TW498550B - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
TW498550B
TW498550B TW90115789A TW90115789A TW498550B TW 498550 B TW498550 B TW 498550B TW 90115789 A TW90115789 A TW 90115789A TW 90115789 A TW90115789 A TW 90115789A TW 498550 B TW498550 B TW 498550B
Authority
TW
Taiwan
Prior art keywords
power terminal
semiconductor device
power terminals
patent application
power
Prior art date
Application number
TW90115789A
Other languages
English (en)
Chinese (zh)
Inventor
Fumio Hirahara
Kenichi Ogata
Original Assignee
Toshiba Copr
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Copr filed Critical Toshiba Copr
Application granted granted Critical
Publication of TW498550B publication Critical patent/TW498550B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/501—Inductive arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Inverter Devices (AREA)
  • Power Conversion In General (AREA)
  • Lead Frames For Integrated Circuits (AREA)
TW90115789A 2000-07-11 2001-06-28 Semiconductor device TW498550B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000210475A JP2002026251A (ja) 2000-07-11 2000-07-11 半導体装置

Publications (1)

Publication Number Publication Date
TW498550B true TW498550B (en) 2002-08-11

Family

ID=18706739

Family Applications (1)

Application Number Title Priority Date Filing Date
TW90115789A TW498550B (en) 2000-07-11 2001-06-28 Semiconductor device

Country Status (6)

Country Link
US (1) US6885096B2 (https=)
EP (1) EP1172850A3 (https=)
JP (1) JP2002026251A (https=)
KR (1) KR100430772B1 (https=)
CN (1) CN1204623C (https=)
TW (1) TW498550B (https=)

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JP5253430B2 (ja) * 2009-03-23 2013-07-31 株式会社豊田中央研究所 パワーモジュール
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JP6786416B2 (ja) * 2017-02-20 2020-11-18 株式会社東芝 半導体装置
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Also Published As

Publication number Publication date
EP1172850A3 (en) 2006-04-26
CN1333566A (zh) 2002-01-30
US20020024129A1 (en) 2002-02-28
EP1172850A2 (en) 2002-01-16
US6885096B2 (en) 2005-04-26
JP2002026251A (ja) 2002-01-25
KR20020006453A (ko) 2002-01-19
KR100430772B1 (ko) 2004-05-10
CN1204623C (zh) 2005-06-01

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