JP6463079B2 - 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板 - Google Patents
硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板 Download PDFInfo
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- JP6463079B2 JP6463079B2 JP2014219107A JP2014219107A JP6463079B2 JP 6463079 B2 JP6463079 B2 JP 6463079B2 JP 2014219107 A JP2014219107 A JP 2014219107A JP 2014219107 A JP2014219107 A JP 2014219107A JP 6463079 B2 JP6463079 B2 JP 6463079B2
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- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 1
- GVALZJMUIHGIMD-UHFFFAOYSA-H magnesium phosphate Chemical compound [Mg+2].[Mg+2].[Mg+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O GVALZJMUIHGIMD-UHFFFAOYSA-H 0.000 description 1
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- 238000000206 photolithography Methods 0.000 description 1
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- 229920003023 plastic Polymers 0.000 description 1
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- 229920001610 polycaprolactone Polymers 0.000 description 1
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- 229920000728 polyester Polymers 0.000 description 1
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- 229920000193 polymethacrylate Polymers 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
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- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
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- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
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- 229910052624 sepiolite Inorganic materials 0.000 description 1
- 235000019355 sepiolite Nutrition 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000002893 slag Substances 0.000 description 1
- 239000010802 sludge Substances 0.000 description 1
- 239000001488 sodium phosphate Substances 0.000 description 1
- 229910000162 sodium phosphate Inorganic materials 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- 229910052938 sodium sulfate Inorganic materials 0.000 description 1
- 235000011152 sodium sulphate Nutrition 0.000 description 1
