TW448452B - Conductive material and its manufacture method - Google Patents
Conductive material and its manufacture method Download PDFInfo
- Publication number
- TW448452B TW448452B TW086107320A TW86107320A TW448452B TW 448452 B TW448452 B TW 448452B TW 086107320 A TW086107320 A TW 086107320A TW 86107320 A TW86107320 A TW 86107320A TW 448452 B TW448452 B TW 448452B
- Authority
- TW
- Taiwan
- Prior art keywords
- scope
- item
- conductive material
- patent application
- sheet
- Prior art date
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- 239000004020 conductor Substances 0.000 title claims abstract description 26
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 238000000034 method Methods 0.000 title claims description 21
- 239000002131 composite material Substances 0.000 claims abstract description 45
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 24
- 239000000057 synthetic resin Substances 0.000 claims abstract description 23
- 229910052751 metal Inorganic materials 0.000 claims abstract description 11
- 239000002184 metal Substances 0.000 claims abstract description 11
- 239000000853 adhesive Substances 0.000 claims description 30
- 230000001070 adhesive effect Effects 0.000 claims description 29
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 16
- 229910052737 gold Inorganic materials 0.000 claims description 15
- 239000010931 gold Substances 0.000 claims description 15
- 238000011282 treatment Methods 0.000 claims description 15
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 14
- 238000007747 plating Methods 0.000 claims description 14
- 238000000576 coating method Methods 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- 229910052759 nickel Inorganic materials 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 7
- 230000002079 cooperative effect Effects 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 4
- 235000015170 shellfish Nutrition 0.000 claims description 4
- 229920002994 synthetic fiber Polymers 0.000 claims description 4
- 239000012209 synthetic fiber Substances 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 2
- 239000002648 laminated material Substances 0.000 claims 2
- 239000004332 silver Substances 0.000 claims 2
- 229940098465 tincture Drugs 0.000 claims 2
