HK1142348A1 - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- HK1142348A1 HK1142348A1 HK10108866.2A HK10108866A HK1142348A1 HK 1142348 A1 HK1142348 A1 HK 1142348A1 HK 10108866 A HK10108866 A HK 10108866A HK 1142348 A1 HK1142348 A1 HK 1142348A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- epoxy resin
- resin composition
- cationic polymerization
- thermal cationic
- formula
- Prior art date
Links
- 239000003822 epoxy resin Substances 0.000 title abstract 4
- 229920000647 polyepoxide Polymers 0.000 title abstract 4
- 239000000203 mixture Substances 0.000 title abstract 3
- 238000010538 cationic polymerization reaction Methods 0.000 abstract 3
- 239000003505 polymerization initiator Substances 0.000 abstract 2
- PSBPNWBGNOWCCU-UHFFFAOYSA-N OB(O)O.S.S.S Chemical compound OB(O)O.S.S.S PSBPNWBGNOWCCU-UHFFFAOYSA-N 0.000 abstract 1
- 125000000217 alkyl group Chemical group 0.000 abstract 1
- 125000003710 aryl alkyl group Chemical group 0.000 abstract 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 abstract 1
- 230000007797 corrosion Effects 0.000 abstract 1
- 238000005260 corrosion Methods 0.000 abstract 1
- 229910052731 fluorine Inorganic materials 0.000 abstract 1
- 239000011737 fluorine Substances 0.000 abstract 1
- -1 fluorine ions Chemical class 0.000 abstract 1
- 125000005843 halogen group Chemical group 0.000 abstract 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/72—Complexes of boron halides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Epoxy Resins (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007158283A JP5190665B2 (ja) | 2007-06-15 | 2007-06-15 | エポキシ系樹脂組成物 |
| PCT/JP2008/054924 WO2008152843A1 (ja) | 2007-06-15 | 2008-03-18 | エポキシ系樹脂組成物 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| HK1142348A1 true HK1142348A1 (en) | 2010-12-03 |
Family
ID=40129456
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| HK10108866.2A HK1142348A1 (en) | 2007-06-15 | 2010-09-17 | Epoxy resin composition |
| HK12111061.7A HK1170514A1 (en) | 2007-06-15 | 2012-11-02 | Epoxy resin composition |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| HK12111061.7A HK1170514A1 (en) | 2007-06-15 | 2012-11-02 | Epoxy resin composition |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US8431654B2 (ja) |
| EP (1) | EP2161292B1 (ja) |
| JP (1) | JP5190665B2 (ja) |
| KR (1) | KR101167545B1 (ja) |
| CN (2) | CN102633994B (ja) |
| HK (2) | HK1142348A1 (ja) |
| IN (1) | IN2014KN00897A (ja) |
| TW (1) | TW200902582A (ja) |
| WO (1) | WO2008152843A1 (ja) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008303167A (ja) * | 2007-06-07 | 2008-12-18 | Sony Chemical & Information Device Corp | 新規なスルホニウムボレート錯体 |
