WO2008152843A1 - エポキシ系樹脂組成物 - Google Patents

エポキシ系樹脂組成物 Download PDF

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Publication number
WO2008152843A1
WO2008152843A1 PCT/JP2008/054924 JP2008054924W WO2008152843A1 WO 2008152843 A1 WO2008152843 A1 WO 2008152843A1 JP 2008054924 W JP2008054924 W JP 2008054924W WO 2008152843 A1 WO2008152843 A1 WO 2008152843A1
Authority
WO
WIPO (PCT)
Prior art keywords
epoxy resin
resin composition
cationic polymerization
thermal cationic
formula
Prior art date
Application number
PCT/JP2008/054924
Other languages
English (en)
French (fr)
Inventor
Yoshihisa Shinya
Jun Yamamoto
Ryota Aizaki
Naoki Hayashi
Misao Konishi
Original Assignee
Sony Chemical & Information Device Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chemical & Information Device Corporation filed Critical Sony Chemical & Information Device Corporation
Priority to EP08722318A priority Critical patent/EP2161292B1/en
Priority to US12/451,798 priority patent/US8431654B2/en
Priority to CN2008801032801A priority patent/CN101778882B/zh
Priority to IN897KON2014 priority patent/IN2014KN00897A/en
Priority to KR1020097025723A priority patent/KR101167545B1/ko
Publication of WO2008152843A1 publication Critical patent/WO2008152843A1/ja
Priority to HK10108866.2A priority patent/HK1142348A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/72—Complexes of boron halides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides

Abstract

　エポキシ樹脂と熱カチオン重合開始剤とを含有し、熱カチオン重合時にフッ素イオン生成量を減じて耐電食性を向上させることができるだけでなく、低温速硬化性にも優れたエポキシ系樹脂組成物は、熱カチオン重合開始剤として、式（１）で表されるスルホニウムボレート錯体を使用する。 　式（１）中、Ｒ１はアラルキル基であり、Ｒ２は低級アルキル基である。但し、Ｒ２がメチル基であるとき、Ｒ１はベンジル基ではない。Ｘはハロゲン原子であり、ｎは１～３の整数である。
PCT/JP2008/054924 2007-06-15 2008-03-18 エポキシ系樹脂組成物 WO2008152843A1 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
EP08722318A EP2161292B1 (en) 2007-06-15 2008-03-18 Epoxy resin composition
US12/451,798 US8431654B2 (en) 2007-06-15 2008-03-18 Epoxy resin composition
CN2008801032801A CN101778882B (zh) 2007-06-15 2008-03-18 环氧树脂组合物
IN897KON2014 IN2014KN00897A (ja) 2007-06-15 2008-03-18
KR1020097025723A KR101167545B1 (ko) 2007-06-15 2008-03-18 에폭시계 수지 조성물
HK10108866.2A HK1142348A1 (en) 2007-06-15 2010-09-17 Epoxy resin composition

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-158283 2007-06-15
JP2007158283A JP5190665B2 (ja) 2007-06-15 2007-06-15 エポキシ系樹脂組成物

Publications (1)

Publication Number Publication Date
WO2008152843A1 true WO2008152843A1 (ja) 2008-12-18

Family

ID=40129456

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/054924 WO2008152843A1 (ja) 2007-06-15 2008-03-18 エポキシ系樹脂組成物

Country Status (9)

Country Link
US (1) US8431654B2 (ja)
EP (1) EP2161292B1 (ja)
JP (1) JP5190665B2 (ja)
KR (1) KR101167545B1 (ja)
CN (2) CN101778882B (ja)
HK (2) HK1142348A1 (ja)
IN (1) IN2014KN00897A (ja)
TW (1) TW200902582A (ja)
WO (1) WO2008152843A1 (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010064648A1 (ja) * 2008-12-05 2010-06-10 ソニーケミカル＆インフォメーションデバイス株式会社 新規なスルホニウムボレート錯体
EP2078722A4 (en) * 2007-06-07 2011-08-17 Sony Chem & Inf Device Corp NEW SULFONIUM BORATE COMPLEX
CN102762629A (zh) * 2010-05-06 2012-10-31 横滨橡胶株式会社 热固化性环氧树脂组合物
JP2013014553A (ja) * 2011-07-06 2013-01-24 Sekisui Chem Co Ltd スルホニウム化合物及びその製造方法、並びにスルホニウムボレート錯体及びその製造方法
JP2014131997A (ja) * 2013-12-26 2014-07-17 Dexerials Corp 新規なスルホニウムボレート錯体
JP2015108090A (ja) * 2013-12-05 2015-06-11 デクセリアルズ株式会社 化合物、熱硬化性樹脂組成物、及び熱硬化性シート

