Ltd | 水晶発振器およびそれを用いた電子装置 |
WO2004091100A1 (en) | 2003-04-11 | 2004-10-21 | Philips Intellectual Property & Standards Gmbh | Device for detecting the temperature of an oscillator crystal |
JP4251070B2 (ja) | 2003-12-10 | 2009-04-08 | エプソントヨコム株式会社 | 圧電発振器、電子部品、及び圧電発振器の製造方法 |
US7710002B2 (en) | 2006-06-21 | 2010-05-04 | Epson Toyocom Corporation | Piezoelectric resonator for oscillator and surface mount type piezoelectric oscillator |
JP4692722B2 (ja) * | 2004-01-29 | 2011-06-01 | セイコーエプソン株式会社 | 電子部品用パッケージおよび電子部品 |
JP2005286892A (ja) | 2004-03-30 | 2005-10-13 | Kyocera Kinseki Corp | 温度センサーを内蔵した圧電振動子、及びそれを用いた圧電発振器 |
JP4457760B2 (ja) | 2004-06-03 | 2010-04-28 | セイコーエプソン株式会社 | 圧電発振器および電子機器 |
JP4244865B2 (ja) | 2004-06-03 | 2009-03-25 | セイコーエプソン株式会社 | 圧電発振器および電子機器 |
JP4600663B2 (ja) | 2004-12-07 | 2010-12-15 | セイコーエプソン株式会社 | 温度補償型圧電発振器 |
JP2006287594A (ja) | 2005-03-31 | 2006-10-19 | Kyocera Kinseki Corp | 圧電デバイス及びその製造方法 |
JP2006339943A (ja) | 2005-06-01 | 2006-12-14 | Seiko Epson Corp | 圧電デバイス |
JP5007494B2 (ja) | 2005-07-04 | 2012-08-22 | セイコーエプソン株式会社 | 電子デバイスの製造方法 |
JP2007065959A (ja) | 2005-08-31 | 2007-03-15 | Seiko Epson Corp | 電子デバイス、及び電子デバイスの製造方法 |
JP4724518B2 (ja) | 2005-09-29 | 2011-07-13 | 京セラキンセキ株式会社 | 圧電発振器 |
JP4894248B2 (ja) | 2005-12-01 | 2012-03-14 | セイコーエプソン株式会社 | 電子デバイスの外部信号入力方法 |
US20070126316A1 (en) | 2005-12-01 | 2007-06-07 | Epson Toyocom Corporation | Electronic device |
JP2007158522A (ja) | 2005-12-01 | 2007-06-21 | Epson Toyocom Corp | 電子デバイス |
JP2007158521A (ja) | 2005-12-01 | 2007-06-21 | Epson Toyocom Corp | 電子デバイス |
JP4244053B2 (ja) | 2006-06-16 | 2009-03-25 | エプソントヨコム株式会社 | 圧電デバイスを備えた電子モジュール |
JP5339681B2 (ja) | 2007-02-21 | 2013-11-13 | 日本電波工業株式会社 | 表面実装用の水晶振動子 |
JP2008263564A (ja) | 2007-04-16 | 2008-10-30 | Kyocera Kinseki Corp | 温度補償型圧電発振器 |
JP5070954B2 (ja) * | 2007-06-22 | 2012-11-14 | 株式会社大真空 | 表面実装型圧電振動デバイス |
JP4872981B2 (ja) | 2008-07-29 | 2012-02-08 | セイコーエプソン株式会社 | 圧電デバイスを備えた電子モジュール及びその製造方法 |
JP2010035078A (ja) | 2008-07-31 | 2010-02-12 | Kyocera Kinseki Corp | 圧電発振器 |
JP2010035077A (ja) * | 2008-07-31 | 2010-02-12 | Kyocera Kinseki Corp | 圧電発振器 |
JP4822139B2 (ja) | 2008-08-04 | 2011-11-24 | セイコーエプソン株式会社 | 機器及び機器の製造方法 |
JP4695175B2 (ja) | 2008-11-14 | 2011-06-08 | 日本電波工業株式会社 | 恒温型の水晶発振器 |
JP2010135995A (ja) | 2008-12-03 | 2010-06-17 | Nippon Dempa Kogyo Co Ltd | 表面実装水晶発振器 |
JP5308879B2 (ja) * | 2009-03-13 | 2013-10-09 | 日本電波工業株式会社 | 恒温型の水晶発振器 |
US9344095B2 (en) * | 2010-01-31 | 2016-05-17 | Intel Mobile Communications GmbH | Temperature compensation for an oscillator crystal |
TWI466437B (zh) | 2010-03-29 | 2014-12-21 | Kyocera Kinseki Corp | Piezoelectric vibrator |
