USD1019582S1 - Inner tube of reaction tube for semiconductor manufacturing equipment - Google Patents

Inner tube of reaction tube for semiconductor manufacturing equipment Download PDF

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Publication number
USD1019582S1
USD1019582S1 US29/861,180 US202229861180F USD1019582S US D1019582 S1 USD1019582 S1 US D1019582S1 US 202229861180 F US202229861180 F US 202229861180F US D1019582 S USD1019582 S US D1019582S
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US
United States
Prior art keywords
semiconductor manufacturing
manufacturing equipment
tube
inner tube
reaction tube
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/861,180
Inventor
Atsushi Hirano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Electric Corp
Original Assignee
Kokusai Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Kokusai Electric Corp filed Critical Kokusai Electric Corp
Assigned to Kokusai Electric Corporation reassignment Kokusai Electric Corporation ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HIRANO, ATSUSHI
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Description

FIG. 1 is a front, top and right side perspective view of an inner tube of reaction tube for semiconductor manufacturing equipment showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a right side elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a rear elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is a cross-sectional view taken along line 8-8 in FIG. 2 .
The dash-dot broken lines in the drawings illustrate the boundary of the claim and form no part of the claimed design.
The dash-dash broken lines in the drawings illustrate portions of the article that form no part of the claimed design.

Claims (1)

    CLAIM
  1. I claim the ornamental design for an inner tube of reaction tube for semiconductor manufacturing equipment, as shown and described.
US29/861,180 2022-05-30 2022-11-28 Inner tube of reaction tube for semiconductor manufacturing equipment Active USD1019582S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022011410F JP1731674S (en) 2022-05-30 2022-05-30
JP2022011410D 2022-05-30

Publications (1)

Publication Number Publication Date
USD1019582S1 true USD1019582S1 (en) 2024-03-26

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ID=84322280

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US29/861,180 Active USD1019582S1 (en) 2022-05-30 2022-11-28 Inner tube of reaction tube for semiconductor manufacturing equipment

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US (1) USD1019582S1 (en)
JP (1) JP1731674S (en)
TW (1) TWD232582S (en)

Citations (47)

