CN101276770B - 外观检查装置 - Google Patents

外观检查装置 Download PDF

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Publication number
CN101276770B
CN101276770B CN2008100879371A CN200810087937A CN101276770B CN 101276770 B CN101276770 B CN 101276770B CN 2008100879371 A CN2008100879371 A CN 2008100879371A CN 200810087937 A CN200810087937 A CN 200810087937A CN 101276770 B CN101276770 B CN 101276770B
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CN
China
Prior art keywords
light
illumination
appearance inspection
periphery
inspection device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CN2008100879371A
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English (en)
Chinese (zh)
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CN101276770A (zh
Inventor
横田敦俊
仓田俊辅
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Olympus Corp
Olympus Imaging Corp
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Olympus Corp
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Publication date
Application filed by Olympus Corp filed Critical Olympus Corp
Publication of CN101276770A publication Critical patent/CN101276770A/zh
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Publication of CN101276770B publication Critical patent/CN101276770B/zh
Expired - Fee Related legal-status Critical Current
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G01N21/9503—Wafer edge inspection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features

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  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Microscoopes, Condenser (AREA)
CN2008100879371A 2007-03-27 2008-03-25 外观检查装置 Expired - Fee Related CN101276770B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007080546A JP5060808B2 (ja) 2007-03-27 2007-03-27 外観検査装置
JP2007-080546 2007-03-27

Publications (2)

Publication Number Publication Date
CN101276770A CN101276770A (zh) 2008-10-01
CN101276770B true CN101276770B (zh) 2011-06-15

Family

ID=39793721

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008100879371A Expired - Fee Related CN101276770B (zh) 2007-03-27 2008-03-25 外观检查装置

Country Status (4)

Country Link
US (1) US20080239301A1 (https=)
JP (1) JP5060808B2 (https=)
CN (1) CN101276770B (https=)
TW (1) TWI451077B (https=)

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US20110199480A1 (en) * 2009-07-09 2011-08-18 Camtek Ltd. Optical inspection system using multi-facet imaging
JP2011095148A (ja) * 2009-10-30 2011-05-12 Mec:Kk 欠陥検査装置
JP5563372B2 (ja) * 2010-05-20 2014-07-30 第一実業ビスウィル株式会社 外観検査装置
JP6067407B2 (ja) * 2013-02-20 2017-01-25 第一実業ビスウィル株式会社 検査装置
KR101525700B1 (ko) * 2013-12-09 2015-06-03 삼성전기주식회사 칩 부품의 외관 검사장치
KR101540885B1 (ko) 2014-07-29 2015-07-30 주식회사 엘지실트론 웨이퍼의 결함 측정장치
WO2017031710A1 (en) 2015-08-26 2017-03-02 Abb Schweiz Ag Object multi-perspective inspection apparatus and method therefor
CN107622963B (zh) * 2017-09-25 2019-11-01 武汉新芯集成电路制造有限公司 一种晶圆方向识别系统及晶圆传送盒
TWI838367B (zh) * 2018-05-01 2024-04-11 日商奈米系統解決股份有限公司 檢查裝置
IT201900016187A1 (it) * 2019-09-12 2021-03-12 Scm Group Spa Sistema di controllo per macchine bordatrici
EP3798621B1 (en) 2019-09-27 2022-11-23 SCHOTT Schweiz AG Apparatus for inspecting a pharmaceutical container
EP3797883B1 (en) 2019-09-27 2022-06-08 SCHOTT Schweiz AG Apparatus for inspecting a pharmaceutical container
EP3855175B1 (en) * 2020-01-23 2023-03-29 SCHOTT Pharma Schweiz AG Detection and characterization of defects in pharmaceutical cylindrical containers
JP7351273B2 (ja) * 2020-08-25 2023-09-27 株式会社Sumco 半導体ウェーハの割れの発生率低減方法
JP2024158608A (ja) * 2023-04-28 2024-11-08 株式会社Ｓｃｒｅｅｎホールディングス 撮像装置、基板観察装置、基板処理装置および撮像方法
US20250297969A1 (en) * 2024-03-22 2025-09-25 Tokyo Electron Limited Reflecting non-planar surfaces integrated with laser scan for poseidon tool integration
CN119511609B (zh) * 2024-11-20 2025-12-26 上海御微半导体技术有限公司 轮廓背光切换装置及检测设备