- 239000000463 material Substances 0.000 abstract description 32
- 239000012790 adhesive layer Substances 0.000 abstract description 9
- 238000004891 communication Methods 0.000 abstract description 2
- 239000000835 fiber Substances 0.000 description 42
- 239000006260 foam Substances 0.000 description 25
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 15
- 229920005830 Polyurethane Foam Polymers 0.000 description 12
- 239000004744 fabric Substances 0.000 description 12
- 239000011496 polyurethane foam Substances 0.000 description 12
- 238000012360 testing method Methods 0.000 description 12
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 10
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 10
- 238000007906 compression Methods 0.000 description 9
- 230000006835 compression Effects 0.000 description 9
- -1 polyethylene phthalate Polymers 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 229920000728 polyester Polymers 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- 239000013078 crystal Substances 0.000 description 6
- 239000002759 woven fabric Substances 0.000 description 6
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 5
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 5
- 239000004745 nonwoven fabric Substances 0.000 description 5
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 5
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000005406 washing Methods 0.000 description 4
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 2
- KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 description 2
- 239000003522 acrylic cement Substances 0.000 description 2
- 229910000365 copper sulfate Inorganic materials 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 2
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 229920002972 Acrylic fiber Polymers 0.000 description 1
- MHZGKXUYDGKKIU-UHFFFAOYSA-N Decylamine Chemical compound CCCCCCCCCCN MHZGKXUYDGKKIU-UHFFFAOYSA-N 0.000 description 1
- 241000196324 Embryophyta Species 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- KKYNGSVDQZFBIK-UHFFFAOYSA-N N.[Au+3] Chemical compound N.[Au+3] KKYNGSVDQZFBIK-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- 125000005396 acrylic acid ester group Chemical group 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 238000005273 aeration Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 244000005700 microbiome Species 0.000 description 1
