TWD208179S - 基板處理裝置用晶舟之部分 - Google Patents

基板處理裝置用晶舟之部分 Download PDF

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Publication number
TWD208179S
TWD208179S TW108307123F TW108307123F TWD208179S TW D208179 S TWD208179 S TW D208179S TW 108307123 F TW108307123 F TW 108307123F TW 108307123 F TW108307123 F TW 108307123F TW D208179 S TWD208179 S TW D208179S
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TW
Taiwan
Prior art keywords
substrate processing
wafer boat
design
processing device
case
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TW108307123F
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English (en)
Chinese (zh)
Inventor
嶋田寛哲
上村大義
谷山智志
西堂周平
佐佐木史
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日商國際電氣股份有限公司
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Application filed by 日商國際電氣股份有限公司 filed Critical 日商國際電氣股份有限公司
Publication of TWD208179S publication Critical patent/TWD208179S/zh

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TW108307123F 2019-08-07 2019-11-21 基板處理裝置用晶舟之部分 TWD208179S (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-017637 2019-08-07
JPD2019-17637F JP1658652S (enrdf_load_stackoverflow) 2019-08-07 2019-08-07

Publications (1)

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TWD208179S true TWD208179S (zh) 2020-11-11

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TW108307123F TWD208179S (zh) 2019-08-07 2019-11-21 基板處理裝置用晶舟之部分

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US (1) USD939459S1 (enrdf_load_stackoverflow)
JP (1) JP1658652S (enrdf_load_stackoverflow)
TW (1) TWD208179S (enrdf_load_stackoverflow)

Cited By (7)

* Cited by examiner, † Cited by third party
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TWD222579S (zh) 2021-10-15 2022-12-11 日商信越化學工業股份有限公司 微小構造體和薄化晶圓處理用載體基板
TWD223130S (zh) 2021-10-15 2023-01-11 日商信越化學工業股份有限公司 微小構造體和薄化晶圓處理用載體基板
TWD223131S (zh) 2021-10-15 2023-01-11 日商信越化學工業股份有限公司 微小構造體和薄化晶圓處理用載體基板
TWD227572S (zh) 2021-10-15 2023-09-11 日商信越化學工業股份有限公司 微小構造體和薄化晶圓處理用載體基板
TWD227746S (zh) 2021-10-15 2023-09-21 日商信越化學工業股份有限公司 微小構造體和薄化晶圓處理用載體基板
TWD235000S (zh) 2023-12-19 2024-11-21 日商三菱電線工業股份有限公司 (日本) 金屬墊片
USD1054388S1 (en) 2021-10-15 2024-12-17 Shin-Etsu Chemical Co., Ltd. Carrier substrate for handling

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KR102552458B1 (ko) * 2019-07-31 2023-07-06 가부시키가이샤 코쿠사이 엘렉트릭 기판 처리 장치, 기판 지지구 및 반도체 장치의 제조 방법
USD989012S1 (en) * 2020-09-17 2023-06-13 Ebara Corporation Elastic membrane
USD1006768S1 (en) * 2021-01-07 2023-12-05 Solaero Technologies Corp. Semiconductor wafer for mosaic solar cell fabrication
USD1042374S1 (en) 2022-03-18 2024-09-17 Applied Materials, Inc. Support pipe for an interlocking process kit for a substrate processing chamber
USD1042373S1 (en) 2022-03-18 2024-09-17 Applied Materials, Inc. Sliding ring for an interlocking process kit for a substrate processing chamber
USD1055006S1 (en) * 2022-03-18 2024-12-24 Applied Materials, Inc. Support ring for an interlocking process kit for a substrate processing chamber
JP1731674S (enrdf_load_stackoverflow) * 2022-05-30 2022-12-08
JP1731673S (enrdf_load_stackoverflow) * 2022-05-30 2022-12-08
JP1731675S (enrdf_load_stackoverflow) * 2022-05-30 2022-12-08
USD1069863S1 (en) * 2022-08-04 2025-04-08 Applied Materials, Inc. Deposition ring of a process kit for semiconductor substrate processing
USD1064005S1 (en) * 2022-08-04 2025-02-25 Applied Materials, Inc. Grounding ring of a process kit for semiconductor substrate processing

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TWD133942S1 (zh) * 2008-03-28 2010-03-21 東京威力科創股份有限公司 晶舟
USD600221S1 (en) * 2008-03-28 2009-09-15 Tokyo Electron Limited Wafer boat
USD616396S1 (en) * 2009-03-12 2010-05-25 Tokyo Electron Limited Pedestal of heat insulating cylinder for manufacturing semiconductor wafers
USD655255S1 (en) * 2010-06-18 2012-03-06 Hitachi Kokusai Electric Inc. Boat of wafer processing apparatus
USD655682S1 (en) * 2010-06-18 2012-03-13 Hitachi Kokusai Electric Inc. Boat of wafer processing apparatus
USD734730S1 (en) * 2012-12-27 2015-07-21 Hitachi Kokusai Electric Inc. Boat of substrate processing apparatus
TWD166332S (zh) * 2013-03-22 2015-03-01 日立國際電氣股份有限公司 基板處理裝置用晶舟之部分
TWD163542S (zh) * 2013-03-22 2014-10-11 日立國際電氣股份有限公司 基板處理裝置用晶舟
TWD167988S (zh) * 2013-07-29 2015-05-21 日立國際電氣股份有限公司 半導體製造裝置用晶舟
TWD168827S (zh) * 2013-07-29 2015-07-01 日立國際電氣股份有限公司 半導體製造裝置用晶舟
TWD165429S (zh) * 2013-07-29 2015-01-11 日立國際電氣股份有限公司 半導體製造裝置用晶舟
JP1563649S (enrdf_load_stackoverflow) * 2016-02-12 2016-11-21
USD846514S1 (en) * 2018-05-03 2019-04-23 Kokusai Electric Corporation Boat of substrate processing apparatus
USD847105S1 (en) * 2018-05-03 2019-04-30 Kokusai Electric Corporation Boat of substrate processing apparatus

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD222579S (zh) 2021-10-15 2022-12-11 日商信越化學工業股份有限公司 微小構造體和薄化晶圓處理用載體基板
TWD223130S (zh) 2021-10-15 2023-01-11 日商信越化學工業股份有限公司 微小構造體和薄化晶圓處理用載體基板
TWD223131S (zh) 2021-10-15 2023-01-11 日商信越化學工業股份有限公司 微小構造體和薄化晶圓處理用載體基板
TWD227572S (zh) 2021-10-15 2023-09-11 日商信越化學工業股份有限公司 微小構造體和薄化晶圓處理用載體基板
TWD227746S (zh) 2021-10-15 2023-09-21 日商信越化學工業股份有限公司 微小構造體和薄化晶圓處理用載體基板
USD1054388S1 (en) 2021-10-15 2024-12-17 Shin-Etsu Chemical Co., Ltd. Carrier substrate for handling
TWD235000S (zh) 2023-12-19 2024-11-21 日商三菱電線工業股份有限公司 (日本) 金屬墊片

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JP1658652S (enrdf_load_stackoverflow) 2020-04-27
USD939459S1 (en) 2021-12-28

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