TWI265966B - Adhesive film for circuit connection, and circuit connection structure - Google Patents
Adhesive film for circuit connection, and circuit connection structureInfo
- Publication number
- TWI265966B TWI265966B TW093141476A TW93141476A TWI265966B TW I265966 B TWI265966 B TW I265966B TW 093141476 A TW093141476 A TW 093141476A TW 93141476 A TW93141476 A TW 93141476A TW I265966 B TWI265966 B TW I265966B
- Authority
- TW
- Taiwan
- Prior art keywords
- circuit connection
- adhesive film
- circuit
- connection structure
- film
- Prior art date
Links
- 239000002313 adhesive film Substances 0.000 title abstract 2
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 229920000642 polymer Polymers 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
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- A—HUMAN NECESSITIES
- A62—LIFE-SAVING; FIRE-FIGHTING
- A62C—FIRE-FIGHTING
- A62C35/00—Permanently-installed equipment
- A62C35/58—Pipe-line systems
- A62C35/68—Details, e.g. of pipes or valve systems
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
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- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04B—GENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
- E04B9/00—Ceilings; Construction of ceilings, e.g. false ceilings; Ceiling construction with regard to insulation
- E04B9/006—Ceilings; Construction of ceilings, e.g. false ceilings; Ceiling construction with regard to insulation with means for hanging lighting fixtures or other appliances to the framework of the ceiling
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16L—PIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
- F16L41/00—Branching pipes; Joining pipes to walls
- F16L41/02—Branch units, e.g. made in one piece, welded, riveted
- F16L41/03—Branch units, e.g. made in one piece, welded, riveted comprising junction pieces for four or more pipe members
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/4827—Materials
- H01L23/4828—Conductive organic material or pastes, e.g. conductive adhesives, inks
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- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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- C—CHEMISTRY; METALLURGY
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
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- H01L2224/0556—Disposition
- H01L2224/05568—Disposition the whole external layer protruding from the surface
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- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
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- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T428/2896—Adhesive compositions including nitrogen containing condensation polymer [e.g., polyurethane, polyisocyanate, etc.]
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004002326A JP2005194393A (ja) | 2004-01-07 | 2004-01-07 | 回路接続用接着フィルム及び回路接続構造体 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200530366A TW200530366A (en) | 2005-09-16 |
TWI265966B true TWI265966B (en) | 2006-11-11 |
Family
ID=34737115
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093141476A TWI265966B (en) | 2004-01-07 | 2004-12-30 | Adhesive film for circuit connection, and circuit connection structure |
Country Status (5)
Country | Link |
---|---|
US (2) | US7785708B2 (zh) |
JP (1) | JP2005194393A (zh) |
KR (1) | KR101242930B1 (zh) |
CN (1) | CN100416921C (zh) |
TW (1) | TWI265966B (zh) |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69836078T2 (de) * | 1997-03-31 | 2007-05-10 | Hitachi Chemical Co., Ltd. | Material zur verbindung von leiterplatten und verfahren zur verbindung von schaltungsanschlüssen |
US7604868B2 (en) * | 1997-03-31 | 2009-10-20 | Hitachi Chemical Company, Ltd. | Electronic circuit including circuit-connecting material |
US7605056B2 (en) | 2005-05-31 | 2009-10-20 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing a semiconductor device including separation by physical force |
JP4208863B2 (ja) * | 2005-06-30 | 2009-01-14 | 富士通マイクロエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
CN101233531B (zh) * | 2005-07-29 | 2012-05-30 | 株式会社半导体能源研究所 | 半导体装置的制造方法 |
JP4701963B2 (ja) * | 2005-09-27 | 2011-06-15 | 日本電気株式会社 | 表示装置 |
WO2007046189A1 (ja) * | 2005-10-18 | 2007-04-26 | Hitachi Chemical Company, Ltd. | 接着剤組成物、回路接続材料、回路接続部材の接続構造及び半導体装置 |
KR100811430B1 (ko) * | 2005-12-20 | 2008-03-07 | 제일모직주식회사 | 속경화형 이방성 도전 접착 필름용 조성물 및 이를 이용한이방성 도전 접착 필름 |
US20090133923A1 (en) * | 2006-03-09 | 2009-05-28 | Bridgestone Corporation | Process for preparing light transmissive electromagnetic wave shielding material, light transmissive electromagnetic wave shielding material and display filter |
JP2007335392A (ja) * | 2006-05-19 | 2007-12-27 | Hitachi Chem Co Ltd | 回路部材の接続方法 |
PL2223982T3 (pl) * | 2006-07-21 | 2012-06-29 | Hitachi Chemical Co Ltd | Materiał do łączenia obwodów, struktura łącząca elementy obwodów i sposób łączenia elementów obwodów |
JP4650456B2 (ja) * | 2006-08-25 | 2011-03-16 | 日立化成工業株式会社 | 回路接続材料、これを用いた回路部材の接続構造及びその製造方法 |
JP2008111091A (ja) * | 2006-10-06 | 2008-05-15 | Hitachi Chem Co Ltd | 接着剤フィルム及び回路接続材料 |
JP5141456B2 (ja) * | 2007-10-24 | 2013-02-13 | 日立化成工業株式会社 | 回路接続材料及び接続構造体 |
WO2009078409A1 (ja) * | 2007-12-17 | 2009-06-25 | Hitachi Chemical Company, Ltd. | 回路接続材料及び回路部材の接続構造 |
JP5073609B2 (ja) * | 2008-08-11 | 2012-11-14 | 日東電工株式会社 | 光導波路の製造方法 |
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-
2004
- 2004-01-07 JP JP2004002326A patent/JP2005194393A/ja active Pending
- 2004-12-30 TW TW093141476A patent/TWI265966B/zh not_active IP Right Cessation
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2005
- 2005-01-06 KR KR1020050001091A patent/KR101242930B1/ko active IP Right Grant
- 2005-01-06 US US11/029,628 patent/US7785708B2/en not_active Expired - Fee Related
- 2005-01-07 CN CNB2005100042363A patent/CN100416921C/zh not_active Expired - Fee Related
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KR20050072693A (ko) | 2005-07-12 |
KR101242930B1 (ko) | 2013-03-12 |
CN100416921C (zh) | 2008-09-03 |
US7776438B2 (en) | 2010-08-17 |
CN1638194A (zh) | 2005-07-13 |
TW200530366A (en) | 2005-09-16 |
JP2005194393A (ja) | 2005-07-21 |
US20080064849A1 (en) | 2008-03-13 |
US7785708B2 (en) | 2010-08-31 |
US20050151271A1 (en) | 2005-07-14 |
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