- 210000004400 mucous membrane Anatomy 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- YWYZEGXAUVWDED-UHFFFAOYSA-N triammonium citrate Chemical compound [NH4+].[NH4+].[NH4+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O YWYZEGXAUVWDED-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0015—Gaskets or seals
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
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- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249955—Void-containing component partially impregnated with adjacent component
- Y10T428/249958—Void-containing component is synthetic resin or natural rubbers
-
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- Y10T428/249981—Plural void-containing components
-
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- Y10T442/3333—Including a free metal or alloy constituent
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- Y10T442/339—Metal or metal-coated strand
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- Y10T442/3398—Vapor or sputter deposited metal layer
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Chemical Or Physical Treatment Of Fibers (AREA)
- Laminated Bodies (AREA)
Description
公告本 44S452 申請曰期 86年 5 月 29日 案 號 86107320 麵 別 (以上各棚由本局填註) 經濟部中央揉準局貝工消費合作社印掣
本紙張尺度適用中國國家標準(CNS ) A4洗格(210X297公釐) 4484 5 2 申請曰期 86 年 5 月 29 日 案 號 86107320 _ 別 (以上各攔由本局填註) A4 C4 專利説明書 -公稱 中 文 英文 姓 名 國 籍 發明 四平野成之 W)日本 M)日本國福井縣福井市松本二丁目二一 0—六 住、居所 姓 名 (名稱) 經濟部中'央標隼局員工消費合作社印袈 申請人 國 藉 住、居所 (事務所) 代表人 姓 名 本紙張尺度適用中國國家標準(CNS ) A4規格(2丨Ο X 29了公釐) 44 84 5 2 經濟部中央標準局負工消費合作社印衷 {由本局讀}
A B 本案已向: 國(地區)申請專利,申請日期: 案號: ,□有□無主張俊先權 3本 1996年8月5日 8-205545 0有主張優先權 有關微生物已寄存於: ,寄存日期: ,寄存號碼: (請先《讀背面之注意事項再填寫本頁各櫊) 本紙張尺度適用中國國家梯率(CNS ) A4規格(210X297公釐) α484 5 2 Α7 _Β7_ 五、發明説明(1 ) 〔技術之領域〕 本發明係主要與適用於遮蔽自電子機器洩漏之電磁波 之電磁波屏蔽用封墊材料之導電性材料及其製造方法有關 〔先前之技術〕 近年來個人電腦,電視遊樂器|行動電話等所謂電子 機器應被利用,普及至一般家庭生活中《此種機器隨著自 工業用擴大至一般用途,由此等機器所漏電磁波招致其他 電子機器之誤動作,或招致通信機器之電波障礙等問題多 生,並大爲舉發於大眾傳播。 -* 在此種社會環境中,電子工業關連領域下,爲防止由 該機器洩漏之電磁波之各種障礙,要求卓越之發揮遮蔽效 果之電磁波屏蔽材料。 經濟部中央標準局貝工消費合作社印褽 (請先聞讀背面之注$項再填寫本頁) 一般由利用電子之機器產生之電磁波尤成爲問題者乃 構成機器殼體之各配件接縫式裝於該殼體之開關用門等間 隙洩漏之電磁波,以遮蔽此種洩漏之電磁波爲目的提出具 有各種形態之封墊。 