TWI534164B - A hardened resin composition, a hardened product thereof, and a printed wiring board using the same - Google Patents

A hardened resin composition, a hardened product thereof, and a printed wiring board using the same Download PDF

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Publication number
TWI534164B
TWI534164B TW101113018A TW101113018A TWI534164B TW I534164 B TWI534164 B TW I534164B TW 101113018 A TW101113018 A TW 101113018A TW 101113018 A TW101113018 A TW 101113018A TW I534164 B TWI534164 B TW I534164B
Authority
TW
Taiwan
Prior art keywords
carboxyl group
compound
resin
group
resin composition
Prior art date
Application number
TW101113018A
Other languages
English (en)
Chinese (zh)
Other versions
TW201302831A (zh
Inventor
Kazunori Nishio
Takahiro Yoshida
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Publication of TW201302831A publication Critical patent/TW201302831A/zh
Application granted granted Critical
Publication of TWI534164B publication Critical patent/TWI534164B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/30—Low-molecular-weight compounds
    • C08G18/34—Carboxylic acids; Esters thereof with monohydroxyl compounds
    • C08G18/348—Hydroxycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
    • C08G18/44—Polycarbonates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/67—Unsaturated compounds having active hydrogen
    • C08G18/671—Unsaturated compounds having only one group containing active hydrogen
    • C08G18/672—Esters of acrylic or alkyl acrylic acid having only one group containing active hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C08L101/06—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing oxygen atoms
    • C08L101/08—Carboxyl groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
    • C09D175/04—Polyurethanes
    • C09D175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C09D175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Materials For Photolithography (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Polymerisation Methods In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW101113018A 2011-04-13 2012-04-12 A hardened resin composition, a hardened product thereof, and a printed wiring board using the same TWI534164B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011088929 2011-04-13
JP2011088928 2011-04-13

Publications (2)

Publication Number Publication Date
TW201302831A TW201302831A (zh) 2013-01-16
TWI534164B true TWI534164B (zh) 2016-05-21

Family

ID=47009297

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101113018A TWI534164B (zh) 2011-04-13 2012-04-12 A hardened resin composition, a hardened product thereof, and a printed wiring board using the same

Country Status (5)

Country Link
JP (1) JP5838200B2 (ko)
KR (1) KR101493640B1 (ko)
CN (1) CN103459504B (ko)
TW (1) TWI534164B (ko)
WO (1) WO2012141124A1 (ko)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5841570B2 (ja) * 2012-10-19 2016-01-13 太陽インキ製造株式会社 硬化性樹脂組成物、ソルダーレジスト形成用硬化性樹脂組成物、硬化塗膜およびプリント配線板
JP6071108B2 (ja) * 2013-03-13 2017-02-01 荒川化学工業株式会社 光硬化型樹脂組成物およびこれを用いて得られる光学用フィルム
JP5624184B1 (ja) * 2013-06-28 2014-11-12 太陽インキ製造株式会社 ドライフィルムおよびプリント配線板
US9303828B2 (en) 2013-07-31 2016-04-05 E I Du Pont De Nemours And Company Flexible white reflective dielectric for electronic circuits
KR20150093595A (ko) * 2014-02-07 2015-08-18 다이요 잉키 세이조 가부시키가이샤 경화성 수지 조성물, 그의 경화 피막, 및 이것을 구비한 가식 유리판
JP6192556B2 (ja) * 2014-02-07 2017-09-06 太陽インキ製造株式会社 硬化性樹脂組成物、その硬化皮膜、およびこれを備えた加飾ガラス板
JP2015147908A (ja) * 2014-02-07 2015-08-20 太陽インキ製造株式会社 硬化性樹脂組成物、その硬化皮膜、およびこれを備えた加飾ガラス板
CN104570606B (zh) * 2014-12-24 2019-05-31 欧利生东邦涂料（东莞）有限公司 光固化热固化性组合物及其制备方法以及印刷线路板用油墨
WO2016157587A1 (ja) * 2015-03-31 2016-10-06 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
CN106918988B (zh) * 2015-12-25 2021-04-20 太阳油墨（苏州）有限公司 固化性树脂组合物以及使用了其的反射膜和印刷电路板
CN107609625B (zh) * 2017-07-25 2020-06-30 浙江海洋大学 小丑鱼无线标签的处理装置
JP7059598B2 (ja) * 2017-12-04 2022-04-26 日立金属株式会社 被覆材料、ケーブル、及びケーブルの製造方法
JP6774730B2 (ja) * 2018-03-15 2020-10-28 株式会社タムラ製作所 白色樹脂組成物
CN109666287B (zh) * 2018-12-25 2021-04-06 陕西科技大学 一种无溶剂型水性聚氨酯/磺化杯芳烃改性水滑石纳米复合材料及其制备方法
JP7165473B2 (ja) * 2018-12-27 2022-11-04 太陽インキ製造株式会社 硬化性樹脂組成物、これを用いたドライフィルムおよび硬化物、並びにこれを有する電子部品

