USD939459S1 - Boat for wafer processing apparatus - Google Patents

Boat for wafer processing apparatus Download PDF

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Publication number
USD939459S1
USD939459S1 US29/716,458 US201929716458F USD939459S US D939459 S1 USD939459 S1 US D939459S1 US 201929716458 F US201929716458 F US 201929716458F US D939459 S USD939459 S US D939459S
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United States
Prior art keywords
view
boat
processing apparatus
wafer processing
elevational view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/716,458
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English (en)
Inventor
Hironori Shimada
Daigi KAMIMURA
Tomoshi Taniyama
Shuhei SAIDO
Takafumi Sasaki
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Kokusai Electric Corp
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Kokusai Electric Corp
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Publication date
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Assigned to Kokusai Electric Corporation reassignment Kokusai Electric Corporation ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KAMIMURA, DAIGI, SAIDO, SHUHEI, SASAKI, TAKAFUMI, SHIMADA, HIRONORI, TANIYAMA, TOMOSHI
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US29/716,458 2019-08-07 2019-12-10 Boat for wafer processing apparatus Active USD939459S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPD2019-17637F JP1658652S (enrdf_load_stackoverflow) 2019-08-07 2019-08-07
JP2019-017637 2019-08-07

Publications (1)

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USD939459S1 true USD939459S1 (en) 2021-12-28

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ID=70335647

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US29/716,458 Active USD939459S1 (en) 2019-08-07 2019-12-10 Boat for wafer processing apparatus

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US (1) USD939459S1 (enrdf_load_stackoverflow)
JP (1) JP1658652S (enrdf_load_stackoverflow)
TW (1) TWD208179S (enrdf_load_stackoverflow)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210035835A1 (en) * 2019-07-31 2021-02-04 Kokusai Electric Corporation Substrate processing apparatus, substrate support, and method of manufacturing semiconductor device
USD989012S1 (en) * 2020-09-17 2023-06-13 Ebara Corporation Elastic membrane
USD1006768S1 (en) * 2021-01-07 2023-12-05 Solaero Technologies Corp. Semiconductor wafer for mosaic solar cell fabrication
USD1019581S1 (en) * 2022-05-30 2024-03-26 Kokusai Electric Corporation Inner tube of reaction tube for semiconductor manufacturing equipment
USD1019583S1 (en) * 2022-05-30 2024-03-26 Kokusai Electric Corporation Inner tube of reaction tube for semiconductor manufacturing equipment
USD1019582S1 (en) * 2022-05-30 2024-03-26 Kokusai Electric Corporation Inner tube of reaction tube for semiconductor manufacturing equipment
USD1042374S1 (en) 2022-03-18 2024-09-17 Applied Materials, Inc. Support pipe for an interlocking process kit for a substrate processing chamber
USD1042373S1 (en) 2022-03-18 2024-09-17 Applied Materials, Inc. Sliding ring for an interlocking process kit for a substrate processing chamber
USD1055006S1 (en) * 2022-03-18 2024-12-24 Applied Materials, Inc. Support ring for an interlocking process kit for a substrate processing chamber
USD1064005S1 (en) * 2022-08-04 2025-02-25 Applied Materials, Inc. Grounding ring of a process kit for semiconductor substrate processing
USD1069863S1 (en) * 2022-08-04 2025-04-08 Applied Materials, Inc. Deposition ring of a process kit for semiconductor substrate processing
USD1091489S1 (en) * 2021-04-14 2025-09-02 Kokusai Electric Corporation Boat of substrate processing apparatus

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1727916S (ja) 2021-10-15 2022-10-21 ハンドリング用キャリア基板
JP1724567S (ja) 2021-10-15 2022-09-12 ハンドリング用キャリア基板
JP1718604S (ja) 2021-10-15 2022-06-29 ハンドリング用キャリア基板
JP1718541S (ja) 2021-10-15 2022-06-29 ハンドリング用キャリア基板
USD1054388S1 (en) 2021-10-15 2024-12-17 Shin-Etsu Chemical Co., Ltd. Carrier substrate for handling
JP1724481S (ja) 2021-10-15 2022-09-12 ハンドリング用キャリア基板
JP1768691S (ja) 2023-12-19 2024-04-19 金属ガスケット

Citations (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD366868S (en) * 1993-09-29 1996-02-06 Tokyo Electron Kabushiki Kaisha Wafer boat or rack
USD378675S (en) * 1995-05-30 1997-04-01 Tokyo Electron Limited Wafer boat
USD378823S (en) * 1995-05-30 1997-04-15 Tokyo Electron Limited Wafer boat
USD380454S (en) * 1995-05-30 1997-07-01 Tokyo Electron Limited Wafer boat
US5752609A (en) * 1996-02-06 1998-05-19 Tokyo Electron Limited Wafer boat
USD404015S (en) * 1997-01-31 1999-01-12 Tokyo Electron Ltd. Wafer boat for use in a semiconductor wafer heat processing apparatus
USD404371S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Wafer boat for use in a semiconductor wafer heat processing apparatus
USD409158S (en) * 1997-08-20 1999-05-04 Tokyo Electron Limited Wafer boat for use in a semiconductor wafer heat processing apparatus
USD411176S (en) * 1997-08-20 1999-06-22 Tokyo Electron Limited Wafer boat for use in a semiconductor wafer heat processing apparatus
US6062853A (en) * 1996-02-29 2000-05-16 Tokyo Electron Limited Heat-treating boat for semiconductor wafers
US6065615A (en) * 1996-02-28 2000-05-23 Asahi Glass Company, Ltd. Vertical wafer boat
US6099302A (en) * 1998-06-23 2000-08-08 Samsung Electronics Co., Ltd. Semiconductor wafer boat with reduced wafer contact area
US6287112B1 (en) * 2000-03-30 2001-09-11 Asm International, N.V. Wafer boat
US6341935B1 (en) * 2000-06-14 2002-01-29 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer boat having improved wafer holding capability
US20020092815A1 (en) * 2001-01-18 2002-07-18 Hong-Guen Kim Semiconductor wafer boat having stackable independently replaceable boat parts and vertical heat-treating apparatus comprising the same
US20020113027A1 (en) * 2001-02-20 2002-08-22 Mitsubishi Denki Kabushiki Kaisha Retainer for use in heat treatment of substrate, substrate heat treatment equipment, and method of manufacturing the retainer
US6966771B2 (en) * 2001-12-27 2005-11-22 Tokyo Electron Limited Boat for heat treatment and vertical heat treatment equipment
US7033168B1 (en) * 2005-01-24 2006-04-25 Memc Electronic Materials, Inc. Semiconductor wafer boat for a vertical furnace
USD570309S1 (en) * 2006-10-25 2008-06-03 Tokyo Electron Limited Wafer boat
USD570308S1 (en) * 2006-05-01 2008-06-03 Tokyo Electron Limited Wafer boat
USD580894S1 (en) * 2006-05-01 2008-11-18 Tokyo Electron Limited Wafer boat
US7484958B2 (en) * 2003-07-16 2009-02-03 Shin-Etsu Handotai Co., Ltd. Vertical boat for heat treatment and method for producing the same
USD600221S1 (en) * 2008-03-28 2009-09-15 Tokyo Electron Limited Wafer boat
USD600222S1 (en) * 2008-03-28 2009-09-15 Tokyo Electron Limited Wafer boat
USD616396S1 (en) * 2009-03-12 2010-05-25 Tokyo Electron Limited Pedestal of heat insulating cylinder for manufacturing semiconductor wafers
US7857140B2 (en) * 2005-12-06 2010-12-28 Fujitsu Semiconductor Limited Semiconductor wafer storage case and semiconductor wafer storing method
USD655255S1 (en) * 2010-06-18 2012-03-06 Hitachi Kokusai Electric Inc. Boat of wafer processing apparatus
USD655682S1 (en) * 2010-06-18 2012-03-13 Hitachi Kokusai Electric Inc. Boat of wafer processing apparatus
USD734730S1 (en) * 2012-12-27 2015-07-21 Hitachi Kokusai Electric Inc. Boat of substrate processing apparatus
USD737785S1 (en) * 2013-07-29 2015-09-01 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD738329S1 (en) * 2013-07-29 2015-09-08 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD739831S1 (en) * 2013-03-22 2015-09-29 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD740769S1 (en) * 2013-03-22 2015-10-13 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD747279S1 (en) * 2013-07-29 2016-01-12 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD839219S1 (en) * 2016-02-12 2019-01-29 Kokusai Electric Corporation Boat for substrate processing apparatus
USD846514S1 (en) * 2018-05-03 2019-04-23 Kokusai Electric Corporation Boat of substrate processing apparatus
USD847105S1 (en) * 2018-05-03 2019-04-30 Kokusai Electric Corporation Boat of substrate processing apparatus

