TW593530B - Thermosetting resin composition - Google Patents

Thermosetting resin composition Download PDF

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Publication number
TW593530B
TW593530B TW091114427A TW91114427A TW593530B TW 593530 B TW593530 B TW 593530B TW 091114427 A TW091114427 A TW 091114427A TW 91114427 A TW91114427 A TW 91114427A TW 593530 B TW593530 B TW 593530B
Authority
TW
Taiwan
Prior art keywords
component
patent application
epoxy resin
scope
item
Prior art date
Application number
TW091114427A
Other languages
English (en)
Chinese (zh)
Inventor
Kiyoshi Sato
Kazunori Kitamura
Original Assignee
San Ei Kagaku Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by San Ei Kagaku Co filed Critical San Ei Kagaku Co
Application granted granted Critical
Publication of TW593530B publication Critical patent/TW593530B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/10—Epoxy resins modified by unsaturated compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49894—Materials of the insulating layers or coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09881—Coating only between conductors, i.e. flush with the conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Epoxy Resins (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
TW091114427A 2001-07-19 2002-06-28 Thermosetting resin composition TW593530B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001253678A JP3911690B2 (ja) 2001-07-19 2001-07-19 熱硬化性樹脂組成物、並びに平滑板の製造方法及びその平滑板

Publications (1)

Publication Number Publication Date
TW593530B true TW593530B (en) 2004-06-21

Family

ID=19081968

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091114427A TW593530B (en) 2001-07-19 2002-06-28 Thermosetting resin composition

Country Status (8)

Country Link
US (2) US6812299B2 (enExample)
EP (1) EP1277798B1 (enExample)
JP (1) JP3911690B2 (enExample)
KR (1) KR100584435B1 (enExample)
CN (1) CN1170885C (enExample)
AT (1) ATE373047T1 (enExample)
DE (1) DE60222340T2 (enExample)
TW (1) TW593530B (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI475080B (zh) * 2006-09-13 2015-03-01 Tatsuta Densen Kk 導熱性糊
TWI622633B (zh) * 2016-06-24 2018-05-01 利諾士尖端材料有限公司 非導電性黏結膜
TWI626292B (zh) * 2016-04-28 2018-06-11 利諾士尖端材料有限公司 非導電性粘結膜用組合物及包含其的非導電性粘結膜

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JP3911690B2 (ja) * 2001-07-19 2007-05-09 山栄化学株式会社 熱硬化性樹脂組成物、並びに平滑板の製造方法及びその平滑板
JP2003105061A (ja) * 2001-09-27 2003-04-09 Sanei Kagaku Kk 光・熱硬化性樹脂組成物、並びに穴詰プリント配線（基）板の製造方法及び穴詰プリント配線（基）板
JP2004066017A (ja) * 2002-08-01 2004-03-04 Nippon Paint Co Ltd ソルダーレジスト膜の形成方法
JP2005209861A (ja) * 2004-01-22 2005-08-04 Nippon Steel Corp ウェハレベルパッケージ及びその製造方法
JP4683182B2 (ja) * 2004-09-28 2011-05-11 山栄化学株式会社 感光性熱硬化性樹脂組成物、並びにレジスト被覆プリント配線板及びその製造法
JP4735815B2 (ja) * 2005-04-18 2011-07-27 山栄化学株式会社 穴埋め多層プリント配線板及びその製造方法
JP2007257818A (ja) * 2006-02-27 2007-10-04 Tdk Corp 情報記録媒体製造方法
JP5360359B2 (ja) * 2008-07-01 2013-12-04 株式会社スリーボンド エポキシ樹脂組成物
JP5344394B2 (ja) 2008-07-10 2013-11-20 山栄化学株式会社 硬化性樹脂組成物、並びにハロゲンフリー樹脂基板及びハロゲンフリービルドアッププリント配線板
US7943862B2 (en) * 2008-08-20 2011-05-17 Electro Scientific Industries, Inc. Method and apparatus for optically transparent via filling
US20100155128A1 (en) * 2008-12-22 2010-06-24 Tombs Thomas N Printed electronic circuit boards and other articles having patterned coonductive images
JP5467469B2 (ja) 2011-01-04 2014-04-09 山栄化学株式会社 プリント配線基板に表面実装する方法
JP2012241076A (ja) * 2011-05-18 2012-12-10 Hitachi Industrial Equipment Systems Co Ltd 高耐熱性熱硬化性樹脂組成物およびそれを用いた電気機器
JP5018985B1 (ja) * 2011-06-17 2012-09-05 パナソニック株式会社 配線基板と、配線基板の製造方法
WO2014014045A1 (ja) * 2012-07-20 2014-01-23 協立化学産業株式会社 ハードディスク装置用硬化性組成物
JP6545924B2 (ja) * 2012-12-27 2019-07-17 味の素株式会社 粗化硬化体、積層体、プリント配線板及び半導体装置
CN104530789B (zh) * 2015-01-19 2017-08-08 广东希贵光固化材料有限公司 一种用于转印膜的阳离子光固化涂料
CN108241253B (zh) * 2016-12-27 2021-11-09 太阳油墨（苏州）有限公司 碱显影型阻焊剂组合物、其干膜、和固化物以及印刷电路板
JP2020019983A (ja) * 2018-07-31 2020-02-06 セイコーエプソン株式会社 配線基板及び配線基板の製造方法
CN109705700A (zh) * 2018-12-21 2019-05-03 北京隆源纳欣科技有限公司 一种双重固化耐湿热重防腐陶瓷涂料
JP7220623B2 (ja) * 2019-05-28 2023-02-10 株式会社タムラ製作所 保護被膜を有する配線板の製造方法

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JP2001192554A (ja) * 2000-01-13 2001-07-17 Mitsubishi Gas Chem Co Inc スルーホール充填用インク及びそれを用いたプリント配線板
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JP3648704B2 (ja) * 2000-02-14 2005-05-18 タムラ化研株式会社 活性エネルギー線硬化性組成物及びプリント配線板
JP3911690B2 (ja) * 2001-07-19 2007-05-09 山栄化学株式会社 熱硬化性樹脂組成物、並びに平滑板の製造方法及びその平滑板

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI475080B (zh) * 2006-09-13 2015-03-01 Tatsuta Densen Kk 導熱性糊
TWI626292B (zh) * 2016-04-28 2018-06-11 利諾士尖端材料有限公司 非導電性粘結膜用組合物及包含其的非導電性粘結膜
TWI622633B (zh) * 2016-06-24 2018-05-01 利諾士尖端材料有限公司 非導電性黏結膜

Also Published As

Publication number Publication date
ATE373047T1 (de) 2007-09-15
US20050019582A1 (en) 2005-01-27
KR100584435B1 (ko) 2006-05-26
KR20030009192A (ko) 2003-01-29
JP3911690B2 (ja) 2007-05-09
JP2003026765A (ja) 2003-01-29
CN1398918A (zh) 2003-02-26
DE60222340D1 (de) 2007-10-25
EP1277798A2 (en) 2003-01-22
US6812299B2 (en) 2004-11-02
US7410673B2 (en) 2008-08-12
DE60222340T2 (de) 2008-06-19
CN1170885C (zh) 2004-10-13
EP1277798A3 (en) 2003-06-11
EP1277798B1 (en) 2007-09-12
US20030162898A1 (en) 2003-08-28

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