| JP4901889B2 (ja) * | 2008-02-18 | 2012-03-21 | ソニーケミカル＆インフォメーションデバイス株式会社 | 磁性シート組成物、磁性シート、及び磁性シートの製造方法 |
| JP5444702B2 (ja) * | 2008-12-05 | 2014-03-19 | デクセリアルズ株式会社 | 新規なスルホニウムボレート錯体 |
| JP4784698B1 (ja) * | 2010-05-06 | 2011-10-05 | 横浜ゴム株式会社 | 熱硬化性エポキシ樹脂組成物 |
| CN102934243B (zh) * | 2010-06-09 | 2018-08-31 | 迪睿合电子材料有限公司 | 光反射性各向异性导电浆料和发光装置 |
| JP5707754B2 (ja) * | 2010-07-12 | 2015-04-30 | 横浜ゴム株式会社 | 導電性組成物および太陽電池セル |
| CN103154074B (zh) * | 2010-09-29 | 2014-10-01 | 横滨橡胶株式会社 | 阳离子聚合引发剂以及热固化性环氧树脂组合物 |
| JP5727316B2 (ja) * | 2011-07-06 | 2015-06-03 | 積水化学工業株式会社 | スルホニウム化合物の製造方法、並びにスルホニウムボレート錯体の製造方法 |
| KR101391696B1 (ko) * | 2011-11-23 | 2014-05-07 | 제일모직주식회사 | 이방 전도성 조성물 및 필름 |
| KR101391697B1 (ko) * | 2011-12-14 | 2014-05-07 | 제일모직주식회사 | 이방성 도전 필름용 조성물 및 이를 이용한 이방성 도전 필름 |
| JP6251557B2 (ja) * | 2013-12-05 | 2017-12-20 | デクセリアルズ株式会社 | 化合物、熱硬化性樹脂組成物、及び熱硬化性シート |
| JP2014131997A (ja) * | 2013-12-26 | 2014-07-17 | Dexerials Corp | 新規なスルホニウムボレート錯体 |
| KR101665171B1 (ko) * | 2014-01-29 | 2016-10-11 | 제일모직주식회사 | 이방 도전성 필름 및 상기 필름에 의해 접속된 반도체 장치 |
| KR101706818B1 (ko) | 2014-04-30 | 2017-02-15 | 제일모직주식회사 | 이방 도전성 필름용 조성물, 이방 도전성 필름 및 반도체 장치 |
| JP6434748B2 (ja) * | 2014-08-29 | 2018-12-05 | 積水化学工業株式会社 | 有機エレクトロルミネッセンス表示素子用封止剤 |
| KR101731677B1 (ko) | 2014-08-29 | 2017-04-28 | 삼성에스디아이 주식회사 | 이방 도전성 필름용 조성물, 이방 도전성 필름 및 반도체 장치 |
| KR20170115580A (ko) * | 2015-03-10 | 2017-10-17 | 요코하마 고무 가부시키가이샤 | 양이온 중합 개시제 및 에폭시 수지 조성물 |
| JP6776609B2 (ja) | 2016-02-22 | 2020-10-28 | デクセリアルズ株式会社 | 異方性導電フィルム |
| WO2017145801A1 (ja) | 2016-02-22 | 2017-08-31 | デクセリアルズ株式会社 | 異方性導電フィルム |
| JP2022185716A (ja) | 2021-06-03 | 2022-12-15 | デクセリアルズ株式会社 | 接着剤組成物、接着フィルム、接続構造体および接続構造体の製造方法 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2797010B2 (ja) * | 1989-04-08 | 1998-09-17 | 三新化学工業株式会社 | 新規なスルホニウム化合物およびその製造方法 |
| CA2014047A1 (en) * | 1989-04-08 | 1990-10-08 | Yoshinari Yamamoto | Sulfonium compound and polymerization initiator comprising the sulfonium compound as the main ingredient |
| JP2797024B2 (ja) * | 1989-10-13 | 1998-09-17 | 三新化学工業株式会社 | スルホニウム化合物 |
| JP2706833B2 (ja) * | 1990-02-14 | 1998-01-28 | 三新化学工業株式会社 | カチオン重合開始剤および重合性組成物 |
| JPH05230189A (ja) * | 1992-02-25 | 1993-09-07 | Nippon Soda Co Ltd | スルホニウム塩及び増感剤を含有する硬化性組成物 |
| FR2727416A1 (fr) * | 1994-11-24 | 1996-05-31 | Rhone Poulenc Chimie | Nouveaux amorceurs cationiques thermoactivables, de polymerisation et/ou de reticulation et compositions monomeres et/ou polymeres fonctionnels les mettant en oeuvre |
| JP3679438B2 (ja) * | 1995-01-10 | 2005-08-03 | 三新化学工業株式会社 | スルホニウム化合物の製造方法 |
| JPH09179112A (ja) * | 1995-12-21 | 1997-07-11 | Citizen Watch Co Ltd | 液晶表示装置 |
| JP3937466B2 (ja) * | 1995-12-28 | 2007-06-27 | 東洋インキ製造株式会社 | 感エネルギー線酸発生剤、感エネルギー線酸発生剤組成物および硬化性組成物 |