* Cited by examiner, † Cited by third party
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US5637153A (en) * 1993-04-30 1997-06-10 Tokyo Electron Limited Method of cleaning reaction tube and exhaustion piping system in heat processing apparatus
USD405430S (en) * 1997-01-31 1999-02-09 Tokyo Electron Limited Inner tube for use in a semiconductor wafer heat processing apparatus
USD423463S (en) * 1997-01-31 2000-04-25 Tokyo Electron Limited Quartz process tube
USD424024S (en) * 1997-01-31 2000-05-02 Tokyo Electron Limited Quartz process tube
USD551634S1 (en) * 2005-02-28 2007-09-25 Tokyo Electron Limited Wafer-boat for heat-processing of semiconductor wafers
USD552047S1 (en) * 2005-02-28 2007-10-02 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers
US20080205864A1 (en) * 2007-02-28 2008-08-28 Tokyo Electron Limited Heat processing furnace and vertical-type heat processing apparatus
US20080232787A1 (en) * 2007-03-20 2008-09-25 Takashi Ichikawa Heat processing furnace and vertical-type heat processing apparatus
USD594488S1 (en) * 2007-04-20 2009-06-16 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers
USD600659S1 (en) * 2006-09-12 2009-09-22 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers
USD610559S1 (en) * 2008-05-30 2010-02-23 Hitachi Kokusai Electric, Inc. Reaction tube
USD611013S1 (en) * 2008-03-28 2010-03-02 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers
USD619630S1 (en) * 2007-05-08 2010-07-13 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers
US20120186573A1 (en) * 2011-01-21 2012-07-26 Jdira Lucian C Thermal processing furnace and liner for the same
USD711843S1 (en) * 2013-06-28 2014-08-26 Hitachi Kokusai Electric Inc. Reaction tube
USD719114S1 (en) * 2013-06-28 2014-12-09 Hitachi Kokusai Electric Inc. Reaction tube
USD720308S1 (en) * 2011-11-18 2014-12-30 Tokyo Electron Limited Inner tube for process tube for manufacturing semiconductor wafers
USD720309S1 (en) * 2011-11-18 2014-12-30 Tokyo Electron Limited Inner tube for process tube for manufacturing semiconductor wafers
USD720707S1 (en) * 2013-06-28 2015-01-06 Hitachi Kokusai Electric Inc. Reaction tube
USD724551S1 (en) * 2011-11-18 2015-03-17 Tokyo Electron Limited Inner tube for process tube for manufacturing semiconductor wafers
USD725055S1 (en) * 2013-06-28 2015-03-24 Hitachi Kokusai Electric Inc. Reaction tube
USD738329S1 (en) * 2013-07-29 2015-09-08 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD739832S1 (en) * 2013-06-28 2015-09-29 Hitachi Kokusai Electric Inc. Reaction tube
USD740769S1 (en) * 2013-03-22 2015-10-13 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD747279S1 (en) * 2013-07-29 2016-01-12 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD770993S1 (en) * 2015-09-04 2016-11-08 Hitachi Kokusai Electric Inc. Reaction tube
JP1563524S (en) 2016-03-30 2016-11-21
USD772824S1 (en) * 2015-02-25 2016-11-29 Hitachi Kokusai Electric Inc. Reaction tube
USD791090S1 (en) * 2015-09-04 2017-07-04 Hitachi Kokusai Electric Inc. Reaction tube
USD839219S1 (en) * 2016-02-12 2019-01-29 Kokusai Electric Corporation Boat for substrate processing apparatus
USD842823S1 (en) * 2017-08-10 2019-03-12 Kokusai Electric Corporation Reaction tube
USD842824S1 (en) * 2017-08-09 2019-03-12 Kokusai Electric Corporation Reaction tube
USD843958S1 (en) * 2017-08-10 2019-03-26 Kokusai Electric Corporation Reaction tube
USD846514S1 (en) * 2018-05-03 2019-04-23 Kokusai Electric Corporation Boat of substrate processing apparatus
USD847105S1 (en) * 2018-05-03 2019-04-30 Kokusai Electric Corporation Boat of substrate processing apparatus
USD853979S1 (en) * 2017-12-27 2019-07-16 Kokusai Electric Corporation Reaction tube
JP1644260S (en) 2019-03-20 2019-10-28
US11015248B2 (en) * 2018-05-25 2021-05-25 Kokusai Electric Corporation Substrate processing apparatus and method of manufacturing semiconductor device
USD920935S1 (en) * 2018-09-20 2021-06-01 Kokusai Electric Corporation Boat for substrate processing apparatus
USD931823S1 (en) * 2020-01-29 2021-09-28 Kokusai Electric Corporation Reaction tube
USD939459S1 (en) * 2019-08-07 2021-12-28 Kokusai Electric Corporation Boat for wafer processing apparatus
USD940669S1 (en) * 2018-11-19 2022-01-11 Kokusai Electric Corporation Boat for substrate processing apparatus
USD958093S1 (en) * 2019-11-28 2022-07-19 Kokusai Electric Corporation Boat of substrate processing apparatus
USD965542S1 (en) * 2020-03-19 2022-10-04 Kokusai Electric Corporation Boat of substrate processing apparatus
USD981971S1 (en) * 2021-03-15 2023-03-28 Kokusai Electric Corporation Boat of substrate processing apparatus
USD986826S1 (en) * 2020-03-10 2023-05-23 Kokusai Electric Corporation Reaction tube
US20230221700A1 (en) * 2020-09-28 2023-07-13 Kokusai Electric Corporation Temperature control method, method of manufacturing semiconductor device, non-transitory computer-readable recording medium and substrate processing apparatus

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1682719S (en) 2020-06-15 2021-04-05