JP5101651B2 (ja) | 2010-03-29 | 2012-12-19 | 京セラクリスタルデバイス株式会社 | 圧電振動子 |
JP5144731B2 (ja) | 2010-09-30 | 2013-02-13 | 京セラクリスタルデバイス株式会社 | 圧電振動子 |
JP5144732B2 (ja) | 2010-09-30 | 2013-02-13 | 京セラクリスタルデバイス株式会社 | 圧電振動子 |
JP5337791B2 (ja) | 2010-12-28 | 2013-11-06 | 京セラクリスタルデバイス株式会社 | 圧電振動子 |
JP5210369B2 (ja) | 2010-11-30 | 2013-06-12 | 京セラクリスタルデバイス株式会社 | 圧電デバイス |
JP2012099928A (ja) | 2010-10-29 | 2012-05-24 | Kyocera Kinseki Corp | 圧電デバイス |
JP5751800B2 (ja) | 2010-10-29 | 2015-07-22 | 京セラクリスタルデバイス株式会社 | 圧電振動子 |
JP5819053B2 (ja) | 2010-10-29 | 2015-11-18 | 京セラクリスタルデバイス株式会社 | 圧電振動子 |
JP2012142688A (ja) | 2010-12-28 | 2012-07-26 | Kyocera Crystal Device Corp | 圧電デバイスおよびその製造方法 |
JP2012142691A (ja) | 2010-12-28 | 2012-07-26 | Kyocera Crystal Device Corp | 圧電デバイス |
JP5689702B2 (ja) | 2011-01-31 | 2015-03-25 | 京セラクリスタルデバイス株式会社 | 圧電デバイス |
JP5689703B2 (ja) | 2011-01-31 | 2015-03-25 | 京セラクリスタルデバイス株式会社 | 圧電デバイス |
JP5647033B2 (ja) | 2011-02-28 | 2014-12-24 | 京セラクリスタルデバイス株式会社 | 圧電デバイス |
JP2012182567A (ja) | 2011-02-28 | 2012-09-20 | Kyocera Crystal Device Corp | 圧電デバイス |
JP5747574B2 (ja) * | 2011-03-11 | 2015-07-15 | セイコーエプソン株式会社 | 圧電デバイス及び電子機器 |
JP5877962B2 (ja) | 2011-05-31 | 2016-03-08 | 京セラクリスタルデバイス株式会社 | 圧電振動子 |
US9287882B2 (en) * | 2013-11-07 | 2016-03-15 | Kyocera Crystal Device Corporation | Temperature compensated crystal oscillator |
CN106233619B (zh) * | 2014-04-25 | 2019-04-09 | 株式会社村田制作所 | 水晶振动装置 |
JP2016010099A (ja) * | 2014-06-26 | 2016-01-18 | セイコーエプソン株式会社 | 複合電子部品、発振器、電子機器及び移動体 |
JP2016131266A (ja) * | 2015-01-13 | 2016-07-21 | セイコーエプソン株式会社 | 振動デバイス、発振器、電子機器、および移動体 |
-
2011
- 2011-03-11 JP JP2011054014A patent/JP5747574B2/ja active Active
- 2011-08-25 US US13/217,685 patent/US8754718B2/en active Active
- 2011-08-26 KR KR1020110085576A patent/KR101227837B1/ko active IP Right Grant
- 2011-08-31 CN CN2011203333516U patent/CN202261167U/zh not_active Expired - Fee Related
- 2011-08-31 CN CN201310219340.9A patent/CN103354441B/zh active Active
- 2011-08-31 TW TW100131346A patent/TWI521860B/zh active
- 2011-08-31 TW TW104142156A patent/TWI565224B/zh active
- 2011-08-31 CN CN201511021041.XA patent/CN105634472B/zh active Active
- 2011-08-31 CN CN201110264290.7A patent/CN102684602B/zh active Active
-
2012
- 2012-10-05 KR KR1020120110419A patent/KR101759284B1/ko active IP Right Grant
-
2013
- 2013-05-31 US US13/906,683 patent/US9054604B2/en active Active
-
2014
- 2014-01-13 US US14/153,388 patent/US9160254B2/en active Active
- 2014-05-02 US US14/268,447 patent/US9685889B2/en active Active
-
2017
- 2017-05-18 US US15/598,762 patent/US10715058B2/en active Active