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JPH0832857B2 (ja) * 1987-06-10 1996-03-29 ユ−ホ−ケミカル株式会社 被覆剤組成物
JP3050677B2 (ja) * 1991-12-04 2000-06-12 大日精化工業株式会社 ウレタン尿素樹脂及び該樹脂を用いた印刷インキ
JPH11100528A (ja) * 1997-09-26 1999-04-13 Dainippon Ink & Chem Inc 活性エネルギー線硬化性水性組成物
JP2000345131A (ja) * 1999-06-03 2000-12-12 Nippon Synthetic Chem Ind Co Ltd:The 再剥離型粘着剤組成物
JP4446516B2 (ja) * 1999-07-09 2010-04-07 日本合成化学工業株式会社 再剥離型粘着剤組成物
JP2006011395A (ja) * 2004-05-26 2006-01-12 Showa Denko Kk 感光性樹脂組成物、その硬化物及び用途
JPWO2006004158A1 (ja) * 2004-07-07 2008-04-24 太陽インキ製造株式会社 光硬化性・熱硬化性樹脂組成物とそれを用いたドライフィルム、及びその硬化物
WO2007105713A1 (ja) * 2006-03-16 2007-09-20 Showa Denko K.K. 熱硬化性樹脂組成物、フレキシブル回路基板用オーバーコート剤および表面保護膜
JP4340272B2 (ja) * 2006-05-30 2009-10-07 太陽インキ製造株式会社 光硬化性・熱硬化性ソルダーレジスト組成物およびそれを用いたプリント配線板
JP4538484B2 (ja) * 2006-10-24 2010-09-08 太陽インキ製造株式会社 光硬化性熱硬化性樹脂組成物およびそれを用いたプリント配線板
TWI357536B (en) * 2006-10-24 2012-02-01 Taiyo Ink Mfg Co Ltd Photosetting and thermosetting solder resist ink c
JP5043577B2 (ja) * 2007-09-27 2012-10-10 太陽ホールディングス株式会社 熱硬化性樹脂組成物及びその硬化物
JP5355918B2 (ja) * 2008-03-26 2013-11-27 太陽ホールディングス株式会社 熱硬化性樹脂組成物、その硬化物及びそれを用いたプリント配線板
JP5760304B2 (ja) * 2008-10-03 2015-08-05 Dic株式会社 水性複合樹脂組成物及びコーティング剤
JP5377021B2 (ja) * 2009-03-23 2013-12-25 太陽ホールディングス株式会社 硬化性樹脂組成物、それを用いたドライフィルム及びプリント配線板
JP6061440B2 (ja) * 2010-02-25 2017-01-18 太陽ホールディングス株式会社 ポリエステル基材用樹脂組成物、それを用いたドライフィルム及びプリント配線板
JP5411027B2 (ja) * 2010-03-09 2014-02-12 三井化学株式会社 水分散体

Also Published As

Publication number Publication date
TW201302831A (zh) 2013-01-16
JP5838200B2 (ja) 2016-01-06
KR20130140881A (ko) 2013-12-24
JPWO2012141124A1 (ja) 2014-07-28
CN103459504B (zh) 2015-12-09
CN103459504A (zh) 2013-12-18
WO2012141124A1 (ja) 2012-10-18
KR101493640B1 (ko) 2015-02-13

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