TW297910B - - Google Patents

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Publication number
TW297910B
TW297910B TW085101141A TW85101141A TW297910B TW 297910 B TW297910 B TW 297910B TW 085101141 A TW085101141 A TW 085101141A TW 85101141 A TW85101141 A TW 85101141A TW 297910 B TW297910 B TW 297910B
Authority
TW
Taiwan
Prior art keywords
arm
substrate
holding
patent application
processing unit
Prior art date
Application number
TW085101141A
Other languages
English (en)
Chinese (zh)
Original Assignee
Tokyo Electron Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP04641395A external-priority patent/JP3485990B2/ja
Application filed by Tokyo Electron Co Ltd filed Critical Tokyo Electron Co Ltd
Application granted granted Critical
Publication of TW297910B publication Critical patent/TW297910B/zh

Links

Classifications

    • H10P72/50—
    • H10P72/0448—
    • H10P72/3412—
    • H10P72/7602—

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW085101141A 1995-02-02 1996-01-30 TW297910B (OSRAM)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP3925495 1995-02-02
JP04641395A JP3485990B2 (ja) 1995-02-09 1995-02-09 搬送方法及び搬送装置

Publications (1)

Publication Number Publication Date
TW297910B true TW297910B (OSRAM) 1997-02-11

Family

ID=26378584

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085101141A TW297910B (OSRAM) 1995-02-02 1996-01-30

Country Status (3)

Country Link
US (2) US5664254A (OSRAM)
KR (1) KR100251340B1 (OSRAM)
TW (1) TW297910B (OSRAM)

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JP5154006B2 (ja) * 2004-12-06 2013-02-27 株式会社Ｓｏｋｕｄｏ 基板処理装置
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JP5128918B2 (ja) 2007-11-30 2013-01-23 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5318403B2 (ja) * 2007-11-30 2013-10-16 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP4975605B2 (ja) * 2007-12-26 2012-07-11 東京エレクトロン株式会社 処理システム、処理システムの制御方法およびソフトウェアのバージョンアップ方法
KR100892756B1 (ko) * 2007-12-27 2009-04-15 세메스 주식회사 기판 처리 장치 및 이를 이용한 기판 이송 방법
JP5001828B2 (ja) 2007-12-28 2012-08-15 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5179170B2 (ja) * 2007-12-28 2013-04-10 株式会社Ｓｏｋｕｄｏ 基板処理装置
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US8402638B1 (en) 2009-11-06 2013-03-26 Wd Media, Inc. Press system with embossing foil free to expand for nano-imprinting of recording media
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JP5639963B2 (ja) * 2010-06-16 2014-12-10 東京エレクトロン株式会社 基板処理装置及び基板処理方法並びに基板処理プログラムを記録した記録媒体
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US20140361800A1 (en) * 2013-06-05 2014-12-11 Qualcomm Incorporated Method and apparatus for high volume system level testing of logic devices with pop memory
JP6296164B2 (ja) 2014-09-08 2018-03-20 株式会社安川電機 ロボットシステムおよび搬送方法
JP6232164B2 (ja) * 2015-03-25 2017-11-15 株式会社日立国際電気 基板処理装置および半導体装置の製造方法
KR102240155B1 (ko) * 2017-03-29 2021-04-14 가부시키가이샤 코쿠사이 엘렉트릭 기판 이재 유닛, 기판 처리 장치 및 반도체 장치의 제조 방법
JP7114456B2 (ja) 2018-12-28 2022-08-08 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板搬送方法
JP2021048322A (ja) * 2019-09-19 2021-03-25 株式会社Ｓｃｒｅｅｎホールディングス 基板搬送装置および基板搬送方法
JP7608106B2 (ja) * 2020-10-05 2025-01-06 キオクシア株式会社 半導体製造装置
TW202249142A (zh) * 2021-02-25 2022-12-16 日商東京威力科創股份有限公司 基板搬送機構及基板搬送方法
CN114896940B (zh) 2022-07-13 2022-09-20 之江实验室 一种软件定义的晶圆级交换系统设计方法及装置

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Also Published As

Publication number Publication date
USRE37470E1 (en) 2001-12-18
KR960032577A (ko) 1996-09-17
US5664254A (en) 1997-09-02
KR100251340B1 (ko) 2000-04-15

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