TWI496852B - Ceramic embryo chip and its manufacturing method - Google Patents
Ceramic embryo chip and its manufacturing method Download PDFInfo
- Publication number
- TWI496852B TWI496852B TW102146734A TW102146734A TWI496852B TW I496852 B TWI496852 B TW I496852B TW 102146734 A TW102146734 A TW 102146734A TW 102146734 A TW102146734 A TW 102146734A TW I496852 B TWI496852 B TW I496852B
- Authority
- TW
- Taiwan
- Prior art keywords
- ceramic green
- ceramic
- green sheet
- substrate
- weight
- Prior art date
Links
- 239000000919 ceramic Substances 0.000 title claims description 187
- 238000004519 manufacturing process Methods 0.000 title claims description 25
- 210000001161 mammalian embryo Anatomy 0.000 title description 2
- 239000000758 substrate Substances 0.000 claims description 69
- 239000002002 slurry Substances 0.000 claims description 47
- 229920000642 polymer Polymers 0.000 claims description 32
- 239000003795 chemical substances by application Substances 0.000 claims description 30
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 20
- 230000002209 hydrophobic effect Effects 0.000 claims description 18
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 16
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims description 16
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 15
- 229920000570 polyether Polymers 0.000 claims description 15
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims description 14
- 239000002245 particle Substances 0.000 claims description 13
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 7
- 239000006082 mold release agent Substances 0.000 claims description 5
- 239000002904 solvent Substances 0.000 claims description 4
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 2
- 235000013870 dimethyl polysiloxane Nutrition 0.000 claims description 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 2
- XTDKZSUYCXHXJM-UHFFFAOYSA-N 2-methoxyoxane Chemical compound COC1CCCCO1 XTDKZSUYCXHXJM-UHFFFAOYSA-N 0.000 claims 1
- 238000000034 method Methods 0.000 description 20
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 18
- 239000000463 material Substances 0.000 description 17
- 229920005989 resin Polymers 0.000 description 15
- 239000011347 resin Substances 0.000 description 15
- GPBBNPPLBQIADY-UHFFFAOYSA-N 4,4-dimethyloxane Chemical compound CC1(C)CCOCC1 GPBBNPPLBQIADY-UHFFFAOYSA-N 0.000 description 13
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 12
- 229920002799 BoPET Polymers 0.000 description 10
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 10
- -1 polysiloxane Polymers 0.000 description 10
- 125000000524 functional group Chemical group 0.000 description 6
- 239000012046 mixed solvent Substances 0.000 description 6
- 238000006116 polymerization reaction Methods 0.000 description 6
- VOQDCMULDZDDLP-UHFFFAOYSA-N 2-methoxy-2,3-dimethyloxane Polymers CC1C(OCCC1)(C)OC VOQDCMULDZDDLP-UHFFFAOYSA-N 0.000 description 5
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 5
- 230000002411 adverse Effects 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- NZZFYRREKKOMAT-UHFFFAOYSA-N diiodomethane Chemical compound ICI NZZFYRREKKOMAT-UHFFFAOYSA-N 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 239000004014 plasticizer Substances 0.000 description 4
- 229920000058 polyacrylate Polymers 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 3
- 150000005215 alkyl ethers Chemical class 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 239000004094 surface-active agent Substances 0.000 description 3
- DHXVGJBLRPWPCS-UHFFFAOYSA-N Tetrahydropyran Chemical compound C1CCOCC1 DHXVGJBLRPWPCS-UHFFFAOYSA-N 0.000 description 2
- 238000007646 gravure printing Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N o-dicarboxybenzene Natural products OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- DIIIISSCIXVANO-UHFFFAOYSA-N 1,2-Dimethylhydrazine Chemical class CNNC DIIIISSCIXVANO-UHFFFAOYSA-N 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 150000003973 alkyl amines Chemical class 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007607 die coating method Methods 0.000 description 1
- 125000000118 dimethyl group Polymers [H]C([H])([H])* 0.000 description 1
- 210000002257 embryonic structure Anatomy 0.000 description 1
- 125000001033 ether group Chemical group 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- MVZXIDCKTRPHIU-UHFFFAOYSA-N formic acid;phthalic acid Chemical compound OC=O.OC(=O)C1=CC=CC=C1C(O)=O MVZXIDCKTRPHIU-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B11/00—Apparatus or processes for treating or working the shaped or preshaped articles
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
- C04B35/632—Organic additives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Structural Engineering (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Inorganic Chemistry (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Producing Shaped Articles From Materials (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012282368 | 2012-12-26 | ||
JP2013251812A JP2014141394A (ja) | 2012-12-26 | 2013-12-05 | セラミックグリーンシートおよびその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201435020A TW201435020A (zh) | 2014-09-16 |
TWI496852B true TWI496852B (zh) | 2015-08-21 |
Family
ID=51423047
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW102146734A TWI496852B (zh) | 2012-12-26 | 2013-12-17 | Ceramic embryo chip and its manufacturing method |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2014141394A (ko) |
KR (1) | KR101586014B1 (ko) |
TW (1) | TWI496852B (ko) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6683295B1 (ja) * | 2018-08-10 | 2020-04-15 | 東洋紡株式会社 | セラミックグリーンシート製造用離型フィルム |
KR102048310B1 (ko) * | 2019-04-26 | 2020-01-08 | 오창용 | 겔캐스팅법을 이용한 세라믹 판재 제조 방법 및 장치 |
CN113185887B (zh) * | 2021-05-24 | 2022-05-17 | 山西吸睛科技有限公司 | 一种疏水/亲水型高分子脱模剂及其制备方法和应用 |
JP7353603B1 (ja) | 2022-05-17 | 2023-10-02 | 日機装株式会社 | セラミックグリーンシートの製造方法および複合体の製造方法 |
JP2024035379A (ja) | 2022-09-02 | 2024-03-14 | 富士フイルム株式会社 | 分散液、積層体、セラミックグリーンシートの製造方法、セラミックコンデンサの製造方法 |
KR102577497B1 (ko) * | 2022-11-28 | 2023-09-11 | 에스케이엔펄스 주식회사 | 반도체 소자 제조 장치용 부품, 이를 포함하는 반도체 소자 제조 장치 및 반도체 소자의 제조 방법 |
CN117417187B (zh) * | 2023-10-18 | 2024-05-28 | 重庆文理学院 | 一种固体电解质流延膜的制备方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW235932B (ko) * | 1992-08-18 | 1994-12-11 | Shinetsu Asutekku Kk | |
TW201144254A (en) * | 2010-01-26 | 2011-12-16 | Kuraray Co | Slurry composition for ceramic green sheet, ceramic green sheet, and multilayer ceramic capacitor |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03279255A (ja) * | 1990-03-29 | 1991-12-10 | Taiyo Yuden Co Ltd | セラミックグリーンシート用組成物、そのシート及びセラミック焼結体 |
JP3585530B2 (ja) * | 1994-05-18 | 2004-11-04 | 三洋化成工業株式会社 | バインダー組成物 |
JPH1086285A (ja) * | 1996-09-18 | 1998-04-07 | Teijin Ltd | 離形フィルム |
JPH10166532A (ja) * | 1996-12-09 | 1998-06-23 | Teijin Ltd | 離形フィルム |
JP2001093771A (ja) | 1999-09-20 | 2001-04-06 | Teijin Ltd | セラミックコンデンサー製造用キャリヤーシート |
JP3767362B2 (ja) * | 1999-12-13 | 2006-04-19 | 株式会社村田製作所 | 積層型セラミック電子部品の製造方法 |
JP3865204B2 (ja) * | 2001-05-14 | 2007-01-10 | Tdk株式会社 | セラミックグリーンシート用組成物 |
JP2004168556A (ja) * | 2002-11-15 | 2004-06-17 | Kyocera Corp | セラミックグリーンシート及びその製造方法 |
JP4415554B2 (ja) | 2003-03-26 | 2010-02-17 | 株式会社村田製作所 | 積層セラミック電子部品の製造方法 |
JP2005036084A (ja) * | 2003-07-18 | 2005-02-10 | Mitsubishi Chemicals Corp | 離型剤及び離型フィルム |
JP4604753B2 (ja) | 2004-03-30 | 2011-01-05 | 東レ株式会社 | 離型フィルム |
JP4347206B2 (ja) * | 2004-12-08 | 2009-10-21 | 電気化学工業株式会社 | セラミックシートの製造方法、それを用いたセラミック基板及びその用途 |
JP2009032380A (ja) * | 2007-03-05 | 2009-02-12 | Rohm & Haas Co | 硬化性組成物 |
JP5574118B2 (ja) | 2010-05-13 | 2014-08-20 | 株式会社村田製作所 | 積層型電子部品製造装置及び積層型電子部品の製造方法 |
JP2012184124A (ja) * | 2011-03-03 | 2012-09-27 | Tdk Corp | グリーンシート用塗料、グリーンシートの製造方法および電子部品の製造方法 |
-
2013
- 2013-12-05 JP JP2013251812A patent/JP2014141394A/ja active Pending
- 2013-12-17 TW TW102146734A patent/TWI496852B/zh active
- 2013-12-24 KR KR1020130162385A patent/KR101586014B1/ko active IP Right Grant
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW235932B (ko) * | 1992-08-18 | 1994-12-11 | Shinetsu Asutekku Kk | |
TW201144254A (en) * | 2010-01-26 | 2011-12-16 | Kuraray Co | Slurry composition for ceramic green sheet, ceramic green sheet, and multilayer ceramic capacitor |
Also Published As
Publication number | Publication date |
---|---|
TW201435020A (zh) | 2014-09-16 |
KR20140083900A (ko) | 2014-07-04 |
KR101586014B1 (ko) | 2016-01-15 |
JP2014141394A (ja) | 2014-08-07 |
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