TW200902582A - Epoxy resin composition - Google Patents

Epoxy resin composition Download PDF

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Publication number
TW200902582A
TW200902582A TW097110902A TW97110902A TW200902582A TW 200902582 A TW200902582 A TW 200902582A TW 097110902 A TW097110902 A TW 097110902A TW 97110902 A TW97110902 A TW 97110902A TW 200902582 A TW200902582 A TW 200902582A
Authority
TW
Taiwan
Prior art keywords
epoxy resin
resin composition
group
complex
formula
Prior art date
Application number
TW097110902A
Other languages
English (en)
Chinese (zh)
Other versions
TWI383002B (https=
Inventor
Yoshihisa Shinya
Jun Yamamoto
Ryota Aizaki
Naoki Hayashi
Misao Konishi
Original Assignee
Sony Chem & Inf Device Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chem & Inf Device Corp filed Critical Sony Chem & Inf Device Corp
Publication of TW200902582A publication Critical patent/TW200902582A/zh
Application granted granted Critical
Publication of TWI383002B publication Critical patent/TWI383002B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/72—Complexes of boron halides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Die Bonding (AREA)
TW097110902A 2007-06-15 2008-03-27 Epoxy resin composition TW200902582A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007158283A JP5190665B2 (ja) 2007-06-15 2007-06-15 エポキシ系樹脂組成物

Publications (2)

Publication Number Publication Date
TW200902582A true TW200902582A (en) 2009-01-16
TWI383002B TWI383002B (https=) 2013-01-21

Family

ID=40129456

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097110902A TW200902582A (en) 2007-06-15 2008-03-27 Epoxy resin composition

Country Status (8)

Country Link
US (1) US8431654B2 (https=)
EP (1) EP2161292B1 (https=)
JP (1) JP5190665B2 (https=)
KR (1) KR101167545B1 (https=)
CN (2) CN101778882B (https=)
IN (1) IN2014KN00897A (https=)
TW (1) TW200902582A (https=)
WO (1) WO2008152843A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI561603B (en) * 2011-11-23 2016-12-11 Cheil Ind Inc Adhesive composition, adhesive film and electronic component

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JP2008303167A (ja) * 2007-06-07 2008-12-18 Sony Chemical & Information Device Corp 新規なスルホニウムボレート錯体
JP4901889B2 (ja) * 2008-02-18 2012-03-21 ソニーケミカル＆インフォメーションデバイス株式会社 磁性シート組成物、磁性シート、及び磁性シートの製造方法
JP5444702B2 (ja) * 2008-12-05 2014-03-19 デクセリアルズ株式会社 新規なスルホニウムボレート錯体
JP4784698B1 (ja) * 2010-05-06 2011-10-05 横浜ゴム株式会社 熱硬化性エポキシ樹脂組成物
KR101829475B1 (ko) 2010-06-09 2018-02-14 데쿠세리아루즈 가부시키가이샤 광반사성 이방성 도전 페이스트 및 발광 장치
JP5707754B2 (ja) * 2010-07-12 2015-04-30 横浜ゴム株式会社 導電性組成物および太陽電池セル
CN103154074B (zh) * 2010-09-29 2014-10-01 横滨橡胶株式会社 阳离子聚合引发剂以及热固化性环氧树脂组合物
JP5727316B2 (ja) * 2011-07-06 2015-06-03 積水化学工業株式会社 スルホニウム化合物の製造方法、並びにスルホニウムボレート錯体の製造方法
KR101391697B1 (ko) * 2011-12-14 2014-05-07 제일모직주식회사 이방성 도전 필름용 조성물 및 이를 이용한 이방성 도전 필름
JP6251557B2 (ja) * 2013-12-05 2017-12-20 デクセリアルズ株式会社 化合物、熱硬化性樹脂組成物、及び熱硬化性シート
JP2014131997A (ja) * 2013-12-26 2014-07-17 Dexerials Corp 新規なスルホニウムボレート錯体
KR101665171B1 (ko) * 2014-01-29 2016-10-11 제일모직주식회사 이방 도전성 필름 및 상기 필름에 의해 접속된 반도체 장치
KR101706818B1 (ko) 2014-04-30 2017-02-15 제일모직주식회사 이방 도전성 필름용 조성물, 이방 도전성 필름 및 반도체 장치
JP6434748B2 (ja) * 2014-08-29 2018-12-05 積水化学工業株式会社 有機エレクトロルミネッセンス表示素子用封止剤
KR101731677B1 (ko) 2014-08-29 2017-04-28 삼성에스디아이 주식회사 이방 도전성 필름용 조성물, 이방 도전성 필름 및 반도체 장치
JP6644267B2 (ja) * 2015-03-10 2020-02-12 横浜ゴム株式会社 カチオン重合開始剤およびエポキシ樹脂組成物
KR102363322B1 (ko) 2016-02-22 2022-02-15 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름
JP6776609B2 (ja) 2016-02-22 2020-10-28 デクセリアルズ株式会社 異方性導電フィルム
JP7462408B2 (ja) 2019-12-13 2024-04-05 デクセリアルズ株式会社 接着剤組成物、接着フィルム及び接続構造体
JP7764146B2 (ja) 2021-06-03 2025-11-05 デクセリアルズ株式会社 接着剤組成物、接着フィルム、接続構造体および接続構造体の製造方法

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JP2008303167A (ja) * 2007-06-07 2008-12-18 Sony Chemical & Information Device Corp 新規なスルホニウムボレート錯体

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI561603B (en) * 2011-11-23 2016-12-11 Cheil Ind Inc Adhesive composition, adhesive film and electronic component

Also Published As

Publication number Publication date
CN101778882B (zh) 2012-08-29
EP2161292A1 (en) 2010-03-10
CN102633994B (zh) 2015-06-17
KR101167545B1 (ko) 2012-07-20
US20100193228A1 (en) 2010-08-05
US8431654B2 (en) 2013-04-30
TWI383002B (https=) 2013-01-21
EP2161292B1 (en) 2012-06-20
WO2008152843A1 (ja) 2008-12-18
HK1142348A1 (en) 2010-12-03
KR20100029759A (ko) 2010-03-17
JP2008308596A (ja) 2008-12-25
CN101778882A (zh) 2010-07-14
JP5190665B2 (ja) 2013-04-24
EP2161292A4 (en) 2010-09-22
IN2014KN00897A (https=) 2015-08-21
CN102633994A (zh) 2012-08-15
HK1170514A1 (en) 2013-03-01

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