TW200729554A - Installing substrate for light emitting diode - Google Patents
Installing substrate for light emitting diodeInfo
- Publication number
- TW200729554A TW200729554A TW095139597A TW95139597A TW200729554A TW 200729554 A TW200729554 A TW 200729554A TW 095139597 A TW095139597 A TW 095139597A TW 95139597 A TW95139597 A TW 95139597A TW 200729554 A TW200729554 A TW 200729554A
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- emitting diode
- penetrable hole
- light
- penetrable
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Led Device Packages (AREA)
Abstract
The invention relates to the installing substrate for light-emitting diode. The bottom substrate is insulated electrically from the upper substrate. Each substrate of the installing substrate for light-emitting diode is equipped with different circuits having different functions. The installing substrate for light emitting diode 1 of this invention is composed of the followings: the insulation body installed with the first penetrable hole; the supporting thin film 4 (copper foil) used for heat sink with thickness 50 ~ 500 μm, which is deposited on one surface; the bottom substrate 11, which is installed on the other surface of conductor layer 5 to connect the light-emitting diode device 2 of the supporting thin film used for heat sink from the inside of the first penetrable hole of insulation body; the second penetrable hole of the insulation middle layer 12, deposited on the section of opening portion of the first penetrable hole in another surface of the bottom substrate to connect the whole surface with the opening surface of the first penetrable hole; and the third penetrable hole of the upper portion substrate 13, deposited on the section of opening portion of the second penetrable hole in the surface to connect the whole surface with the opening surface of the second penetrable hole. The bottom substrate insulates electrically with the upper substrate.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005320161 | 2005-11-02 | ||
JP2006089520A JP3978456B2 (en) | 2005-11-02 | 2006-03-28 | LED mounting board |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200729554A true TW200729554A (en) | 2007-08-01 |
TWI318465B TWI318465B (en) | 2009-12-11 |
Family
ID=38211213
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095139597A TW200729554A (en) | 2005-11-02 | 2006-10-26 | Installing substrate for light emitting diode |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP3978456B2 (en) |
KR (1) | KR100850061B1 (en) |
TW (1) | TW200729554A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI407598B (en) * | 2010-05-26 | 2013-09-01 | Advanced Optoelectronic Tech | Method of manufacturing led package |
TWI461626B (en) * | 2009-12-28 | 2014-11-21 | Chi Mei Comm Systems Inc | Light source device and portable electronic device using the same |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080128734A1 (en) * | 2006-01-06 | 2008-06-05 | Epistar Corporation | Light-emitting device |
KR20080054327A (en) * | 2006-12-12 | 2008-06-17 | 교리츠 엘렉스 가부시키가이샤 | Package for light-emitting diode and manufacturing method thereof, and light-emitting diode |
JP5405467B2 (en) * | 2007-08-31 | 2014-02-05 | エルジー イノテック カンパニー リミテッド | Light emitting device package |
KR101370791B1 (en) * | 2007-09-28 | 2014-03-10 | 삼성전자주식회사 | Light emitting device |
KR101370790B1 (en) * | 2007-09-28 | 2014-03-10 | 삼성전자주식회사 | Bar type light emitting device |
JP5400290B2 (en) * | 2007-11-13 | 2014-01-29 | 電気化学工業株式会社 | Light emitting device |
JP5400289B2 (en) * | 2007-11-13 | 2014-01-29 | 電気化学工業株式会社 | Light emitting device |
JP5238366B2 (en) * | 2008-06-09 | 2013-07-17 | スタンレー電気株式会社 | Semiconductor light emitting device |
JP5150384B2 (en) * | 2008-06-25 | 2013-02-20 | スタンレー電気株式会社 | Semiconductor light emitting device |
JP5227693B2 (en) * | 2008-08-11 | 2013-07-03 | スタンレー電気株式会社 | Semiconductor light emitting device |
JP5482293B2 (en) * | 2009-03-05 | 2014-05-07 | 日亜化学工業株式会社 | Optical semiconductor device and manufacturing method thereof |
JP2010220682A (en) * | 2009-03-19 | 2010-10-07 | Daito Giken:Kk | Game machine |
KR101071593B1 (en) | 2009-06-12 | 2011-10-10 | 김용태 | Light Emitting Sheet capable of forming free shape |
WO2011129202A1 (en) * | 2010-04-16 | 2011-10-20 | 日亜化学工業株式会社 | Light-emitting device and manufacturing method for light-emitting device |
KR101114719B1 (en) | 2010-08-09 | 2012-02-29 | 엘지이노텍 주식회사 | Light emitting device and lighing system |
KR101114197B1 (en) | 2010-08-09 | 2012-02-22 | 엘지이노텍 주식회사 | Light emitting device and lighing system |
JP5740981B2 (en) * | 2011-01-05 | 2015-07-01 | ソニー株式会社 | LIGHT EMITTING DEVICE, LIGHTING DEVICE, AND DISPLAY DEVICE |
JP2012152452A (en) * | 2011-01-27 | 2012-08-16 | Pearl Lighting Co Ltd | Photocatalytic deodorizer |