此種封墊中,滿足遮蔽目的之構造之遮蔽材料,實際 上使用具備耐壓縮性及金屬般導電性之產品,獲得大致之 效果》該製品有由如圖1所示角柱形狀而成之未鍍金羼之 合成樹脂多孔體薄片1之聚氨酯泡沫材料繞捲粘接鍍金靥 布帛2,在該布帛全表面或一部分設粘著劑層3後於其表 面積層離型紙4者,惟實際使用之聚氨酯泡沫本身因富於 本紙張尺度適用中國國家梯準(CNS ) A4規格(210X297公釐) -4 - 448452 A7 ___B7 _____ 五、發明説明(2 ) 柔軟性及緩衝性致腰部較弱,向一定方向以規定寬度細切 該材料之作業,在技術上將帶來困難。故爲了使該材料具 有耐壓縮性,將該泡決加熱壓縮至所希厚度以賦予永久度 變形之壓縮成形體泡沫型使用乃實情。 然而此種封墊材料因以將接著劑塗於鍍金屬處理之纖 維布帛繞捲於予先以機械加工糟滑之角柱狀聚氨酯泡沫之 方法製造,致不僅费工*結果亦有生產成本高之問題。 〔發明之目的〕 本發明乃有鑑於此種現狀而爲,其目的在提供與先前 之電磁波屏蔽封墊材料比較可消除其煩雜之製造作業,可 大量生產廉價品質均勻信頼性高之封墊材料之導電性材料 及其製造方法。 〔發明之方法〕 本發明人等爲解決前述課題,經銳意檢討結果•完成 本發明。 經濟部十失揉準局負工消费合作社印装 I I n m ^ I I» mm T --¾ ,T (If.先聞讀背面之注意事項再填寫本頁) 本發明之第1項係適於由有機纖維構造薄片與合成樹 脂多孔體薄片之積層一體化之複合體薄片予以金屬化而成 做爲電磁波屏蔽封墊材料之導電性材料。 本發明之第2項係適於將有機纖維構造薄片與合成樹 脂多孔體薄片積層牯接,接著將所得複合體薄片予以鍍金 屬處理爲特徵之電磁波屏蔽封墊之導電性材料之製造方法 本紙張尺度適用中國國家標準(CNS > A4規格(210 X 297公釐) -5 - 448452 A7 __B7_ 五、發明説明(3 ) 〔良好之實施形態〕 本發明之適於電磁波封墊材料之導電性材料之典型例 具有如圓4所示斷面構造。更如圖5至圓8所示,由於將 離型紙4被覆之粘著劑層3設於金靥化之複合體薄片外面 之全表面或一部分表面形成適於電磁波屏蔽封墊材料之導 電性材料。又,更由於以鍍金屬處理多光積層拈接有機纖 維構造與合成樹脂多孔體薄片所得之複合體薄片外面之全 表面或一部分表面塗以粘著劑後以離型低複覆,分別形成 適於電磁波屏蔽封墊之導電性材料。 圖2係表示由圖5所示屏蔽封墊材料切出規定尺寸形 態之一例之電磁波屏蔽封墊材料之斜視圓,又圖3係表示 由圖6所示屏蔽封墊材料同樣切出狀態之一例之電磁波屏 蔽封墊材料之斜視圖。 經濟部中央橾準局貝工消费合作杜印掣 (請先聞讀背面之注$項再填寫本頁) 本發明所使用之織維構造薄片,可舉織物,編物,不 織布,等纖維布帛。構成這些之纖維可用有機纖維,即合 成纖維,半合成纖維,再生纖維等化學嫌維,及植物纖維 ,動物纖維等天然繊維,惟尤以聚酰胺纖維,聚酯纖維及 壓克力纖維等合成纖維爲宜,其中尤以聚酯(聚乙烯苯二 甲酸鹽)纖維爲宜。這些纖維例如以單纖維爲0 . 1 — 5 登尼爾(d e n i e r )之複合絲更佳。又纖維布帛之種 類以不織布更佳纖維布帛之單位面積重含量以1 0〜 1 0 0 g / m 2爲宜。 爲了能確實將金屬附著於此等纖維構造薄片1予先以 本紙張尺度適用中國國家橾率(CNS > A4規格(2丨Ο X扣7公釐> -6 ~ 4484 52 A7 B7_ 五、發明说明(4 ) 精練處理完全去除附著於該纖維薄片表面之糊劑,油劑1 灰塵等不純物爲宜。 其次使用於本發明之合成樹脂多孔體薄片,以柔軟, 最好實質上未具品粘膜,富壓縮復元性,由連續氣泡而成 之三次元網狀構造之泡沬薄片爲宜。具有此等特性之泡沫 例有:聚乙烯泡沬,聚丙烯泡沬,聚氯化乙烯泡沬,聚氨 酯泡沫,聚合樹脂泡沫,聚丁二烯泡沬等》尤以聚酯系或 聚醚系之聚氨酯泡沬》 此種泡沫薄片依輕質,半硬質,硬質,更依氣泡密度 種類多,尤以欲均勻鍍金靥於泡沫內部時,氣泡密度不宜 過高,以考慮最終用途之功能選擇最適氣泡密度爲宜。一 般而言,理想之晶粒密度係約2 0 — 1 0 0個/英吋》 合成櫥脂多孔體薄片之厚度,視用途等而異,惟通常 約爲0.5〜5mm» 經濟部中央標準局員工消費合作社印裝 (諸先閲讀背面之注項再填寫本頁) 其次欲獲得有機嫌維構造薄片與合成樹脂多孔體薄片 之複合體之方法,甫舉,將接著商Γ塗於該薄片之任何表面 後,將另一方薄片積層粘接之方法,或將該多孔體薄片表 面之一部分熱溶解後立即將該纖維構造薄片積層粘接等方 法,惟將所得複合體鍍金屬處理時*爲充分確保有機纖維 造薄片與合成樹脂多孔體薄片間之接著部分之導電性,可 推薦依後著之熱熔解之接著方法。以瓦斯火炎直接熔解胺 酯泡沫薄片表面部後與織維布帛薄片表面積層粘接成複合 體即可完成熔接。此時,以該泡沬薄片火炎之熔解以由表 面起0 . 3〜1mm程度爲宜。0 . 3mm以下無法獲得 本紙張尺度適用中國國家橾準(CNS ) A4规格(2丨Ο X 297公釐) -7 ~ 第86107320號專利案 中文說明書更正頁
