TWI843869B - 樹脂組成物及使用其的半導體密封材料、含浸基材、電路基板、增層膜、預浸體、碳纖維複合材料、阻焊劑、乾膜、印刷配線板 - Google Patents

樹脂組成物及使用其的半導體密封材料、含浸基材、電路基板、增層膜、預浸體、碳纖維複合材料、阻焊劑、乾膜、印刷配線板 Download PDF

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Publication number
TWI843869B
TWI843869B TW109122689A TW109122689A TWI843869B TW I843869 B TWI843869 B TW I843869B TW 109122689 A TW109122689 A TW 109122689A TW 109122689 A TW109122689 A TW 109122689A TW I843869 B TWI843869 B TW I843869B
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Taiwan
Prior art keywords
film
prepreg
build
resin composition
carbon fiber
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TW109122689A
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English (en)
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TW202112957A (zh
Inventor
松村優佑
中村昭文
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日商Ｄｉｃ股份有限公司
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TW109122689A 2019-08-23 2020-07-06 樹脂組成物及使用其的半導體密封材料、含浸基材、電路基板、增層膜、預浸體、碳纖維複合材料、阻焊劑、乾膜、印刷配線板 TWI843869B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2019-152878 2019-08-23
JP2019152878 2019-08-23
JP2019-152877 2019-08-23
JP2019152877 2019-08-23

Publications (2)

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TW202112957A TW202112957A (zh) 2021-04-01
TWI843869B true TWI843869B (zh) 2024-06-01

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009269999A (ja) 2008-05-07 2009-11-19 Nitto Denko Corp 半導体封止用エポキシ樹脂組成物およびそれを用いて得られる半導体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009269999A (ja) 2008-05-07 2009-11-19 Nitto Denko Corp 半導体封止用エポキシ樹脂組成物およびそれを用いて得られる半導体装置

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