TWI318465B - - Google Patents

Info

Publication number
TWI318465B
TWI318465B TW95139597A TW95139597A TWI318465B TW I318465 B TWI318465 B TW I318465B TW 95139597 A TW95139597 A TW 95139597A TW 95139597 A TW95139597 A TW 95139597A TW I318465 B TWI318465 B TW I318465B
Authority
TW
Taiwan
Application number
TW95139597A
Other languages
Chinese (zh)
Other versions
TW200729554A (en
Inventor
Nobuo Mito
Yoshio Ueda
Original Assignee
Torion Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Torion Co Ltd filed Critical Torion Co Ltd
Publication of TW200729554A publication Critical patent/TW200729554A/en
Application granted granted Critical
Publication of TWI318465B publication Critical patent/TWI318465B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
TW095139597A 2005-11-02 2006-10-26 Installing substrate for light emitting diode TW200729554A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005320161 2005-11-02
JP2006089520A JP3978456B2 (en) 2005-11-02 2006-03-28 LED mounting board

Publications (2)

Publication Number Publication Date
TW200729554A TW200729554A (en) 2007-08-01
TWI318465B true TWI318465B (en) 2009-12-11

Family

ID=38211213

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095139597A TW200729554A (en) 2005-11-02 2006-10-26 Installing substrate for light emitting diode

Country Status (3)

Country Link
JP (1) JP3978456B2 (en)
KR (1) KR100850061B1 (en)
TW (1) TW200729554A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI382567B (en) * 2007-11-15 2013-01-11 Epistar Corp Light-emitting device

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080054327A (en) * 2006-12-12 2008-06-17 교리츠 엘렉스 가부시키가이샤 Package for light-emitting diode and manufacturing method thereof, and light-emitting diode
EP2191517B1 (en) * 2007-08-31 2017-11-29 LG Innotek Co., Ltd. Light emitting device package
KR101370790B1 (en) * 2007-09-28 2014-03-10 삼성전자주식회사 Bar type light emitting device
KR101370791B1 (en) * 2007-09-28 2014-03-10 삼성전자주식회사 Light emitting device
JP5400289B2 (en) * 2007-11-13 2014-01-29 電気化学工業株式会社 Light emitting device
JP5400290B2 (en) * 2007-11-13 2014-01-29 電気化学工業株式会社 Light emitting device
JP5238366B2 (en) * 2008-06-09 2013-07-17 スタンレー電気株式会社 Semiconductor light emitting device
JP5150384B2 (en) * 2008-06-25 2013-02-20 スタンレー電気株式会社 Semiconductor light emitting device
JP5227693B2 (en) * 2008-08-11 2013-07-03 スタンレー電気株式会社 Semiconductor light emitting device
JP5482293B2 (en) * 2009-03-05 2014-05-07 日亜化学工業株式会社 Optical semiconductor device and manufacturing method thereof
JP2010220682A (en) * 2009-03-19 2010-10-07 Daito Giken:Kk Game machine
KR101071593B1 (en) 2009-06-12 2011-10-10 김용태 Light Emitting Sheet capable of forming free shape
TWI461626B (en) * 2009-12-28 2014-11-21 Chi Mei Comm Systems Inc Light source device and portable electronic device using the same
WO2011129202A1 (en) * 2010-04-16 2011-10-20 日亜化学工業株式会社 Light-emitting device and manufacturing method for light-emitting device
TWI407598B (en) * 2010-05-26 2013-09-01 Advanced Optoelectronic Tech Method of manufacturing led package
KR101114197B1 (en) * 2010-08-09 2012-02-22 엘지이노텍 주식회사 Light emitting device and lighing system
KR101114719B1 (en) * 2010-08-09 2012-02-29 엘지이노텍 주식회사 Light emitting device and lighing system
JP5740981B2 (en) * 2011-01-05 2015-07-01 ソニー株式会社 LIGHT EMITTING DEVICE, LIGHTING DEVICE, AND DISPLAY DEVICE
JP2012152452A (en) * 2011-01-27 2012-08-16 Pearl Lighting Co Ltd Photocatalytic deodorizer
US8879276B2 (en) 2011-06-15 2014-11-04 Power Gold LLC Flexible circuit assembly and method thereof
JP6104527B2 (en) * 2012-06-29 2017-03-29 シャープ株式会社 Light emitting device
JP2014233383A (en) * 2013-05-31 2014-12-15 シャープ株式会社 Photocatalytic sterilization deodorizing device
US10642087B2 (en) 2014-05-23 2020-05-05 Eyesafe, Llc Light emission reducing compounds for electronic devices
JP2017123418A (en) * 2016-01-08 2017-07-13 豊田合成株式会社 Illumination device
JP6458793B2 (en) 2016-11-21 2019-01-30 日亜化学工業株式会社 Method for manufacturing light emitting device
KR102401826B1 (en) * 2017-09-15 2022-05-25 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 Light emitting device package and lighting apparatus
JP7231809B2 (en) * 2018-06-05 2023-03-02 日亜化学工業株式会社 light emitting device
JP7266387B2 (en) * 2018-11-12 2023-04-28 株式会社ジャパンディスプレイ Display device
US11810532B2 (en) 2018-11-28 2023-11-07 Eyesafe Inc. Systems for monitoring and regulating harmful blue light exposure from digital devices
US11592701B2 (en) 2018-11-28 2023-02-28 Eyesafe Inc. Backlight unit with emission modification
US10971660B2 (en) * 2019-08-09 2021-04-06 Eyesafe Inc. White LED light source and method of making same

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005158957A (en) * 2003-11-25 2005-06-16 Matsushita Electric Works Ltd Light emitting device
JP4572312B2 (en) * 2004-02-23 2010-11-04 スタンレー電気株式会社 LED and manufacturing method thereof
KR100583162B1 (en) * 2004-04-06 2006-05-23 엘지이노텍 주식회사 Light emitting diode package
JP4453004B2 (en) * 2004-08-19 2010-04-21 日立化成工業株式会社 Wiring board for mounting light-emitting elements
JP3956965B2 (en) * 2004-09-07 2007-08-08 日立エーアイシー株式会社 Chip component type light emitting device and wiring board therefor
JP4659421B2 (en) * 2004-09-30 2011-03-30 株式会社トクヤマ Manufacturing method of light emitting element storage package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI382567B (en) * 2007-11-15 2013-01-11 Epistar Corp Light-emitting device

Also Published As

Publication number Publication date
TW200729554A (en) 2007-08-01
KR20070047680A (en) 2007-05-07
JP2007150228A (en) 2007-06-14
KR100850061B1 (en) 2008-08-04
JP3978456B2 (en) 2007-09-19

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees