TWI451077B - 外觀檢查裝置 - Google Patents

外觀檢查裝置 Download PDF

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Publication number
TWI451077B
TWI451077B TW097110342A TW97110342A TWI451077B TW I451077 B TWI451077 B TW I451077B TW 097110342 A TW097110342 A TW 097110342A TW 97110342 A TW97110342 A TW 97110342A TW I451077 B TWI451077 B TW I451077B
Authority
TW
Taiwan
Prior art keywords
illumination
peripheral
workpiece
visual inspection
inspection device
Prior art date
Application number
TW097110342A
Other languages
English (en)
Chinese (zh)
Other versions
TW200842344A (en
Inventor
Atsutoshi Yokota
Shunsuke Kurata
Original Assignee
Olympus Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Corp filed Critical Olympus Corp
Publication of TW200842344A publication Critical patent/TW200842344A/zh
Application granted granted Critical
Publication of TWI451077B publication Critical patent/TWI451077B/zh

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G01N21/9503—Wafer edge inspection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features

Landscapes

  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Microscoopes, Condenser (AREA)
TW097110342A 2007-03-27 2008-03-24 外觀檢查裝置 TWI451077B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007080546A JP5060808B2 (ja) 2007-03-27 2007-03-27 外観検査装置

Publications (2)

Publication Number Publication Date
TW200842344A TW200842344A (en) 2008-11-01
TWI451077B true TWI451077B (zh) 2014-09-01

Family

ID=39793721

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097110342A TWI451077B (zh) 2007-03-27 2008-03-24 外觀檢查裝置

Country Status (4)

Country Link
US (1) US20080239301A1 (https=)
JP (1) JP5060808B2 (https=)
CN (1) CN101276770B (https=)
TW (1) TWI451077B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI802962B (zh) * 2020-08-25 2023-05-21 日商Ｓｕｍｃｏ股份有限公司 半導體晶圓破裂的發生率減低方法

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US20110199480A1 (en) * 2009-07-09 2011-08-18 Camtek Ltd. Optical inspection system using multi-facet imaging
JP2011095148A (ja) * 2009-10-30 2011-05-12 Mec:Kk 欠陥検査装置
JP5563372B2 (ja) * 2010-05-20 2014-07-30 第一実業ビスウィル株式会社 外観検査装置
JP6067407B2 (ja) * 2013-02-20 2017-01-25 第一実業ビスウィル株式会社 検査装置
KR101525700B1 (ko) * 2013-12-09 2015-06-03 삼성전기주식회사 칩 부품의 외관 검사장치
KR101540885B1 (ko) 2014-07-29 2015-07-30 주식회사 엘지실트론 웨이퍼의 결함 측정장치
WO2017031710A1 (en) 2015-08-26 2017-03-02 Abb Schweiz Ag Object multi-perspective inspection apparatus and method therefor
CN107622963B (zh) * 2017-09-25 2019-11-01 武汉新芯集成电路制造有限公司 一种晶圆方向识别系统及晶圆传送盒
TWI838367B (zh) * 2018-05-01 2024-04-11 日商奈米系統解決股份有限公司 檢查裝置
IT201900016187A1 (it) * 2019-09-12 2021-03-12 Scm Group Spa Sistema di controllo per macchine bordatrici
EP3798621B1 (en) 2019-09-27 2022-11-23 SCHOTT Schweiz AG Apparatus for inspecting a pharmaceutical container
EP3797883B1 (en) 2019-09-27 2022-06-08 SCHOTT Schweiz AG Apparatus for inspecting a pharmaceutical container
EP3855175B1 (en) * 2020-01-23 2023-03-29 SCHOTT Pharma Schweiz AG Detection and characterization of defects in pharmaceutical cylindrical containers
JP2024158608A (ja) * 2023-04-28 2024-11-08 株式会社Ｓｃｒｅｅｎホールディングス 撮像装置、基板観察装置、基板処理装置および撮像方法
US20250297969A1 (en) * 2024-03-22 2025-09-25 Tokyo Electron Limited Reflecting non-planar surfaces integrated with laser scan for poseidon tool integration
CN119511609B (zh) * 2024-11-20 2025-12-26 上海御微半导体技术有限公司 轮廓背光切换装置及检测设备

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US20050013474A1 (en) * 2003-07-14 2005-01-20 August Technology Corp. Edge normal process
TW200702657A (en) * 2005-04-27 2007-01-16 Olympus Corp Visual inspection apparatus, visual inspection method, and circumference inspection unit attachable to visual inspection apparatus

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KR100579322B1 (ko) * 2003-11-28 2006-05-12 삼성코닝정밀유리 주식회사 유리기판의 커팅면 검사장치
US7280197B1 (en) * 2004-07-27 2007-10-09 Kla-Tehcor Technologies Corporation Wafer edge inspection apparatus
JP2006064975A (ja) * 2004-08-26 2006-03-09 Olympus Corp 顕微鏡および薄板エッジ検査装置
TWI388798B (zh) * 2004-11-30 2013-03-11 芝浦機械電子裝置股份有限公司 表面檢查裝置及表面檢查方法
JP4869590B2 (ja) * 2004-12-21 2012-02-08 オリンパス株式会社 画像処理装置、顕微鏡装置、検査装置および画像処理プログラム
JP4663725B2 (ja) * 2005-08-10 2011-04-06 株式会社レイテックス 端部傷検査装置
WO2007120491A2 (en) * 2006-04-03 2007-10-25 Rudolph Technologies, Inc. Wafer bevel inspection mechanism
JP2008008636A (ja) * 2006-06-27 2008-01-17 Reitetsukusu:Kk 端部検査装置の校正方法

Patent Citations (2)

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Publication number Priority date Publication date Assignee Title
US20050013474A1 (en) * 2003-07-14 2005-01-20 August Technology Corp. Edge normal process
TW200702657A (en) * 2005-04-27 2007-01-16 Olympus Corp Visual inspection apparatus, visual inspection method, and circumference inspection unit attachable to visual inspection apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI802962B (zh) * 2020-08-25 2023-05-21 日商Ｓｕｍｃｏ股份有限公司 半導體晶圓破裂的發生率減低方法

Also Published As

Publication number Publication date
JP2008241377A (ja) 2008-10-09
TW200842344A (en) 2008-11-01
JP5060808B2 (ja) 2012-10-31
US20080239301A1 (en) 2008-10-02
CN101276770B (zh) 2011-06-15
CN101276770A (zh) 2008-10-01

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