- 2017-07-12 KR KR1020170088411A patent/KR101854219B1/ko active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5500628A (en) * | 1995-01-24 | 1996-03-19 | Motorola, Inc. | Double-sided oscillator package and method of coupling components thereto |
US7382204B2 (en) * | 2005-03-28 | 2008-06-03 | Nihon Dempa Kogyo Co., Ltd. | Constant temperature crystal oscillator |
US7471162B2 (en) * | 2006-04-24 | 2008-12-30 | Nihon Dempa Kogyo Co., Ltd. | Surface mount type temperature-compensated crystal oscillator |
US20090212878A1 (en) * | 2008-02-21 | 2009-08-27 | Junichi Arai | Oven-controlled crystal oscillator |
Non-Patent Citations (2)
Title |
---|
SEIKO EPSON CORP.," THE CRYSTAL MASTER product catalog",2001年 * |
Y. Ueno and H. Shimizu, "Voltage controlled temperature compensated crystal oscillator using 2-port crystal resonator," Frequency Control, 1991., Proceedings of the 45th Annual Symposium on, Los Angeles, CA, 1991, pp. 418-425. * |
Also Published As
Publication number | Publication date |
---|---|
JP5747574B2 (ja) | 2015-07-15 |
US20170264214A1 (en) | 2017-09-14 |
US9054604B2 (en) | 2015-06-09 |
TW201614955A (en) | 2016-04-16 |
US9685889B2 (en) | 2017-06-20 |
US20140125420A1 (en) | 2014-05-08 |
TWI521860B (zh) | 2016-02-11 |
KR20120127366A (ko) | 2012-11-21 |
KR101854219B1 (ko) | 2018-05-03 |
KR20120103401A (ko) | 2012-09-19 |
CN102684602B (zh) | 2016-01-20 |
CN103354441A (zh) | 2013-10-16 |
US10715058B2 (en) | 2020-07-14 |
KR20170086434A (ko) | 2017-07-26 |
CN105634472A (zh) | 2016-06-01 |
CN102684602A (zh) | 2012-09-19 |
TW201238236A (en) | 2012-09-16 |
US20120229225A1 (en) | 2012-09-13 |
JP2012191484A (ja) | 2012-10-04 |
US20130257555A1 (en) | 2013-10-03 |
KR101759284B1 (ko) | 2017-07-18 |
CN202261167U (zh) | 2012-05-30 |
CN103354441B (zh) | 2016-12-28 |
CN105634472B (zh) | 2018-10-30 |
US8754718B2 (en) | 2014-06-17 |
US20140239773A1 (en) | 2014-08-28 |
KR101227837B1 (ko) | 2013-01-31 |
US9160254B2 (en) | 2015-10-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI565224B (zh) | 壓電裝置及電子機器 | |
JP6175242B2 (ja) | 圧電デバイス | |
JP2013219539A (ja) | 温度補償型圧電発振器 | |
JP6288118B2 (ja) | 電子機器 | |
JP2010035078A (ja) | 圧電発振器 | |
JP2003163540A (ja) | 表面実装型水晶発振器 | |
JP5924365B2 (ja) | 圧電デバイス及び電子機器 | |
JP4654837B2 (ja) | 表面実装型圧電発振器用パッケージ、表面実装型圧電発振器 | |
JP6610641B2 (ja) | 電子機器 | |
JP2007096373A (ja) | 表面実装型圧電発振器用パッケージ、及び表面実装型圧電発振器 | |
JP2000114877A (ja) | 圧電発振器 | |
JP2010035077A (ja) | 圧電発振器 | |
JP2005268257A (ja) | 電子部品収納用パッケージおよび電子装置 | |
JP2003258554A (ja) | 温度補償型圧電発振器 | |
JP5468240B2 (ja) | 表面実装用とした温度補償水晶発振器 | |
JP2003224425A (ja) | 温度補償型圧電発振器 | |
WO2021199790A1 (ja) | 恒温槽型圧電発振器 | |
JP2023080598A (ja) | 発振器 |