Patent Citations (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD366868S (en) * 1993-09-29 1996-02-06 Tokyo Electron Kabushiki Kaisha Wafer boat or rack
USD378675S (en) * 1995-05-30 1997-04-01 Tokyo Electron Limited Wafer boat
USD378823S (en) * 1995-05-30 1997-04-15 Tokyo Electron Limited Wafer boat
USD380454S (en) * 1995-05-30 1997-07-01 Tokyo Electron Limited Wafer boat
US5752609A (en) * 1996-02-06 1998-05-19 Tokyo Electron Limited Wafer boat
US6065615A (en) * 1996-02-28 2000-05-23 Asahi Glass Company, Ltd. Vertical wafer boat
US6062853A (en) * 1996-02-29 2000-05-16 Tokyo Electron Limited Heat-treating boat for semiconductor wafers
USD404015S (en) * 1997-01-31 1999-01-12 Tokyo Electron Ltd. Wafer boat for use in a semiconductor wafer heat processing apparatus
USD411176S (en) * 1997-08-20 1999-06-22 Tokyo Electron Limited Wafer boat for use in a semiconductor wafer heat processing apparatus
USD409158S (en) * 1997-08-20 1999-05-04 Tokyo Electron Limited Wafer boat for use in a semiconductor wafer heat processing apparatus
USD404371S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Wafer boat for use in a semiconductor wafer heat processing apparatus
US6099302A (en) * 1998-06-23 2000-08-08 Samsung Electronics Co., Ltd. Semiconductor wafer boat with reduced wafer contact area
US6287112B1 (en) * 2000-03-30 2001-09-11 Asm International, N.V. Wafer boat
US6341935B1 (en) * 2000-06-14 2002-01-29 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer boat having improved wafer holding capability
US20020092815A1 (en) * 2001-01-18 2002-07-18 Hong-Guen Kim Semiconductor wafer boat having stackable independently replaceable boat parts and vertical heat-treating apparatus comprising the same
US20020113027A1 (en) * 2001-02-20 2002-08-22 Mitsubishi Denki Kabushiki Kaisha Retainer for use in heat treatment of substrate, substrate heat treatment equipment, and method of manufacturing the retainer
US6966771B2 (en) * 2001-12-27 2005-11-22 Tokyo Electron Limited Boat for heat treatment and vertical heat treatment equipment
US7484958B2 (en) * 2003-07-16 2009-02-03 Shin-Etsu Handotai Co., Ltd. Vertical boat for heat treatment and method for producing the same
US7033168B1 (en) * 2005-01-24 2006-04-25 Memc Electronic Materials, Inc. Semiconductor wafer boat for a vertical furnace
US7857140B2 (en) * 2005-12-06 2010-12-28 Fujitsu Semiconductor Limited Semiconductor wafer storage case and semiconductor wafer storing method
USD570308S1 (en) * 2006-05-01 2008-06-03 Tokyo Electron Limited Wafer boat
USD580894S1 (en) * 2006-05-01 2008-11-18 Tokyo Electron Limited Wafer boat
USD570309S1 (en) * 2006-10-25 2008-06-03 Tokyo Electron Limited Wafer boat
USD600222S1 (en) * 2008-03-28 2009-09-15 Tokyo Electron Limited Wafer boat
USD600221S1 (en) * 2008-03-28 2009-09-15 Tokyo Electron Limited Wafer boat
USD616396S1 (en) * 2009-03-12 2010-05-25 Tokyo Electron Limited Pedestal of heat insulating cylinder for manufacturing semiconductor wafers
USD655255S1 (en) * 2010-06-18 2012-03-06 Hitachi Kokusai Electric Inc. Boat of wafer processing apparatus
USD655682S1 (en) * 2010-06-18 2012-03-13 Hitachi Kokusai Electric Inc. Boat of wafer processing apparatus
USD734730S1 (en) * 2012-12-27 2015-07-21 Hitachi Kokusai Electric Inc. Boat of substrate processing apparatus
USD740769S1 (en) * 2013-03-22 2015-10-13 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD739831S1 (en) * 2013-03-22 2015-09-29 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD738329S1 (en) * 2013-07-29 2015-09-08 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD737785S1 (en) * 2013-07-29 2015-09-01 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD747279S1 (en) * 2013-07-29 2016-01-12 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD839219S1 (en) * 2016-02-12 2019-01-29 Kokusai Electric Corporation Boat for substrate processing apparatus
USD846514S1 (en) * 2018-05-03 2019-04-23 Kokusai Electric Corporation Boat of substrate processing apparatus
USD847105S1 (en) * 2018-05-03 2019-04-30 Kokusai Electric Corporation Boat of substrate processing apparatus