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US6399957B1 (en) * 1998-11-30 2002-06-04 Nikon Corporation Method and apparatus for inspecting appearance of objects by irradiating illumination light on the objects
CN1473360A (zh) * 2001-09-19 2004-02-04 ���ְ�˹��ѧ��ҵ��ʽ���� 半导体晶片检查设备

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JPS63133006A (ja) * 1986-11-26 1988-06-04 Bridgestone Corp レタ−タイヤの判別装置
JP2738300B2 (ja) * 1994-06-20 1998-04-08 白柳式撰果機株式会社 塊状青果物のカメラ選別機に用いる間接照明型多面撮影装置
JP3282786B2 (ja) * 1996-07-29 2002-05-20 東芝セラミックス株式会社 ウエハの形状認識装置
JPH1183749A (ja) * 1997-09-01 1999-03-26 Fujitsu Ltd 半導体検査装置
JP2001208694A (ja) * 2000-01-31 2001-08-03 Toshiba Corp 試料処理装置および試料処理方法、フォトマスクの製造方法
JP3941375B2 (ja) * 2000-10-26 2007-07-04 ソニー株式会社 基板周縁検査方法、電子基板の製造方法および基板周縁検査装置
KR100389129B1 (ko) * 2001-03-06 2003-06-25 삼성전자주식회사 멀티 펑션 웨이퍼 얼라이너
JP3433739B2 (ja) * 2001-05-18 2003-08-04 オムロン株式会社 照射装置およびその照射装置を使用した基板検査装置
US6633379B2 (en) * 2001-06-08 2003-10-14 Semiconductor 300 Gmbh & Co. Kg Apparatus and method for measuring the degradation of a tool
JP3709426B2 (ja) * 2001-11-02 2005-10-26 日本エレクトロセンサリデバイス株式会社 表面欠陥検出方法および表面欠陥検出装置
JP3629244B2 (ja) * 2002-02-19 2005-03-16 本多エレクトロン株式会社 ウエーハ用検査装置
US6809808B2 (en) * 2002-03-22 2004-10-26 Applied Materials, Inc. Wafer defect detection system with traveling lens multi-beam scanner
JP4093460B2 (ja) * 2002-09-13 2008-06-04 Ｙｋｋ株式会社 複雑な形状をもつ物品の外観検査装置
US6947588B2 (en) * 2003-07-14 2005-09-20 August Technology Corp. Edge normal process
KR100579322B1 (ko) * 2003-11-28 2006-05-12 삼성코닝정밀유리 주식회사 유리기판의 커팅면 검사장치
US7280197B1 (en) * 2004-07-27 2007-10-09 Kla-Tehcor Technologies Corporation Wafer edge inspection apparatus
JP2006064975A (ja) * 2004-08-26 2006-03-09 Olympus Corp 顕微鏡および薄板エッジ検査装置
TWI388798B (zh) * 2004-11-30 2013-03-11 芝浦機械電子裝置股份有限公司 表面檢查裝置及表面檢查方法
JP4869590B2 (ja) * 2004-12-21 2012-02-08 オリンパス株式会社 画像処理装置、顕微鏡装置、検査装置および画像処理プログラム
JPWO2006118152A1 (ja) * 2005-04-27 2008-12-18 オリンパス株式会社 外観検査装置及び外観検査方法並びに外観検査装置に装着可能な周縁部検査ユニット
JP4663725B2 (ja) * 2005-08-10 2011-04-06 株式会社レイテックス 端部傷検査装置
WO2007120491A2 (en) * 2006-04-03 2007-10-25 Rudolph Technologies, Inc. Wafer bevel inspection mechanism
JP2008008636A (ja) * 2006-06-27 2008-01-17 Reitetsukusu:Kk 端部検査装置の校正方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6399957B1 (en) * 1998-11-30 2002-06-04 Nikon Corporation Method and apparatus for inspecting appearance of objects by irradiating illumination light on the objects
CN1473360A (zh) * 2001-09-19 2004-02-04 ���ְ�˹��ѧ��ҵ��ʽ���� 半导体晶片检查设备

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP特开2003-243465A 2003.08.29

Also Published As

Publication number Publication date
JP2008241377A (ja) 2008-10-09
TW200842344A (en) 2008-11-01
TWI451077B (zh) 2014-09-01
JP5060808B2 (ja) 2012-10-31
US20080239301A1 (en) 2008-10-02
CN101276770A (zh) 2008-10-01

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Granted publication date: 20110615

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