- 239000011973 solid acid Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 150000003464 sulfur compounds Chemical class 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
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- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 238000012719 thermal polymerization Methods 0.000 description 1
- AYEKOFBPNLCAJY-UHFFFAOYSA-O thiamine pyrophosphate Chemical compound CC1=C(CCOP(O)(=O)OP(O)(O)=O)SC=[N+]1CC1=CN=C(C)N=C1N AYEKOFBPNLCAJY-UHFFFAOYSA-O 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- KUAZQDVKQLNFPE-UHFFFAOYSA-N thiram Chemical compound CN(C)C(=S)SSC(=S)N(C)C KUAZQDVKQLNFPE-UHFFFAOYSA-N 0.000 description 1
- 229960002447 thiram Drugs 0.000 description 1
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- 239000010936 titanium Substances 0.000 description 1
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- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- CENHPXAQKISCGD-UHFFFAOYSA-N trioxathietane 4,4-dioxide Chemical compound O=S1(=O)OOO1 CENHPXAQKISCGD-UHFFFAOYSA-N 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
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- 239000008096 xylene Substances 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
- UGZADUVQMDAIAO-UHFFFAOYSA-L zinc hydroxide Chemical compound [OH-].[OH-].[Zn+2] UGZADUVQMDAIAO-UHFFFAOYSA-L 0.000 description 1
- 229910021511 zinc hydroxide Inorganic materials 0.000 description 1
- 229940007718 zinc hydroxide Drugs 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Landscapes
- Materials For Photolithography (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Description
前記(A)カルボキシル基含有樹脂に含まれるカルボキシル基の1当量に対し、前記(C)トリグリシジルイソシアヌレートに含まれるエポキシ基の当量比が、2.0以下であることを特徴とするものである。
また、一般的に、カルボキシル基含有樹脂とエポキシ樹脂とを含む硬化性樹脂組成物は、カルボキシル基含有樹脂を含む液とエポキシ樹脂を含む液とに分けて保管するが、本発明の硬化性樹脂組成物では、(A)カルボキシル基含有樹脂と、(C)S−トリアジン環骨格面に対し3個のエポキシ基が同一方向に結合した構造をもつβ体のみからなるトリグリシジルイソシアヌレートとを、分けることなく1液型とすることができる。
まず、本発明の硬化性樹脂組成物の各成分について説明する。なお、本明細書において、(メタ)アクリレートとは、アクリレート、メタクリレートおよびそれらの混合物を総称する用語であり、他の類似の表現についても同様である。
