TW200746302A - Method of making semiconductor IC device - Google Patents
Method of making semiconductor IC deviceInfo
- Publication number
- TW200746302A TW200746302A TW096101926A TW96101926A TW200746302A TW 200746302 A TW200746302 A TW 200746302A TW 096101926 A TW096101926 A TW 096101926A TW 96101926 A TW96101926 A TW 96101926A TW 200746302 A TW200746302 A TW 200746302A
- Authority
- TW
- Taiwan
- Prior art keywords
- oxide film
- thickness
- semiconductor wafer
- primary surface
- less
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 abstract 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract 1
- 238000006555 catalytic reaction Methods 0.000 abstract 1
- 239000001257 hydrogen Substances 0.000 abstract 1
- 229910052739 hydrogen Inorganic materials 0.000 abstract 1
- 230000003647 oxidation Effects 0.000 abstract 1
- 238000007254 oxidation reaction Methods 0.000 abstract 1
- 239000001301 oxygen Substances 0.000 abstract 1
- 229910052760 oxygen Inorganic materials 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Classifications
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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- H01L21/31662—Inorganic layers composed of oxides or glassy oxides or oxide based glass formed by oxidation of semiconductor materials, e.g. the body itself by thermal oxidation, e.g. of SiGe of silicon in uncombined form
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- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02164—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon oxide, e.g. SiO2
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/023—Deep level dopants
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/116—Oxidation, differential
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/935—Gas flow control
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- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Formation Of Insulating Films (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
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JP5078197 | 1997-03-05 | ||
PCT/JP1998/000892 WO1998039802A1 (fr) | 1997-03-05 | 1998-03-04 | Procede de production de circuit integre |
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Family Applications (11)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093110289A TWI250583B (en) | 1997-03-05 | 1998-02-27 | Manufacturing method for semiconductor integrated circuit device |
TW091102375A TWI227531B (en) | 1997-03-05 | 1998-02-27 | Manufacturing method of semiconductor integrated circuit device |
TW090114047A TW577129B (en) | 1997-03-05 | 1998-02-27 | Method for fabricating semiconductor integrated circuit device |
TW091102374A TWI227530B (en) | 1997-03-05 | 1998-02-27 | Manufacturing method of semiconductor integrated circuit device |
TW096101926A TW200746302A (en) | 1997-03-05 | 1998-02-27 | Method of making semiconductor IC device |
TW087102898A TW462093B (en) | 1997-03-05 | 1998-02-27 | Method for manufacturing semiconductor integrated circuit device having a thin insulative film |
TW095107658A TWI278933B (en) | 1997-03-05 | 1998-02-27 | Method of making semiconductor IC device |
TW089119829A TW471068B (en) | 1997-03-05 | 1998-02-27 | Method for fabricating semiconductor integrated circuit device with insulation film |
TW091102373A TWI233164B (en) | 1997-03-05 | 1998-02-27 | Method of making semiconductor integrated circuit device |
TW094103535A TWI278932B (en) | 1997-03-05 | 1998-02-27 | Manufacturing method of semiconductor integrated circuit device |
TW090114046A TW577128B (en) | 1997-03-05 | 1998-02-27 | Method for fabricating semiconductor integrated circuit device |
Family Applications Before (4)
Application Number | Title | Priority Date | Filing Date |
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TW093110289A TWI250583B (en) | 1997-03-05 | 1998-02-27 | Manufacturing method for semiconductor integrated circuit device |
TW091102375A TWI227531B (en) | 1997-03-05 | 1998-02-27 | Manufacturing method of semiconductor integrated circuit device |
TW090114047A TW577129B (en) | 1997-03-05 | 1998-02-27 | Method for fabricating semiconductor integrated circuit device |
TW091102374A TWI227530B (en) | 1997-03-05 | 1998-02-27 | Manufacturing method of semiconductor integrated circuit device |
Family Applications After (6)
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TW095107658A TWI278933B (en) | 1997-03-05 | 1998-02-27 | Method of making semiconductor IC device |
TW089119829A TW471068B (en) | 1997-03-05 | 1998-02-27 | Method for fabricating semiconductor integrated circuit device with insulation film |
TW091102373A TWI233164B (en) | 1997-03-05 | 1998-02-27 | Method of making semiconductor integrated circuit device |
TW094103535A TWI278932B (en) | 1997-03-05 | 1998-02-27 | Manufacturing method of semiconductor integrated circuit device |
TW090114046A TW577128B (en) | 1997-03-05 | 1998-02-27 | Method for fabricating semiconductor integrated circuit device |
Country Status (6)
Country | Link |
---|---|
US (14) | US6239041B1 (zh) |
EP (1) | EP0973191A4 (zh) |
KR (5) | KR100544257B1 (zh) |
CN (8) | CN100364056C (zh) |
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TWI449132B (zh) * | 2009-04-30 | 2014-08-11 | Renesas Electronics Corp | Manufacturing method of semiconductor device |
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