民國90年12月修正 經濟部智慧財產笱®工消资合作社印製 五、發明説明(5 ) 充分之接著強度’又1 mm以上將增加製造成本。又,將 上述複合體鍍金靥時,不僅有機嫌維構造薄片內部合成樹 脂多孔體薄片內部,連泡沬熔解層部分內部亦鍍金屬,使 有機纖維製造薄片與合成樹脂多孔醴薄片間之接著部分之 導電性良好。 其次該複合體之金屬化係,由實施通常電鍍之觸媒之 付與及活性化等前述處理後,將Ag,N i ,C u,Au ,Cu+Ni等所希金屬施予無電解鍍金處理及/或電鍍 處理予以達成· 又付舉複合體之鍍金靥皮膜厚度以0.01〜2 爲宜。 爲了易將以上述方法銨金處理之複合體薄片,做爲電 磁波屏蔽封墊材料使用,在該薄片之任_表面施予粘著加 工亦可•此時塗裝之粘著劑,可用通常使用之合成樹脂製 粘著劑。理想之粘著劑舉例有天然橡膠•合成橡膠等橡膠 '系粘著劑*壓克力酸酯共重合體等壓克力系粘著劑,矽橡 膠/樹脂等矽系粘著劑,乙烯醚重合體等乙烯系粘著劑等 。理想之粘著劑係壓克力系粘著劑。附與導電性之粘著劑 更爲好用。又薄片之塗裝除照相凹板塗器之圓點狀,印刷 機之條紋狀等部分塗裝方法外,亦適宜使用塗裝薄片全面 之方法。塗裝此種粘著劑之薄片係以乾燥蒸發所含溶媒後 •將離型紙積層粘著劑表面。又•將粘著劑塗於離型紙側 後與上述同樣處理,積層薄片亦可·尤其圖7〜圖9將導 電性粘著劑塗於全表面者,即使裁斷使用該屏蔽封墊材 請 先-MV 讀\ 背\ 之 注 意 事 項 再 填 寫设 本 / 頁 訂 本紙張尺度適用中國國家標準(CNS ) A4规格(21〇X 297公釐) 448452 A7 ____B7_ 五、發明説明(6 ) 料之任何部分亦有可得均勻之粘著力與被粘著物間之充分 導電性之效果,成爲信賴性高之產品,此種封墊材料雖製 造所需成本上昇,惟塗裝方法容易,加上尤其做爲電磁波 屏蔽封墊材料符合最終之用途,形成任意細寬度之隙縫時 ,其汎用性將更爲增進。 〔發明之效果〕 本發明之導電性材料,特別是電磁波屏蔽封墊材料得 極容易,廉價且以穩定之品質製造,顯示在予先成形之角 柱形狀胺酯泡沬周圍金膺化之布帛塗接著劑,繞捲之手工 作業排隙之上同等性能。又,鍍金屬之.聚氨酯泡沫軍體係 形成細寬度隙縫時因縱方向之牽引強度極端弱小致不耐實 際使用之問題,惟依本發明之製造方法,對加於鍍金工程 及粘著劑之塗裝工程之縱方向之張力Μ無任何問題而加工 容易。 更將所得製品形成細寬度隙縫後亦可充分保持縱方向 強度在全部工程連續加工。 經濟部中央標準局員工消費合作社印製 (请先閲讀背面之注意事項再填寫本頁) 〔實施例〕 其次依實施例証明本發明。 實施例所用測定方法如下》 1 .壓縮變形(%) 測量一邊爲1 0 Omm之正方形試片厚度後,以兩面 本紙乐尺度適用t國®家標準(CNS ) A4現格(2丨OX29?公釐) -9 - 間之電阻 經濟部智慧財產局員工消費合作社印製 A7 ___ B7 __ 五、發明説明(7 ) 平行之鋁製壓縮板壓縮固定爲試片厚度之5 0%,經溫度 7 0± 5°C恒溫槽加熱2 2小時後取出*由壓縮板拆下試 片於常溫中放置3 0分鐘後測量此厚度•以下式算出壓縮 變形(%)» t 〇 — t 1 C :壓縮變形(% ) t。:起初試片厚度 :試驗後之試片厚度 2 .電阻(Ω ) 厚度方向:將寬1 0mm、長6 0mm之試片2點夾於 1 0 0mm1 2 3之2片銅板間,測量壓縮5 0% 時之銅板間之電阻a 長度方向:將寬1 0mm、長6 0mm之試片兩端以電極 含 面 之 注 頁 -10 - 1 挾持,測量4 0 3 .屏蔽性(d B ) 準備中央鑛5 X 2 5mm長方形孔,厚1 mm銅板( 2 0 0 X ,2 0 0 m m ) 2片,將安裝試片設置中央部,以 3 K E C法測量屏蔽性。即裝於屏蔽箱中送信用與受信用天 線間*測量受信電場強度,由試片非存在時之強度比求減 衰率(d B )。 448^1 b A7 B7 五、發明説明( (屏蔽性)=2 0 i〇g 無屏蔽材料時之電場強度 (d B ) 經濟部中央標準扃貝工消费合作社印裝 有屏蔽材料時之電場強度 4 .牽引強度 抓住寬1英吋,長3〇公分試片間隔2〇 cm,牽引 速度3 0 c m/分以牽引試驗機測量,試片破壞時爲終點 實施例1 將聚醋長纖維(單絲登尼爾2 . 〇 d)而成之細纖法 不織布(單位面積重量4 0 g/hi2)溶接厚度1 . 6 mm晶粒密度4 0個/英吋之聚氨酯泡沫薄片獲得1 . 3 m m之複合體。 其次充分洗淨該複合體後,浸漬於含氯化鈀〇 . 3 g/L,氯化第一錫30g/L,36%鹽酸300 m 1 / L之4 0°C水溶液2分鐘後水洗。接著浸漬於3 0 °C 1 0%硫酸5分鐘後水洗。 更浸漬於30°C之硫酸銅下7 . 5g/L,37%福 爾馬林3 0m〗/L,羅謝爾鹽8 5 g/L而成之無電解 銅鎪液5分鐘後水洗。接著浸漬於3 5 °C硫酸鎳3 0 g/ L,次磷酸蘇打20g/L ·檸檬酸胺50g/L而成之 無電解鎳液1 0分鐘後水洗。獲得纖維及泡沬晶粒表面均 勻鍍金之複合體》 本紙掁尺度適用中國國家樣準(CNS M4規格(210X297公釐) ---------'^------iT (誇先閲讀背面之注意事項再填寫本頁)