本発明の硬化性樹脂組成物は、(A)カルボキシル基含有樹脂を含有する。(A)カルボキシル基含有樹脂としては、公知のカルボキシル基を含む樹脂を用いることができる。カルボキシル基の存在により、組成物をアルカリ現像性とすることができる。また、本発明の組成物を光硬化性にすることや耐現像性の観点から、(A)カルボキシル基含有樹脂は、カルボキシル基の他に、分子内にエチレン性不飽和結合を有することが好ましいが、エチレン性不飽和二重結合を有さないカルボキシル基含有樹脂のみを用いることもできる。(A)カルボキシル基含有樹脂は、芳香環を有しても有さなくてもよい。
(A)カルボキシル基含有樹脂としては、エチレン性不飽和二重結合を有するカルボキシル基含有樹脂、および、エチレン性不飽和二重結合を有さないカルボキシル基含有樹脂のいずれも好適に用いることができる。本発明においては、エチレン性不飽和二重結合を有するカルボキシル基含有樹脂とエチレン性不飽和二重結合を有さないカルボキシル基含有樹脂を併用することも好ましい。
本発明の硬化性樹脂組成物は、(B)光重合開始剤を含有する。(B)光重合開始剤としては、光重合開始剤や光ラジカル発生剤として公知の光重合開始剤であれば、いずれのものを用いることもできる。
本発明の硬化性樹脂組成物は、熱硬化性成分として、芳香環を有さない複素環式エポキシ樹脂である、(C)S−トリアジン環骨格面に対し3個のエポキシ基が同一方向に結合した構造をもつβ体のみからなるトリグリシジルイソシアヌレートを含有する。これにより、無機充填物の比重や配合量によらず、良好なアルカリ現像性を確保することができるとともに、はんだ耐熱性、保存安定性、変色耐性および指触乾燥性に優れた硬化性樹脂組成物を得ることができる。(C)トリグリシジルイソシアヌレートとして、S−トリアジン環骨格面に対し3個のエポキシ基が異なる方向に結合した構造をもつα体を含むものを用いると、エポキシ基自体の骨格は同じであるものの、エポキシ基が向いている方向によって作用に差異が生じ、本発明の所期の効果が得られなくなる。
本発明の硬化性樹脂組成物は、(D)無機充填物を含有する。(D)無機充填物としては、例えば、酸化チタン、水酸化アルミニウム、水酸化マグネシウム、炭酸カルシウム、炭酸マグネシウム、フライアッシュ、天然シリカ、合成シリカ、カオリン、酸化カルシウム、酸化マグネシウム、酸化亜鉛、硫酸バリウム、アルミナ、タルク、マイカ、ハイドロタルサイト、ベーマイト、水酸化カルシウム、ウォラストナイト、チタン酸カリウム、チタン酸バリウム、硫酸マグネシウム、硫酸カルシウム、セピオライト、銅、鉄、カーボンブラック、酸化アルミニウム、酸化ジルコニウム、酸化アンチモン、鉛白、水酸化亜鉛、硫化亜鉛、チタン酸鉛、窒化アルミニウム、窒化ケイ素、窒化チタン、ダイヤモンド粉末、ケイ酸ジルコニウム、雲母粉、硫酸鉛、フッ化セリウム、酸化セリウム、ホスフィン酸アルミニウム塩、珪酸アルミニウム、珪酸マグネシウム、ケイ酸カルシウム、クレー、焼成タルク、燐酸マグネシウム、ゾノライト、窒化ホウ素、ホウ酸アルミニウム、シリカバルーン、ガラスフレーク、ガラスバルーン、無定形シリカ、結晶性シリカ、溶融シリカ、球状シリカ、製鉄スラグ、酸化鉄、センダスト、アルニコ磁石、各種フェライト等の磁性粉、セメント、ガラス粉末、脱水汚泥、ノイブルグ珪土、珪藻土、三酸化アンチモン、マグネシウムオキシサルフェイト、水和アルミニウム、水和石膏、ミョウバン、ホスフィン酸アルミニウム塩などのリン含有金属塩等が挙げられる。これらの無機充填物は、1種を単独で用いてもよく、2種以上を組み合わせて用いてもよい。
本発明の硬化性樹脂組成物は、さらに、(E)酸化防止剤を含有することが好ましい。(E)酸化防止剤を含有させることで、通常、カルボキシル基含有樹脂等の酸化劣化を防止して、変色を抑制する効果が得られることが知られているが、本発明者は、この効果に加えて、耐熱性が向上するとともに、解像性(線幅再現性)が良好になるとの効果が得られることを見出した。すなわち、(E)無機充填物の種類によっては、光を反射し吸収することにより、解像性を悪化させる場合があるが、(E)酸化防止剤を含有させることで、(D)無機充填物の種類によらず、良好な解像性を得ることができるものとなる。
下記の表中に示す配合に従い、各成分を配合し、攪拌機にて予備混合した後、3本ロールミルで分散させ、混練して、それぞれ組成物を調製した。なお、表中の配合量は、質量部を示す。
(ワニスAの合成例)
ジエチレングリコールモノエチルエーテルアセテート600gに、オルソクレゾールノボラック型エポキシ樹脂(大日本インキ化学工業(株)製、EPICLON N−695、軟化点95℃、エポキシ当量214、平均官能基数7.6)1070g(グリシジル基数(芳香環総数):5.0モル)、アクリル酸360g(5.0モル)およびハイドロキノン1.5gを仕込み、100℃に加熱攪拌し、均一溶解した。次いで、トリフェニルホスフィン4.3gを仕込み、110℃に加熱して2時間反応後、120℃に昇温してさらに12時間反応を行った。得られた反応液に、芳香族系炭化水素(ソルベッソ150)415g、テトラヒドロ無水フタル酸456.0g(3.0モル)を仕込み、110℃で4時間反応を行い、冷却し、感光性のカルボキシル基含有樹脂溶液(ワニスA)を得た。