| JPH10120766A (ja) * | 1996-10-21 | 1998-05-12 | Nippon Kayaku Co Ltd | エネルギー線硬化性組成物及び物品 |
| JPH10245378A (ja) | 1997-02-28 | 1998-09-14 | Nippon Kayaku Co Ltd | 新規スルホニウム塩、それからなる光重合開始剤及びエネルギー線硬化性組成物 |
| JP4215852B2 (ja) | 1997-03-10 | 2009-01-28 | 株式会社日本触媒 | テトラキス（フッ化アリール）ボレート誘導体の製造方法 |
| JP4122085B2 (ja) * | 1998-03-11 | 2008-07-23 | 三新化学工業株式会社 | スルホニウム化合物の製造方法 |
| JP2000191751A (ja) * | 1998-12-25 | 2000-07-11 | Sumitomo Bakelite Co Ltd | 紫外線硬化型樹脂組成物 |
| JP2002097443A (ja) * | 2000-09-21 | 2002-04-02 | Hitachi Chem Co Ltd | 接着剤組成物及びこれを用いた回路接続材料並びに接続体 |
| JP2005043862A (ja) * | 2003-04-09 | 2005-02-17 | Konica Minolta Medical & Graphic Inc | ホログラフィック記録用組成物、ホログラフィック記録メディア及びその記録方法 |
| EP1612623A4 (en) | 2003-04-09 | 2007-04-04 | Konica Minolta Med & Graphic | HOLOGRAPHIC RECORDING MEDIUM AND RECORDING METHOD THEREWITH |
| JP2006199778A (ja) * | 2005-01-19 | 2006-08-03 | Hitachi Chem Co Ltd | 接着剤組成物、回路接続用接着剤及びこれを用いた回路接続方法、接続体 |
| JP2006282633A (ja) * | 2005-04-04 | 2006-10-19 | Sanshin Chem Ind Co Ltd | スルホニウム化合物および重合組成物 |
| JP5256570B2 (ja) * | 2005-06-06 | 2013-08-07 | 東洋インキＳｃホールディングス株式会社 | 封止用組成物 |
| JP2008303167A (ja) * | 2007-06-07 | 2008-12-18 | Sony Chemical & Information Device Corp | 新規なスルホニウムボレート錯体 |
-
2007
- 2007-06-15 JP JP2007158283A patent/JP5190665B2/ja active Active
-
2008
- 2008-03-18 EP EP08722318A patent/EP2161292B1/en active Active
- 2008-03-18 IN IN897KON2014 patent/IN2014KN00897A/en unknown
- 2008-03-18 KR KR1020097025723A patent/KR101167545B1/ko active IP Right Grant
- 2008-03-18 CN CN201210079190.1A patent/CN102633994B/zh active Active
- 2008-03-18 US US12/451,798 patent/US8431654B2/en active Active
- 2008-03-18 CN CN2008801032801A patent/CN101778882B/zh active Active
- 2008-03-18 WO PCT/JP2008/054924 patent/WO2008152843A1/ja active Application Filing
- 2008-03-27 TW TW097110902A patent/TW200902582A/zh unknown
-
2010
- 2010-09-17 HK HK10108866.2A patent/HK1142348A1/xx unknown
-
2012
- 2012-11-02 HK HK12111061.7A patent/HK1170514A1/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| US8431654B2 (en) | 2013-04-30 |
| US20100193228A1 (en) | 2010-08-05 |
| JP2008308596A (ja) | 2008-12-25 |
| CN101778882B (zh) | 2012-08-29 |
| KR20100029759A (ko) | 2010-03-17 |
| CN102633994A (zh) | 2012-08-15 |
| TWI383002B (ja) | 2013-01-21 |
| CN102633994B (zh) | 2015-06-17 |
| JP5190665B2 (ja) | 2013-04-24 |
| WO2008152843A1 (ja) | 2008-12-18 |
| EP2161292A4 (en) | 2010-09-22 |
| CN101778882A (zh) | 2010-07-14 |
| IN2014KN00897A (ja) | 2015-08-21 |
| HK1170514A1 (en) | 2013-03-01 |
| EP2161292A1 (en) | 2010-03-10 |
| TW200902582A (en) | 2009-01-16 |
| EP2161292B1 (en) | 2012-06-20 |
| KR101167545B1 (ko) | 2012-07-20 |
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