I B7 五、發明説明(9) 強度及電磁波屏蔽性,導電性 其性能係如表1所示 均優異β 實施例2 面 之 注 意 事 項 再 f 本 頁 將人造長織維(單絲登尼爾2 . 0 d )而成之不織布 (單位面積重量5 0 g/m2)溶接於厚度1. 6mm, 密度4 0個/英<吋之聚氨酯泡沫薄片•獲得厚度1 . 3 m m之複合體。 實施與實施例1同樣處理,獲得纖維及泡沫之晶粒內 表面均勻鍍金之複合體。 其性能如表1所示,強度及電磁波屏蔽性*導電性均 優異。 實施例3 經濟部智慧財產局員工消費合作社印製 將聚酯長纖維(單絲登尼爾2 . 0 d )而成之細微結 不織布(單位面積重量4 0g/cm2),溶接於厚度 3 . 5mm,密度50個/英吋之聚氨酯泡沫,獲得厚度 3.0mm之複合體》 實施與實施例1同樣之處理,獏得繊維及泡沫之晶粒 內表面均勻鍍金之複合體。 其性能如表1所示,強度及電磁波屏蔽性’導電性均 優異》 實施例4 本紙張尺度適用中國闺家橾準(CNS > A4规格(210X297公釐) -12 - 448452 A7 _B7 五、發明説明(l〇 ) 將聚酯長織維(單絲登尼爾2 . 0 d )而成之細織法 不織布(單位面積重量4 0g/m2)溶接厚度1 _ 6 mm晶粒密度40個/英吋之聚氨酯泡沫薄片獲得1.3 m m之複合體。 其次充分洗淨該複合體後,浸漬於含氯化鈀0 . 3 g/L,氯化第一錫30g/L,36%鹽酸300 m 1 / L之4 0°C水溶液2分鐘後水洗。接著浸漬於3 0 °C 10 %硫酸5分鐘後水洗。 更浸漬於3 5 °C之硫酸鎳下30 g/L,次磷酸蘇打 2 0 g/L檸檬酸胺5 0 g/L而成之無電解鎳液1 0分 鐘後水洗。獲得纖維及泡沫之晶粒表面均勻鍍金之複合體
Q 其性能如表1所示,強度及電磁波屏蔽性,導電性均 優異β 實施例5 · 經濟部中央標準局貝工消费合作社印製 (請先Η讀背面之注意事項再填寫本頁) 將聚酯長纖維(單絲登尼爾1 d )而成之織物(經絲 緯絲均50d/48f ,單位面積重量60g/m2)溶 接於厚度1.6mm,密度40個/英吋之聚氨酯泡沬薄 片,獲得厚度1·4mm之複合體》 實施與實施例1同樣處理獲得嫌維及泡沫之晶粒內表 面均勻鍍金之複合體。 其性能如表1所示,強度及電磁波屏蔽性,導電性均 優異· 本紙張尺度適用中國國家標率(CNS ) A4規格(210 X 297公釐) -13 - 經濟部智慧財產局負工消费合作社印製 ___B7_五、發明説明(11) 實施例6 用照相凹板塗器,以粘度5 5 0 0 c p s將壓克力系 粘著劑(東亞油漆XA— 3 7 3 2 )以點狀塗於矽剝離紙 (本州製紙製6 4 G S ),接著乾燥後,壓接實施例1所得 複合體成一髖化。同樣評價其性能,將其結果列於表1。 實施例7 將聚酯長嫌維(3 0 d/2 4 f )而成之雙羅素編物 (單位面積重量1 3 5 g/m2)溶接於厚度1 . 6mm ,密度4 0個/英吋之聚氨酯泡沬薄片,獲得厚度1 · 6 m m之複合體· 實施與實施例1同樣處理,獲得纖維及泡沬之晶粒內 表面均勻鍍金之複合體。 其性能如表1所示,強度及電磁波屏蔽性,導電性均 優異· 實施例8 將用經緯絲均3 6號之綿絲之平織布(密度經絲 11 5支/英吋•緯絲76支/英吋)溶接於厚度1 . 8 mm,密度4 0個/英吋之聚氨酯泡沫薄片獲得厚度 1 . 4mm之複合體* 實施與實施例1同樣處理,獲得纖維及泡沫之晶粒內 表面均匀鍍金之複合體* 本紙乐尺度逍用中國囷家搮準( CNS ) A4規格(2丨0X297公釐) -14 - A7 _ B7_____ 五、發明説明(β 其性能如表1所示,強度及電磁波屏蔽性,導電性均 優異· 比較例1 將聚酯長纖維(單絲登尼爾1 d )而成之織布(經絲 ,緯絲均50d/48f ,單位面積重量60g/m2) 充分洗淨後浸漬於4 0°C含氯化鈀0 . 3g/L,氛化第 一鍚3〇g/L,36%鹽酸300ml/L之水溶液2 分鐘後水洗。接著浸潰3 0°C 1 0%硫酸5分鐘後水洗。 更浸漬於30t硫酸銅7 . 5g/L,37%福爾馬 林3 〇m 1 / L羅素鹽8 5 g/L而成之無電解銅鍍液5 分鐘後水洗,接著浸漬於35°C硫酸鎳30g/L,次磷 酸蘇打2 0 g/L |檸檬酸胺5 0 g/L而成之無電解鎳 液1 0分鐘後水洗,獲得纖維表面均勻鍍金之纖維薄片。 將具有寬度1 Omm,高度1 5 m m之角柱狀胺酯 泡沬,以此處所得鏟金之織維薄片繞捲粘接成一體化•獲 得圖1所示電磁波屏蔽封墊材料"用此同樣評價性能。 經濟部智恶財產局員工消费合作社印製 比較例2 用比較例1同一纖維,充分洗淨後,浸漬4 0°C含氯 化鈀0 . 3g/L,氯化第1鍚3〇g/L,36%鹽酸 300ml/L之水溶液中2分鐘,水洗後,浸漬5分鐘 30 °C 10%硫酸,然後水洗。 接著,浸漬於35°C硫酸鎳3〇g/L,次磷酸蘇打 本紙張尺度適用中.闺國家標準(CNS > A4規格(210X297公釐) -15 - d48452 A7 B7 五、發明説明(l3 ) 2 0 g/L,檸檬酸胺5 0 g/L而成之無電解鎳液1 〇 分鐘後水洗獏得表面均勻鍍金之纖維薄片* 將具有寬1 〇mm,高1 5mm之角柱狀胺酯泡沬 (請先閲讀背面之注意事項再填寫本頁) 以此處所得鍍金之纖維薄片繞捲粘接成一體化,獲得如圓 1所示電磁波屏蔽封墊材料,用此,同樣評價性能。 比較例3 將厚1 . 6mm,晶粒密度4 0個/英时之聚氨酯泡 沬薄片充分洗淨後,浸漬4 0°C含氯化鈀0 . 3 g/L, 氯化第一錫3〇g/L,36 %鹽酸300ml/L之水 -溶液2分鐘後,水洗。接著浸漬30 °C 10%硫酸5分鐘 ,然後水洗。 更浸漬於3 5 °C硫酸鎳3 0 g/L ’次磷酸蘇打2 0 g/L,檸檬酸胺5 0 g/L而成之無電解鎳液1 0分鐘 後水洗,將胺酯表面鍍金。 性能評價結果如表1。 經濟部中央標準局負工消費合作社印製 本紙張尺度適用中國國家標準(CNS ) A4说格(2丨0 X 297公釐) -16 _