温度計、冷却管および撹拌機を備えた耐圧容器に、脱イオン水200質量部および硫酸ナトリウム0.3質量部を仕込み、溶解を確認した。その後、光重合開始剤としてのBPO(ベンゾイルパーオキサイド)5質量部と、連鎖移動剤としてのMSD(α−メチルスチレンダイマー)5質量部とをMMA(メタクリル酸メチル)10.4質量部、n−BA(ノルマル−アクリル酸ブチル)5質量部、MAA(メタクリル酸)24.6質量部およびSt(スチレン)60質量部からなる単量体混合物に加え、十分に溶解した。その後、分散剤を濃度が300ppmになるように加えて十分に撹拌し、釜内部を窒素で置換した後に昇温させ、懸濁重合を行った。
温度計、窒素導入装置兼アルキレンオキシド導入装置および撹拌装置を備えたオートクレーブに、ノボラック型クレゾール樹脂(昭和高分子(株)製、商品名「ショーノールC RG951」、OH当量:119.4)119.4g、水酸化カリウム1.19gおよびトルエン119.4gを仕込み、撹拌しつつ系内を窒素置換し、加熱昇温した。次に、プロピレンオキシド63.8gを徐々に滴下し、125〜132℃、0〜4.8kg/cm2で16時間反応させた。その後、室温まで冷却し、この反応溶液に89%リン酸1.56gを添加混合して水酸化カリウムを中和し、不揮発分62.1%、水酸基価が182.2g/eq.であるノボラック型クレゾール樹脂のプロピレンオキシド反応溶液を得た。これは、フェノール性水酸基1当量当りアルキレンオキシドが平均1.08モル付加しているものであった。
温度計、撹拌機および環流冷却器を備えた5リットルのセパラブルフラスコに、ポリマーポリオールとしてのポリカプロラクトンジオール(ダイセル化学工業(株)製、PLACCEL208、分子量830)1,245g、カルボキシル基を有するジヒドロキシル化合物としてのジメチロールプロピオン酸201g、ポリイソシアナートとしてのイソホロンジイソシアナート777gおよびヒドロキシル基を有する(メタ)アクリレートとしての2−ヒドロキシエチルアクリレート119g、さらにp−メトキシフェノールおよびジ−t−ブチル−ヒドロキシトルエンを各々0.5gずつ投入した。攪拌しながら60℃まで加熱して停止し、ジブチル錫ジラウレート0.8gを添加した。反応容器内の温度が低下し始めたら再度加熱して、80℃で攪拌を続け、赤外線吸収スペクトルでイソシアナート基の吸収スペクトル(2280cm−1)が消失したことを確認して反応を終了し、粘稠液体のウレタンアクリレート化合物を得た。カルビトールアセテートを用いて、不揮発分=50質量%に調整し、感光性のカルボキシル基含有樹脂溶液(ワニスD)を得た。
温度計、撹拌機、滴下ロートおよび還流冷却器を備えたフラスコに、溶媒としてのジプロピレングリコールモノメチルエーテル325.0質量部を110℃まで加熱し、メタクリル酸174.0質量部、ε−カプロラクトン変性メタクリル酸(平均分子量314)174.0質量部、メタクリル酸メチル77.0質量部、ジプロピレングリコールモノメチルエーテル222.0質量部、および、重合触媒としてのt−ブチルパーオキシ2−エチルヘキサノエート(日本油脂(株)製、パーブチルO)12.0質量部の混合物を、3時間かけて滴下し、さらに110℃で3時間攪拌し、重合触媒を失活させて、樹脂溶液を得た。この樹脂溶液を冷却後、ダイセル化学工業(株)製サイクロマーA200を289.0質量部、トリフェニルホスフィン3.0質量部およびハイドロキノンモノメチルエーテル1.3質量部を加え、100℃に昇温し、攪拌することによってエポキシ基の開環付加反応を行い、感光性のカルボキシル基含有樹脂溶液(ワニスE)を得た。
実施例および比較例の各組成物を、ふた付きのプラスチック製容器に入れて、30℃の恒温槽に90日放置し、25℃における初期粘度と放置後粘度とをそれぞれ測定して、初期から放置後までの粘度の増加率を算出し、保存安定性を評価した。
実施例および比較例の各組成物を、銅厚70μm、ラインアンドスペース100/100の銅回路が形成されたFR−4材に塗布し、80℃30分の条件で乾燥させて、乾燥基板を得た。この乾燥基板を、炭酸ナトリウム溶液で現像した後に、ライン間の組成物の残渣を目視にて評価した。判定基準は以下のとおりである。
○:残渣がないもの
△:僅かに残渣があるもの
×:残渣があるもの
実施例および比較例の各組成物を、バフロール研磨された銅張り積層板にスクリーン印刷にて全面塗布し、80℃で30分間乾燥させて、基板を作製した。その塗膜表面の指触乾燥性を、下記に従い評価した。
○:まったくベタつきがないもの
△:僅かにベタつきの有るもの
×:ベタつきのあるもの