Patent Citations (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5637153A (en) * 1993-04-30 1997-06-10 Tokyo Electron Limited Method of cleaning reaction tube and exhaustion piping system in heat processing apparatus
USD405430S (en) * 1997-01-31 1999-02-09 Tokyo Electron Limited Inner tube for use in a semiconductor wafer heat processing apparatus
USD423463S (en) * 1997-01-31 2000-04-25 Tokyo Electron Limited Quartz process tube
USD424024S (en) * 1997-01-31 2000-05-02 Tokyo Electron Limited Quartz process tube
USD551634S1 (en) * 2005-02-28 2007-09-25 Tokyo Electron Limited Wafer-boat for heat-processing of semiconductor wafers
USD552047S1 (en) * 2005-02-28 2007-10-02 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers
USD600659S1 (en) * 2006-09-12 2009-09-22 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers
US20080205864A1 (en) * 2007-02-28 2008-08-28 Tokyo Electron Limited Heat processing furnace and vertical-type heat processing apparatus
US20080232787A1 (en) * 2007-03-20 2008-09-25 Takashi Ichikawa Heat processing furnace and vertical-type heat processing apparatus
USD594488S1 (en) * 2007-04-20 2009-06-16 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers
USD619630S1 (en) * 2007-05-08 2010-07-13 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers
USD611013S1 (en) * 2008-03-28 2010-03-02 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers
USD610559S1 (en) * 2008-05-30 2010-02-23 Hitachi Kokusai Electric, Inc. Reaction tube
US20120186573A1 (en) * 2011-01-21 2012-07-26 Jdira Lucian C Thermal processing furnace and liner for the same
USD720308S1 (en) * 2011-11-18 2014-12-30 Tokyo Electron Limited Inner tube for process tube for manufacturing semiconductor wafers
USD720309S1 (en) * 2011-11-18 2014-12-30 Tokyo Electron Limited Inner tube for process tube for manufacturing semiconductor wafers
USD724551S1 (en) * 2011-11-18 2015-03-17 Tokyo Electron Limited Inner tube for process tube for manufacturing semiconductor wafers
USD740769S1 (en) * 2013-03-22 2015-10-13 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD711843S1 (en) * 2013-06-28 2014-08-26 Hitachi Kokusai Electric Inc. Reaction tube
USD719114S1 (en) * 2013-06-28 2014-12-09 Hitachi Kokusai Electric Inc. Reaction tube
USD720707S1 (en) * 2013-06-28 2015-01-06 Hitachi Kokusai Electric Inc. Reaction tube
USD725055S1 (en) * 2013-06-28 2015-03-24 Hitachi Kokusai Electric Inc. Reaction tube
USD739832S1 (en) * 2013-06-28 2015-09-29 Hitachi Kokusai Electric Inc. Reaction tube
USD747279S1 (en) * 2013-07-29 2016-01-12 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD738329S1 (en) * 2013-07-29 2015-09-08 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD772824S1 (en) * 2015-02-25 2016-11-29 Hitachi Kokusai Electric Inc. Reaction tube
USD770993S1 (en) * 2015-09-04 2016-11-08 Hitachi Kokusai Electric Inc. Reaction tube
USD791090S1 (en) * 2015-09-04 2017-07-04 Hitachi Kokusai Electric Inc. Reaction tube
USD839219S1 (en) * 2016-02-12 2019-01-29 Kokusai Electric Corporation Boat for substrate processing apparatus
JP1563524S (en) 2016-03-30 2016-11-21
USD800080S1 (en) * 2016-03-30 2017-10-17 Tokyo Electron Limited Reactor tube for semiconductor production devices
USD842824S1 (en) * 2017-08-09 2019-03-12 Kokusai Electric Corporation Reaction tube
USD842823S1 (en) * 2017-08-10 2019-03-12 Kokusai Electric Corporation Reaction tube
USD843958S1 (en) * 2017-08-10 2019-03-26 Kokusai Electric Corporation Reaction tube
JP1605462S (en) * 2017-08-10 2021-05-31
USD853979S1 (en) * 2017-12-27 2019-07-16 Kokusai Electric Corporation Reaction tube
USD846514S1 (en) * 2018-05-03 2019-04-23 Kokusai Electric Corporation Boat of substrate processing apparatus
USD847105S1 (en) * 2018-05-03 2019-04-30 Kokusai Electric Corporation Boat of substrate processing apparatus
US11015248B2 (en) * 2018-05-25 2021-05-25 Kokusai Electric Corporation Substrate processing apparatus and method of manufacturing semiconductor device
USD920935S1 (en) * 2018-09-20 2021-06-01 Kokusai Electric Corporation Boat for substrate processing apparatus
USD940669S1 (en) * 2018-11-19 2022-01-11 Kokusai Electric Corporation Boat for substrate processing apparatus
JP1644260S (en) 2019-03-20 2019-10-28
USD901406S1 (en) 2019-03-20 2020-11-10 Kokusai Electric Corporation Inner tube of reactor for semiconductor fabrication
USD939459S1 (en) * 2019-08-07 2021-12-28 Kokusai Electric Corporation Boat for wafer processing apparatus
USD958093S1 (en) * 2019-11-28 2022-07-19 Kokusai Electric Corporation Boat of substrate processing apparatus
USD931823S1 (en) * 2020-01-29 2021-09-28 Kokusai Electric Corporation Reaction tube
USD986826S1 (en) * 2020-03-10 2023-05-23 Kokusai Electric Corporation Reaction tube
USD965542S1 (en) * 2020-03-19 2022-10-04 Kokusai Electric Corporation Boat of substrate processing apparatus
US20230221700A1 (en) * 2020-09-28 2023-07-13 Kokusai Electric Corporation Temperature control method, method of manufacturing semiconductor device, non-transitory computer-readable recording medium and substrate processing apparatus
USD981971S1 (en) * 2021-03-15 2023-03-28 Kokusai Electric Corporation Boat of substrate processing apparatus

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Publication number Publication date
JP1731674S (en) 2022-12-08
TWD232582S (en) 2024-08-01

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