本紙張尺度適用中.國國家標準(CNS ) A4規格(2丨OX 297公釐) 表 1 *僅胺酯泡沫 五、發明説明(1令 r 屋縮變形 («) 牽引強度 Kg/英吋 電阻(Ω) 屛蔽性(dB) 厚度方向 長度方向 50MHz 100MHz 500»Hz lOOOUHz 實施例1 20 10Kg以上 0.1 Ω 0.2Q 93 99 96 86 實施例2 20 10Kg以上 0.1 Ω 0.2Ω 97 98 97 85 實施例3 20 10Kg以上 0.1 Ω 0.2Ω 99 99 97 87 實施例4 20 10Kg以上 0.8 Ω 1.0Ω 50 47 30 30 實施例5 20 10Kg以上 0.1 Ω 0.2Ω 98 98 96 85 實施例6 20 10Kg以上 0. 1 Ω 0.2Ω 97 99 97 84 實施例7 20 10Kg以上 0.1 Ω 0.2Ω 98 98 96 85 實施例8 20 10Kg以上 0.1 〇 0. 2Ω 98 98 96 86 比較例1 18 0.1 Ω 0.2Ω 99 98 97 87 比較例2 19 0. 7 Ω 1.0Ω 46 36 27 25 比較例3 20 lKg 0.1 Ω 0.2Ω 97 98 96 85 木 - - -· * 20 25 23 25 -17 - 4484 52 A7 B7 經濟部中央標準局貝工消費合作社印製 五、發明説明(15) 圖示之簡單說明: 圖1:表示先前之電磁波屏蔽封墊材料概略狀況斜視 圖。 圖2:表示依本發明之將粘著劑層設於有機纖維構造 薄片及合成樹脂多孔體薄片構成之複合體多孔薄片面之電 磁波屏蔽封墊材料之概略斜視圓* 圖3:表示依本發明之將拈著劑層設於有機纖維構造 薄片及合成樹脂多孔體薄片構成之纖維構造薄片面之電磁 波屏蔽封墊材料之概略斜視圖。 圖4:依本發明之由有機繊維構造薄片及合成樹脂多 孔體薄片構成之複合體薄片之概略斷面圖。 圖5 :本發明之圖4之複合體薄片中,在部分合成樹 脂多孔體而施予粘著加工之電磁波屏蔽封墊材料之概略斷 面'圖》_ 圖6 :本發明之圖4之複合體薄片中,在部分有機纖 維構造薄片而施予粘著加工之電磁波屏蔽封墊材料之概略 斷面圖》 圖7 :本發明之圖4之複合體薄片中,在合成樹脂多 孔體而全表面施予導電性粘著劑之電磁波屏蔽封墊材料之 概略斷面圖。 圖8 :本發明之圖4之複合體薄片中,在有機纖維構 造體面之全表面施予導電性粘著劑之電磁波屏蔽封墊材料 之概略斷面圖。 圖9:表示裁斷部分在圖8之導電性粘著劑層上配設 銪· 先 閲 之 注 意 事 項 再 填 寫 本 頁 装 訂 本紙張尺度速用中國囷家標準(CNS ) A4規格(2丨0X297公釐) -18 - 4484 5 2 A7 B7 五、發明说明(16 ) 離型紙之複合體薄片狀態之概略斜視圖。 圖10:表示裁斷部分在圖6部分附與之粘著劑層上 配設離型紙之複合體薄片狀態之概略斜視圖。 圖9及1 0因說明部分裁斷狀態,故簡略各構造部分 之表示方法,而與其他圖不同。 〔符號說明〕 1 .........未鍍金屬處理之合成樹脂多孔體薄片。 1^.........經鍍金屬處理之合成樹脂多孔體薄片> 2 .........鍍金羼處理布帛。 3 .........粘著劑層。 3 ^.........導電性粘著劑層。 4 .........離型紙。 5 .........經鍍金屬處理之有機繊維構造薄片· 6 .........接著部β 11 » Λ 訂 (请先Μ讀背面之注$項再填寫本頁) 經濟部中央標準局員工消費合作社印製 一 19 - 本紙張尺度適用中國國家標隼(CNS ) Α4規格(210X297公釐)
Claims (1)
- 448452 ll D8 六、申請專利範圍 1 0 .如申請專利範圍第1項所述之導電性材料,其 中金靥係由銀,鎳,銅及金選擇至少一種金屬而成。 1 1 .如申請專利範圍第1項所述之導電性材料,其 中經粘著劑將離型總貼於複合材薄片一方之表面。 1 2 .如申請專利範圍第1 1項所述之導電性材料> 其中粘著劑係由導電性粘著劑而成β 13. 如申請專利範圍第11項所述之導電性材料, 其中將離型紙以外之積層材料切斷爲可分別爲具有一定面 積之小區分β 14. 如申請專利範圍第13項所述之導電性材料, 其中將粘著劑以部分塗裝》 15. —種適於電磁波屏蔽封墊之導電性材料之製造 方法,其中,將合成纖維構造薄片與合成樹脂多孔體薄片 予以積層,粘接,其次將所得複合體薄片整體予以金靥電 鍍處理》 經濟部中央標準局員工消費合作社印製 C請先閲讀背面之注意事項再填寫本頁) 1 6 .如申請專利範圍第1 5項所述之方法中,將合 成樹脂多孔體薄片表面之至少一部分予以熱溶解以實施獲 得複合體之接著》 1 7 .如申請專利範圍第1 5項所述之方法,其中並 具有在金屬電鍍處理所得複合體薄片之一方之表面或離型 低表面塗粘著劑,成爲附離型紙之導電性材料工程。 1 8 如申請專利範圍第1 7項所述之方法中,並具 有將附離型紙之導電性材料之離型紙以外積層部分切斷成 可分割爲具有一定面積之小區分。 本紙張尺渡適用中國國家標準(CMS > Α4規格(21〇Χ297公嫠) -21 - 448452 Μ D8 六、申請專利範圍 1 0 .如申請專利範圍第1項所述之導電性材料,其 中金饜係由銀,鎳,銅及金選擇至少一種金屬而成。 