実施例および比較例の各組成物を、FR−4材に塗布、乾燥、露光、現像、ポストキュアをして硬化させて得た基板にロジン系フラックスを塗布し、あらかじめ260℃に設定したはんだ槽に浸漬し、変性アルコールでフラックスを洗浄した後、目視によるレジスト層の膨れ・剥がれについて評価した。判定基準は以下のとおりである。
○:10秒間浸漬を3回以上繰り返しても剥がれが認められないもの
△:10秒間浸漬を3回以上繰り返すと少し剥がれるもの
×:10秒間浸漬を3回以内にレジスト層に膨れ、剥がれがあるもの
実施例および比較例の各組成物を、銅厚70μm、ラインアンドスペース300/300の銅回路が形成されたFR−4材に塗布、乾燥し、幅100μm、長さ2mmのラインが残るように露光、現像、ポストキュアをして硬化させて得た基板を裁断し、光学顕微鏡を用いて組成物の断面形状を確認した。組成物の最大幅を測長し、線幅の設計値である100μmよりどの程度変化しているかを、アンダーカットとして評価した。
アンダーカット(μm)=(最大線幅−100)÷2
◎:10μm以下のもの
○:20μm以下のもの
△:30μm未満のもの
×:30μm以上のもの
実施例および比較例の各組成物を、FR−4材に塗布、乾燥、露光、現像、ポストキュアをして硬化させて得た基板を、リフロー炉(最高285℃)で5回繰り返し処理した。色差計を用いて、処理前後の基板の変化率ΔEを求めた。判定基準は以下のとおりである。
◎:ΔEが2以下のもの
○:ΔEが3以下のもの
△:ΔEが4未満のもの
×:ΔEが4以上のもの
*2)(B−2)オキシムエステル系光重合開始剤「イルガキュアーOXE02」、BASFジャパン(株)製
*3)(B−3)アシルフォスフィンオキサイド系光重合開始剤「イルガキュアー819」、BASFジャパン(株)製
*4)ジエチレングリコールモノメチルエーテルアセテート
*5)(C−1)β体のみからなるトリグリシジルイソシアヌレート「TEPIC−HP エポキシ当量;100」、日産化学工業(株)製、
*6)(C−2)α体およびβ体混合トリグリシジルイソシアヌレート「TEPIC−S エポキシ当量;100」、日産化学工業(株)製
*7)(C−3)フェノールノボラック型エポキシ樹脂「N870 エポキシ当量;210」、DIC(株)製
*8)(D−1)酸化チタン「CR−90」、石原産業(株)製、(比重:4.0)
*9)(D−2)水酸化アルミニウム「H−42M」、昭和電工(株)製、(比重:2.4)
*10)(D−3)硫酸バリウム「B−30」、堺化学工業(株)製、(比重:4.5)
*11)(D−4)ホスフィン酸アルミニウム塩「エクソリットOP935」、クラリアントジャパン(株)製、(比重:1.35)
*12)(E−1)酸化防止剤「イルガノックス1010」、BASFジャパン(株)製、フェノール系
*13)ジペンタエリスリトールヘキサアクリレート、共栄社化学(株)製
*14)ジシアンジアミド
*15)メラミン、日産化学工業(株)製
*16)KS−66、信越シリコーン(株)製
*17)乾燥状態(固形分換算)における、組成物中の(A)カルボキシル基含有樹脂に含まれるカルボキシル基の当量(数)と、(B)トリグリシジルイソシアヌレートに含まれるエポキシ基の当量(数)との比(エポキシ基数/カルボキシル基数)である。
Claims (8)
- (A)カルボキシル基含有樹脂、(B)光重合開始剤、(C)S−トリアジン環骨格面に対し3個のエポキシ基が同一方向に結合した構造をもつβ体のみからなるトリグリシジルイソシアヌレート、および、(D)無機充填物を含有し、
前記(A)カルボキシル基含有樹脂に含まれるカルボキシル基の1当量に対し、前記(C)トリグリシジルイソシアヌレートに含まれるエポキシ基の当量比が、2.0以下であり、前記(A)カルボキシル基含有樹脂が、エチレン性不飽和二重結合を有さず、芳香環を有するカルボキシル基含有樹脂を含むことを特徴とする硬化性樹脂組成物。 - 前記(B)光重合開始剤が、アシルホスフィンオキサイド系光重合開始剤である請求項1記載の硬化性樹脂組成物。
- 前記(A)カルボキシル基含有樹脂に含まれるカルボキシル基の1当量に対し、前記(C)トリグリシジルイソシアヌレートに含まれるエポキシ基の当量比が、0.9以下である請求項1または2記載の硬化性樹脂組成物。
- (E)酸化防止剤をさらに含む請求項1〜3のうちいずれか一項記載の硬化性樹脂組成物。
- 銅上に塗布して用いられる請求項1〜4のうちいずれか一項記載の硬化性樹脂組成物。
- キャリアフィルム上に、請求項1〜5のうちいずれか一項記載の硬化性樹脂組成物を塗布、乾燥させて得られる樹脂層を有することを特徴とするドライフィルム。
- 請求項1〜5のうちいずれか一項記載の硬化性樹脂組成物、または、請求項6記載のドライフィルムの前記樹脂層を、光照射により硬化して得られることを特徴とする硬化物。
- 請求項7記載の硬化物を有することを特徴とするプリント配線板。
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