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JP4901889B2 (ja) * 2008-02-18 2012-03-21 ソニーケミカル＆インフォメーションデバイス株式会社 磁性シート組成物、磁性シート、及び磁性シートの製造方法
CN102934243B (zh) * 2010-06-09 2018-08-31 迪睿合电子材料有限公司 光反射性各向异性导电浆料和发光装置
JP5707754B2 (ja) * 2010-07-12 2015-04-30 横浜ゴム株式会社 導電性組成物および太陽電池セル
KR101259446B1 (ko) * 2010-09-29 2013-05-02 요코하마 고무 가부시키가이샤 양이온 중합 개시제 및 열경화성 에폭시 수지 조성물
KR101391696B1 (ko) * 2011-11-23 2014-05-07 제일모직주식회사 이방 전도성 조성물 및 필름
KR101391697B1 (ko) * 2011-12-14 2014-05-07 제일모직주식회사 이방성 도전 필름용 조성물 및 이를 이용한 이방성 도전 필름
KR101665171B1 (ko) * 2014-01-29 2016-10-11 제일모직주식회사 이방 도전성 필름 및 상기 필름에 의해 접속된 반도체 장치
KR101706818B1 (ko) 2014-04-30 2017-02-15 제일모직주식회사 이방 도전성 필름용 조성물, 이방 도전성 필름 및 반도체 장치
KR101731677B1 (ko) 2014-08-29 2017-04-28 삼성에스디아이 주식회사 이방 도전성 필름용 조성물, 이방 도전성 필름 및 반도체 장치
JP6434748B2 (ja) * 2014-08-29 2018-12-05 積水化学工業株式会社 有機エレクトロルミネッセンス表示素子用封止剤
WO2016143474A1 (ja) * 2015-03-10 2016-09-15 横浜ゴム株式会社 カチオン重合開始剤およびエポキシ樹脂組成物
KR20240010091A (ko) 2016-02-22 2024-01-23 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름
JP6776609B2 (ja) 2016-02-22 2020-10-28 デクセリアルズ株式会社 異方性導電フィルム
JP7462408B2 (ja) 2019-12-13 2024-04-05 デクセリアルズ株式会社 接着剤組成物、接着フィルム及び接続構造体
JP2022185716A (ja) 2021-06-03 2022-12-15 デクセリアルズ株式会社 接着剤組成物、接着フィルム、接続構造体および接続構造体の製造方法

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JPH041177A (ja) * 1989-10-13 1992-01-06 Sanshin Chem Ind Co Ltd スルホニウム化合物
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JPH041177A (ja) * 1989-10-13 1992-01-06 Sanshin Chem Ind Co Ltd スルホニウム化合物
JPH05230189A (ja) * 1992-02-25 1993-09-07 Nippon Soda Co Ltd スルホニウム塩及び増感剤を含有する硬化性組成物
JPH08188570A (ja) * 1995-01-10 1996-07-23 Sanshin Chem Ind Co Ltd スルホニウム化合物の製造方法
JPH09176112A (ja) * 1995-12-28 1997-07-08 Toyo Ink Mfg Co Ltd 感エネルギー線酸発生剤、感エネルギー線酸発生剤組成物および硬化性組成物
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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2078722A4 (en) * 2007-06-07 2011-08-17 Sony Chem & Inf Device Corp NEW SULFONIUM BORATE COMPLEX
WO2010064648A1 (ja) * 2008-12-05 2010-06-10 ソニーケミカル＆インフォメーションデバイス株式会社 新規なスルホニウムボレート錯体
JP2010132614A (ja) * 2008-12-05 2010-06-17 Sony Chemical & Information Device Corp 新規なスルホニウムボレート錯体
CN102239144A (zh) * 2008-12-05 2011-11-09 索尼化学&信息部件株式会社 新型硼酸锍络合物
US8877878B2 (en) 2008-12-05 2014-11-04 Dexerials Corporation Epoxy resin composition with sulfonium borate complex
CN102762629A (zh) * 2010-05-06 2012-10-31 横滨橡胶株式会社 热固化性环氧树脂组合物
JP2013014553A (ja) * 2011-07-06 2013-01-24 Sekisui Chem Co Ltd スルホニウム化合物及びその製造方法、並びにスルホニウムボレート錯体及びその製造方法
JP2015108090A (ja) * 2013-12-05 2015-06-11 デクセリアルズ株式会社 化合物、熱硬化性樹脂組成物、及び熱硬化性シート
JP2014131997A (ja) * 2013-12-26 2014-07-17 Dexerials Corp 新規なスルホニウムボレート錯体

Also Published As

Publication number Publication date
EP2161292A1 (en) 2010-03-10
JP2008308596A (ja) 2008-12-25
KR20100029759A (ko) 2010-03-17
CN101778882A (zh) 2010-07-14
US8431654B2 (en) 2013-04-30
CN101778882B (zh) 2012-08-29
EP2161292A4 (en) 2010-09-22
JP5190665B2 (ja) 2013-04-24
US20100193228A1 (en) 2010-08-05
HK1142348A1 (en) 2010-12-03
EP2161292B1 (en) 2012-06-20
CN102633994B (zh) 2015-06-17
IN2014KN00897A (ja) 2015-08-21
CN102633994A (zh) 2012-08-15
HK1170514A1 (en) 2013-03-01
TW200902582A (en) 2009-01-16
KR101167545B1 (ko) 2012-07-20
TWI383002B (ja) 2013-01-21

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