1 1 .如申請專利範圍第1項所述之導電性材料,其 中經粘著劑將離型總貼於複合材薄片一方之表面。 1 2 .如申請專利範圍第1 1項所述之導電性材料, 其中粘著劑係由導電性牯著劑而成。 13.如申請專利範圍第11項所述之導電性材料, 其中將離型紙以外之積層材料切斷爲可分別爲具有一定面 稹之小區分。 1 4 .如申請專利範圔第1 3項所述之導電性材料, 其中將粘著劑以部分塗裝* 1 5 種適於電磁波屏蔽封墊之導電性材料之製造 方法’其中,將合成織維構造薄片與合成樹脂多孔體薄片 予以積層,粘接•其次將所得複合體薄片整體予以金屬電 鍍處理。 經濟部中央標準局貝工消费合作社印製 (請先Η讀背面之注意事項再填寫本頁) 1 6 .如申請專利範圍第1 5項所述之方法中,將合 成樹脂多孔體薄片表面之至少一部分予以熱溶解以實施獲 得複合體之接著· 1 7 .如申請專利範圍第1 5項所述之方法,其中並 具有在金屬電鍍處理所得複合體薄片之一方之表面或離型 低表面塗粘著劑·成爲附離型紙之導電性材料工程。 1 8 ·如申請專利範圍第1 7項所述之方法中,並具 有將附離型紙之導電性材料之離型紙以外積層部分切斷成 可分割爲具有一定面積之小區分* 本纸張尺度適用中SB家揉準(CNS ) Α4规格(210X297公釐) -21 -
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TW086107320A TW448452B (en) | 1996-08-05 | 1997-05-29 | Conductive material and its manufacture method |
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US (1) | US6569789B1 (zh) |
EP (1) | EP0917419B1 (zh) |
JP (1) | JP3306665B2 (zh) |
KR (1) | KR100396279B1 (zh) |
CN (1) | CN1094030C (zh) |
AU (1) | AU2044397A (zh) |
DE (1) | DE69723560T2 (zh) |
TW (1) | TW448452B (zh) |
WO (1) | WO1998006247A1 (zh) |
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- 1997-03-31 US US09/230,934 patent/US6569789B1/en not_active Expired - Lifetime
- 1997-03-31 AU AU20443/97A patent/AU2044397A/en not_active Abandoned
- 1997-03-31 WO PCT/JP1997/001110 patent/WO1998006247A1/ja active IP Right Grant
- 1997-03-31 CN CN97197057A patent/CN1094030C/zh not_active Expired - Lifetime
- 1997-03-31 JP JP50779198A patent/JP3306665B2/ja not_active Expired - Lifetime
- 1997-03-31 DE DE69723560T patent/DE69723560T2/de not_active Expired - Lifetime
- 1997-03-31 EP EP97908557A patent/EP0917419B1/en not_active Expired - Lifetime
- 1997-03-31 KR KR10-1999-7000940A patent/KR100396279B1/ko active IP Right Review Request
- 1997-05-29 TW TW086107320A patent/TW448452B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN1227702A (zh) | 1999-09-01 |
EP0917419A4 (en) | 2000-04-12 |
CN1094030C (zh) | 2002-11-06 |
KR100396279B1 (ko) | 2003-08-27 |
WO1998006247A1 (fr) | 1998-02-12 |
DE69723560D1 (de) | 2003-08-21 |
US6569789B1 (en) | 2003-05-27 |
KR20000029805A (ko) | 2000-05-25 |
EP0917419A1 (en) | 1999-05-19 |
JP3306665B2 (ja) | 2002-07-24 |
EP0917419B1 (en) | 2003-07-16 |
DE69723560T2 (de) | 2004-06-09 |
AU2044397A (en) | 1998-02-25 |
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