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11929272B2 (en) * 2019-07-31 2024-03-12 Kokusai Electric Corporation Substrate processing apparatus, substrate support, and method of manufacturing semiconductor device
US20210035835A1 (en) * 2019-07-31 2021-02-04 Kokusai Electric Corporation Substrate processing apparatus, substrate support, and method of manufacturing semiconductor device
USD1021832S1 (en) 2020-09-17 2024-04-09 Ebara Corporation Elastic membrane
USD989012S1 (en) * 2020-09-17 2023-06-13 Ebara Corporation Elastic membrane
USD1006768S1 (en) * 2021-01-07 2023-12-05 Solaero Technologies Corp. Semiconductor wafer for mosaic solar cell fabrication
USD1091489S1 (en) * 2021-04-14 2025-09-02 Kokusai Electric Corporation Boat of substrate processing apparatus
USD1042373S1 (en) 2022-03-18 2024-09-17 Applied Materials, Inc. Sliding ring for an interlocking process kit for a substrate processing chamber
USD1042374S1 (en) 2022-03-18 2024-09-17 Applied Materials, Inc. Support pipe for an interlocking process kit for a substrate processing chamber
USD1055006S1 (en) * 2022-03-18 2024-12-24 Applied Materials, Inc. Support ring for an interlocking process kit for a substrate processing chamber
USD1019582S1 (en) * 2022-05-30 2024-03-26 Kokusai Electric Corporation Inner tube of reaction tube for semiconductor manufacturing equipment
USD1019583S1 (en) * 2022-05-30 2024-03-26 Kokusai Electric Corporation Inner tube of reaction tube for semiconductor manufacturing equipment
USD1019581S1 (en) * 2022-05-30 2024-03-26 Kokusai Electric Corporation Inner tube of reaction tube for semiconductor manufacturing equipment
USD1064005S1 (en) * 2022-08-04 2025-02-25 Applied Materials, Inc. Grounding ring of a process kit for semiconductor substrate processing
USD1069863S1 (en) * 2022-08-04 2025-04-08 Applied Materials, Inc. Deposition ring of a process kit for semiconductor substrate processing

Also Published As

Publication number Publication date
TWD208179S (zh) 2020-11-11
JP1658652S (enrdf_load_stackoverflow) 2020-04-27

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