ATE531241T1 - Bestückte leiterplatte - Google Patents

Bestückte leiterplatte

Info

Publication number
ATE531241T1
ATE531241T1 AT09167291T AT09167291T ATE531241T1 AT E531241 T1 ATE531241 T1 AT E531241T1 AT 09167291 T AT09167291 T AT 09167291T AT 09167291 T AT09167291 T AT 09167291T AT E531241 T1 ATE531241 T1 AT E531241T1
Authority
AT
Austria
Prior art keywords
power supply
supply wiring
via hole
embled
circuit board
Prior art date
Application number
AT09167291T
Other languages
English (en)
Inventor
Seiji Hayashi
Original Assignee
Canon Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Kk filed Critical Canon Kk
Application granted granted Critical
Publication of ATE531241T1 publication Critical patent/ATE531241T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969—Apertured conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
AT09167291T 2008-08-07 2009-08-05 Bestückte leiterplatte ATE531241T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008203734 2008-08-07
JP2009145453A JP5284194B2 (ja) 2008-08-07 2009-06-18 プリント配線板およびプリント回路板

Publications (1)

Publication Number Publication Date
ATE531241T1 true ATE531241T1 (de) 2011-11-15

Family

ID=41172327

Family Applications (1)

Application Number Title Priority Date Filing Date
AT09167291T ATE531241T1 (de) 2008-08-07 2009-08-05 Bestückte leiterplatte

Country Status (6)

Country Link
US (1) US8168895B2 (de)
EP (1) EP2152050B1 (de)
JP (1) JP5284194B2 (de)
KR (1) KR101076671B1 (de)
CN (1) CN101646300B (de)
AT (1) ATE531241T1 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5354949B2 (ja) 2007-06-19 2013-11-27 キヤノン株式会社 プリント回路板
CN102802339B (zh) * 2011-05-23 2017-05-24 永捷电子（始兴）有限公司 印刷电路板
CN103091648A (zh) * 2011-10-28 2013-05-08 爱盛科技股份有限公司 磁感测装置
CN103091649A (zh) * 2011-10-28 2013-05-08 爱盛科技股份有限公司 磁感测装置
JP5904856B2 (ja) 2012-04-23 2016-04-20 キヤノン株式会社 プリント配線板、半導体パッケージ及びプリント回路板
KR101472638B1 (ko) * 2012-12-31 2014-12-15 삼성전기주식회사 수동소자 내장기판
US8723052B1 (en) * 2013-02-27 2014-05-13 Boulder Wind Power, Inc. Methods and apparatus for optimizing electrical interconnects on laminated composite assemblies
US8785784B1 (en) 2013-03-13 2014-07-22 Boulder Wind Power, Inc. Methods and apparatus for optimizing structural layout of multi-circuit laminated composite assembly
JP6385075B2 (ja) * 2013-04-15 2018-09-05 キヤノン株式会社 プリント配線板、プリント回路板及び電子機器
US9459398B2 (en) * 2013-07-18 2016-10-04 Quarkstar Llc Illumination device in which source light injection is non-parallel to device's optical axis
US9793775B2 (en) 2013-12-31 2017-10-17 Boulder Wind Power, Inc. Methods and apparatus for reducing machine winding circulating current losses
JP6758888B2 (ja) * 2016-04-06 2020-09-23 株式会社アムコー・テクノロジー・ジャパン 半導体装置
CN107479227A (zh) * 2017-07-06 2017-12-15 惠科股份有限公司 一种电路板及其制作方法
JP6984442B2 (ja) 2018-01-25 2021-12-22 富士通株式会社 基板、電子装置、及び基板の設計支援方法
JP6984441B2 (ja) * 2018-01-25 2021-12-22 富士通株式会社 基板及び電子装置
JP2019201070A (ja) * 2018-05-15 2019-11-21 株式会社デンソーテン 多層基板及び多層基板を用いて素子に電流を供給する方法
FR3083320B1 (fr) * 2018-06-27 2022-11-11 Safran Electronics & Defense Circuit imprime integrant un pont diviseur de courant
IT202000029210A1 (it) * 2020-12-01 2022-06-01 St Microelectronics Srl Dispositivo a semiconduttore e corrispondente procedimento

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0997953A (ja) * 1995-09-29 1997-04-08 Toshiba Ave Corp 大電流用プリント基板
JP3957803B2 (ja) 1996-02-22 2007-08-15 キヤノン株式会社 光電変換装置
US5969421A (en) 1997-11-18 1999-10-19 Lucent Technologies Inc. Integrated circuit conductors that avoid current crowding
JPH11224974A (ja) * 1998-02-06 1999-08-17 Hitachi Ltd 配線基板
JP2000200948A (ja) * 1999-01-07 2000-07-18 Toshiba Corp 並列回路の配線構造
US6977435B2 (en) 2003-09-09 2005-12-20 Intel Corporation Thick metal layer integrated process flow to improve power delivery and mechanical buffering
JP2006066665A (ja) * 2004-08-27 2006-03-09 Mitsumi Electric Co Ltd 配線基板
US7501698B2 (en) 2004-10-26 2009-03-10 Kabushiki Kaisha Toshiba Method and system for an improved power distribution network for use with a semiconductor device
KR100905404B1 (ko) 2006-08-07 2009-06-30 닛뽕 아비오닉스 가부시끼가이샤 프린트 배선판의 접속 방법 및 접속 장치
JP2008078314A (ja) * 2006-09-20 2008-04-03 Toshiba Corp 高速信号回路装置
US8056039B2 (en) * 2008-05-29 2011-11-08 International Business Machines Corporation Interconnect structure for integrated circuits having improved electromigration characteristics

Also Published As

Publication number Publication date
KR101076671B1 (ko) 2011-10-26
CN101646300B (zh) 2011-08-03
US20100032195A1 (en) 2010-02-11
US8168895B2 (en) 2012-05-01
EP2152050A1 (de) 2010-02-10
EP2152050B1 (de) 2011-10-26
JP2010062530A (ja) 2010-03-18
KR20100019342A (ko) 2010-02-18
JP5284194B2 (ja) 2013-09-11
CN101646300A (zh) 2010-02-10

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