US8879276B2 (en) | 2011-06-15 | 2014-11-04 | Power Gold LLC | Flexible circuit assembly and method thereof |
JP6104527B2 (en) * | 2012-06-29 | 2017-03-29 | シャープ株式会社 | Light emitting device |
JP2014233383A (en) * | 2013-05-31 | 2014-12-15 | シャープ株式会社 | Photocatalytic sterilization deodorizing device |
US10642087B2 (en) | 2014-05-23 | 2020-05-05 | Eyesafe, Llc | Light emission reducing compounds for electronic devices |
JP2017123418A (en) * | 2016-01-08 | 2017-07-13 | 豊田合成株式会社 | Illumination device |
JP6458793B2 (en) | 2016-11-21 | 2019-01-30 | 日亜化学工業株式会社 | Method for manufacturing light emitting device |
KR102401826B1 (en) * | 2017-09-15 | 2022-05-25 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | Light emitting device package and lighting apparatus |
JP7231809B2 (en) * | 2018-06-05 | 2023-03-02 | 日亜化学工業株式会社 | light emitting device |
JP7266387B2 (en) * | 2018-11-12 | 2023-04-28 | 株式会社ジャパンディスプレイ | Display device |
US11592701B2 (en) | 2018-11-28 | 2023-02-28 | Eyesafe Inc. | Backlight unit with emission modification |
US11810532B2 (en) | 2018-11-28 | 2023-11-07 | Eyesafe Inc. | Systems for monitoring and regulating harmful blue light exposure from digital devices |
US10971660B2 (en) * | 2019-08-09 | 2021-04-06 | Eyesafe Inc. | White LED light source and method of making same |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005158957A (en) * | 2003-11-25 | 2005-06-16 | Matsushita Electric Works Ltd | Light emitting device |
JP4572312B2 (en) * | 2004-02-23 | 2010-11-04 | スタンレー電気株式会社 | LED and manufacturing method thereof |
KR100583162B1 (en) * | 2004-04-06 | 2006-05-23 | 엘지이노텍 주식회사 | Light emitting diode package |
JP4453004B2 (en) * | 2004-08-19 | 2010-04-21 | 日立化成工業株式会社 | Wiring board for mounting light-emitting elements |
JP3956965B2 (en) * | 2004-09-07 | 2007-08-08 | 日立エーアイシー株式会社 | Chip component type light emitting device and wiring board therefor |
JP4659421B2 (en) * | 2004-09-30 | 2011-03-30 | 株式会社トクヤマ | Manufacturing method of light emitting element storage package |
-
2006
- 2006-03-28 JP JP2006089520A patent/JP3978456B2/en not_active Expired - Fee Related
- 2006-04-20 KR KR20060035542A patent/KR100850061B1/en not_active IP Right Cessation
- 2006-10-26 TW TW095139597A patent/TW200729554A/en not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI461626B (en) * | 2009-12-28 | 2014-11-21 | Chi Mei Comm Systems Inc | Light source device and portable electronic device using the same |
TWI407598B (en) * | 2010-05-26 | 2013-09-01 | Advanced Optoelectronic Tech | Method of manufacturing led package |
Also Published As
Publication number | Publication date |
---|---|
KR100850061B1 (en) | 2008-08-04 |
TWI318465B (en) | 2009-12-11 |
KR20070047680A (en) | 2007-05-07 |
JP2007150228A (en) | 2007-06-14 |
JP3978456B2 (en) | 2007-09-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW200729554A (en) | Installing substrate for light emitting diode | |
TW200715601A (en) | Light emitting diode chip | |
US20090116252A1 (en) | Thermal surface mounting of multiple leds onto a heatsink | |
TW200731908A (en) | Multilayer printed wiring board and method for manufacturing same | |
HK1129950A1 (en) | Surface mountable lightemitting element | |
WO2006101257B1 (en) | Light-emitting module | |
TW200744226A (en) | Light emitting device | |
JP2007514320A5 (en) | ||
TW200734750A (en) | LED illumination assembly with compliant foil construction | |
TW200628725A (en) | Illumination assembly using circuitized strips | |
JP2007510297A5 (en) | ||
WO2008027709A3 (en) | Microelectronic device having interconnects and conductive backplanes | |
TW200746449A (en) | Illumination assembly with enhanced thermal conductivity | |
EP1667226A3 (en) | Thermal management of surface-mount circuit devices | |
WO2011031417A3 (en) | Electronic device submounts with thermally conductive vias and light emitting devices including the same | |
ATE381248T1 (en) | FLEXIBLE INTERMEDIATE CIRCUIT STRUCTURES FOR ELECTRICAL DEVICES AND LIGHT SOURCES WITH SUCH STRUCTURES | |
TW200711065A (en) | Semiconductor device and manufacturing method thereof | |
TW200741829A (en) | Methods of forming through-wafer interconnects and structures resulting therefrom | |
SG150410A1 (en) | Partitioned through-layer via and associated systems and methods | |
TW200729543A (en) | Light emitting device and method of forming the same | |
SG143975A1 (en) | Method of manufacturing a semiconductor device | |
TW200610458A (en) | Circuit board and method for the production of such a circuit board | |
TW200623324A (en) | Semiconductor device and its manufacturing method | |
TW200633575A (en) | Illumination system | |
TW201240146A (en) | Light-emitting semiconductor chip |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |