TWI251130B - Lithographic projection apparatus, gas purging method, device manufacturing method and purge gas supply system - Google Patents

Lithographic projection apparatus, gas purging method, device manufacturing method and purge gas supply system Download PDF

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Publication number
TWI251130B
TWI251130B TW093121654A TW93121654A TWI251130B TW I251130 B TWI251130 B TW I251130B TW 093121654 A TW093121654 A TW 093121654A TW 93121654 A TW93121654 A TW 93121654A TW I251130 B TWI251130 B TW I251130B
Authority
TW
Taiwan
Prior art keywords
purge gas
gas mixture
moisture
lithographic projection
substrate
Prior art date
Application number
TW093121654A
Other languages
English (en)
Chinese (zh)
Other versions
TW200530761A (en
Inventor
Der Net Antonius Johannes Van
Jeffrey Spiegelman
Bragt Johannus Josephus Van
Original Assignee
Asml Netherlands Bv
Entegris Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asml Netherlands Bv, Entegris Inc filed Critical Asml Netherlands Bv
Publication of TW200530761A publication Critical patent/TW200530761A/zh
Application granted granted Critical
Publication of TWI251130B publication Critical patent/TWI251130B/zh

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/18—Coatings for keeping optical surfaces clean, e.g. hydrophobic or photo-catalytic films
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/0006—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 with means to keep optical surfaces clean, e.g. by preventing or removing dirt, stains, contamination, condensation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70933—Purge, e.g. exchanging fluid or gas to remove pollutants
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70991—Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Optics & Photonics (AREA)
  • Toxicology (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Separation Using Semi-Permeable Membranes (AREA)
  • Fuel Cell (AREA)
  • Air Humidification (AREA)
  • Electron Beam Exposure (AREA)
TW093121654A 2003-07-21 2004-07-20 Lithographic projection apparatus, gas purging method, device manufacturing method and purge gas supply system TWI251130B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/623,180 US7384149B2 (en) 2003-07-21 2003-07-21 Lithographic projection apparatus, gas purging method and device manufacturing method and purge gas supply system

Publications (2)

Publication Number Publication Date
TW200530761A TW200530761A (en) 2005-09-16
TWI251130B true TWI251130B (en) 2006-03-11

Family

ID=34079792

Family Applications (3)

Application Number Title Priority Date Filing Date
TW093121654A TWI251130B (en) 2003-07-21 2004-07-20 Lithographic projection apparatus, gas purging method, device manufacturing method and purge gas supply system
TW096131640A TW200801848A (en) 2003-07-21 2004-07-21 Lithographic projection apparatus, gas purging method, device manufacturing method and purge gas supply system
TW093121732A TW200511389A (en) 2003-07-21 2004-07-21 Lithographic projection apparatus, gas purging method, device manufacturing method and purge gas supply system

Family Applications After (2)

Application Number Title Priority Date Filing Date
TW096131640A TW200801848A (en) 2003-07-21 2004-07-21 Lithographic projection apparatus, gas purging method, device manufacturing method and purge gas supply system
TW093121732A TW200511389A (en) 2003-07-21 2004-07-21 Lithographic projection apparatus, gas purging method, device manufacturing method and purge gas supply system

Country Status (9)

Country Link
US (4) US7384149B2 (enExample)
EP (3) EP1649325B1 (enExample)
JP (4) JP4487108B2 (enExample)
KR (3) KR100846184B1 (enExample)
CN (3) CN1853142B (enExample)
DE (1) DE602004027497D1 (enExample)
SG (1) SG141460A1 (enExample)
TW (3) TWI251130B (enExample)
WO (2) WO2005008339A2 (enExample)

Families Citing this family (124)

* Cited by examiner, † Cited by third party
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