TW200638815A - Multilayer printed wiring board - Google Patents

Multilayer printed wiring board

Info

Publication number
TW200638815A
TW200638815A TW095103776A TW95103776A TW200638815A TW 200638815 A TW200638815 A TW 200638815A TW 095103776 A TW095103776 A TW 095103776A TW 95103776 A TW95103776 A TW 95103776A TW 200638815 A TW200638815 A TW 200638815A
Authority
TW
Taiwan
Prior art keywords
wiring board
printed wiring
via hole
hole
multilayer printed
Prior art date
Application number
TW095103776A
Other languages
English (en)
Other versions
TWI320675B (zh
Inventor
You-Hong Wu
Masanori Tamaki
Original Assignee
Ibiden Company Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Company Ltd filed Critical Ibiden Company Ltd
Publication of TW200638815A publication Critical patent/TW200638815A/zh
Application granted granted Critical
Publication of TWI320675B publication Critical patent/TWI320675B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0352—Differences between the conductors of different layers of a multilayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09454—Inner lands, i.e. lands around via or plated through-hole in internal layer of multilayer PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09627—Special connections between adjacent vias, not for grounding vias

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
TW095103776A 2005-02-02 2006-02-03 Multilayer printed wiring board TW200638815A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005026899A JP2006216714A (ja) 2005-02-02 2005-02-02 多層プリント配線板
JP2005026897A JP2006216712A (ja) 2005-02-02 2005-02-02 多層プリント配線板

Publications (2)

Publication Number Publication Date
TW200638815A true TW200638815A (en) 2006-11-01
TWI320675B TWI320675B (zh) 2010-02-11

Family

ID=36777168

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095103776A TW200638815A (en) 2005-02-02 2006-02-03 Multilayer printed wiring board

Country Status (7)

Country Link
US (1) US8367943B2 (zh)
EP (1) EP1848257B1 (zh)
JP (2) JP2006216714A (zh)
KR (3) KR101050697B1 (zh)
CN (1) CN101112142A (zh)
TW (1) TW200638815A (zh)
WO (1) WO2006082784A1 (zh)

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US8263878B2 (en) * 2008-03-25 2012-09-11 Ibiden Co., Ltd. Printed wiring board
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JP2010114108A (ja) * 2008-11-04 2010-05-20 Ngk Spark Plug Co Ltd 配線基板の非接触搬送装置及び方法
TW201110839A (en) * 2009-09-04 2011-03-16 Advanced Semiconductor Eng Substrate structure and method for manufacturing the same
JP5644242B2 (ja) 2009-09-09 2014-12-24 大日本印刷株式会社 貫通電極基板及びその製造方法
JP5313202B2 (ja) * 2010-04-30 2013-10-09 日本メクトロン株式会社 ビルドアップ型多層プリント配線板及びその製造方法
KR101097628B1 (ko) * 2010-06-21 2011-12-22 삼성전기주식회사 인쇄회로기판 및 이의 제조방법
TWI436699B (zh) 2010-07-12 2014-05-01 Princo Corp 多層導通孔疊構
JP5565949B2 (ja) * 2010-07-30 2014-08-06 京セラＳｌｃテクノロジー株式会社 配線基板
CN102404935B (zh) * 2010-09-13 2014-07-02 巨擘科技股份有限公司 多层导通孔叠层结构
JP5565958B2 (ja) * 2010-10-30 2014-08-06 京セラＳｌｃテクノロジー株式会社 配線基板
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KR101231362B1 (ko) * 2011-06-10 2013-02-07 엘지이노텍 주식회사 인쇄회로기판 및 그의 제조 방법
US8927875B2 (en) * 2011-10-28 2015-01-06 Ibiden Co., Ltd. Wiring board and method for manufacturing wiring board
US9275925B2 (en) * 2013-03-12 2016-03-01 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for an improved interconnect structure
JP6205834B2 (ja) * 2013-05-14 2017-10-04 株式会社村田製作所 樹脂多層基板
KR102116962B1 (ko) 2013-06-25 2020-05-29 삼성전자주식회사 반도체 패키지
JP2015126053A (ja) * 2013-12-26 2015-07-06 富士通株式会社 配線基板、配線基板の製造方法及び電子装置
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JP6329027B2 (ja) * 2014-08-04 2018-05-23 ミネベアミツミ株式会社 フレキシブルプリント基板
CN104392934A (zh) * 2014-10-31 2015-03-04 华进半导体封装先导技术研发中心有限公司 封装基板的阻焊制作方法
CN105657988B (zh) * 2014-11-21 2019-04-23 宏启胜精密电子(秦皇岛)有限公司 柔性电路板及其制作方法
JP6641717B2 (ja) * 2015-04-08 2020-02-05 日立化成株式会社 多層配線基板の製造方法
US9743526B1 (en) * 2016-02-10 2017-08-22 International Business Machines Corporation Wiring board with stacked embedded capacitors and method of making
US11056436B2 (en) * 2016-06-07 2021-07-06 Taiwan Semiconductor Manufacturing Co., Ltd. Integrated fan-out structure with rugged interconnect
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JP2021093417A (ja) * 2019-12-09 2021-06-17 イビデン株式会社 プリント配線板、及び、プリント配線板の製造方法
US11257790B2 (en) 2020-03-10 2022-02-22 Applied Materials, Inc. High connectivity device stacking
US11454884B2 (en) 2020-04-15 2022-09-27 Applied Materials, Inc. Fluoropolymer stamp fabrication method
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TWI720898B (zh) * 2020-05-28 2021-03-01 欣興電子股份有限公司 具有增加芯層走線面積的載板結構及其製作方法
US11232951B1 (en) 2020-07-14 2022-01-25 Applied Materials, Inc. Method and apparatus for laser drilling blind vias
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JP2022057232A (ja) * 2020-09-30 2022-04-11 イビデン株式会社 配線基板
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Also Published As

Publication number Publication date
JP2006216712A (ja) 2006-08-17
WO2006082784A1 (ja) 2006-08-10
KR101047824B1 (ko) 2011-07-08
KR20070089886A (ko) 2007-09-03
KR20090115774A (ko) 2009-11-05
KR20110028556A (ko) 2011-03-18
EP1848257B1 (en) 2013-03-27
CN101112142A (zh) 2008-01-23
EP1848257A1 (en) 2007-10-24
TWI320675B (zh) 2010-02-11
KR101069572B1 (ko) 2011-10-05
KR101050697B1 (ko) 2011-07-20
JP2006216714A (ja) 2006-08-17
EP1848257A4 (en) 2009-11-25
US8367943B2 (en) 2013-02-05
US20080314632A1 (en) 2008-12-25

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