TWI318465B - - Google Patents
Info
- Publication number
- TWI318465B TWI318465B TW95139597A TW95139597A TWI318465B TW I318465 B TWI318465 B TW I318465B TW 95139597 A TW95139597 A TW 95139597A TW 95139597 A TW95139597 A TW 95139597A TW I318465 B TWI318465 B TW I318465B
- Authority
- TW
- Taiwan
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005320161 | 2005-11-02 | ||
JP2006089520A JP3978456B2 (en) | 2005-11-02 | 2006-03-28 | LED mounting board |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200729554A TW200729554A (en) | 2007-08-01 |
TWI318465B true TWI318465B (en) | 2009-12-11 |
Family
ID=38211213
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095139597A TW200729554A (en) | 2005-11-02 | 2006-10-26 | Installing substrate for light emitting diode |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP3978456B2 (en) |
KR (1) | KR100850061B1 (en) |
TW (1) | TW200729554A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI382567B (en) * | 2007-11-15 | 2013-01-11 | Epistar Corp | Light-emitting device |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20080054327A (en) * | 2006-12-12 | 2008-06-17 | 교리츠 엘렉스 가부시키가이샤 | Package for light-emitting diode and manufacturing method thereof, and light-emitting diode |
EP2191517B1 (en) * | 2007-08-31 | 2017-11-29 | LG Innotek Co., Ltd. | Light emitting device package |
KR101370790B1 (en) * | 2007-09-28 | 2014-03-10 | 삼성전자주식회사 | Bar type light emitting device |
KR101370791B1 (en) * | 2007-09-28 | 2014-03-10 | 삼성전자주식회사 | Light emitting device |
JP5400289B2 (en) * | 2007-11-13 | 2014-01-29 | 電気化学工業株式会社 | Light emitting device |
JP5400290B2 (en) * | 2007-11-13 | 2014-01-29 | 電気化学工業株式会社 | Light emitting device |
JP5238366B2 (en) * | 2008-06-09 | 2013-07-17 | スタンレー電気株式会社 | Semiconductor light emitting device |
JP5150384B2 (en) * | 2008-06-25 | 2013-02-20 | スタンレー電気株式会社 | Semiconductor light emitting device |
JP5227693B2 (en) * | 2008-08-11 | 2013-07-03 | スタンレー電気株式会社 | Semiconductor light emitting device |
JP5482293B2 (en) * | 2009-03-05 | 2014-05-07 | 日亜化学工業株式会社 | Optical semiconductor device and manufacturing method thereof |
JP2010220682A (en) * | 2009-03-19 | 2010-10-07 | Daito Giken:Kk | Game machine |
KR101071593B1 (en) | 2009-06-12 | 2011-10-10 | 김용태 | Light Emitting Sheet capable of forming free shape |
TWI461626B (en) * | 2009-12-28 | 2014-11-21 | Chi Mei Comm Systems Inc | Light source device and portable electronic device using the same |
WO2011129202A1 (en) * | 2010-04-16 | 2011-10-20 | 日亜化学工業株式会社 | Light-emitting device and manufacturing method for light-emitting device |
TWI407598B (en) * | 2010-05-26 | 2013-09-01 | Advanced Optoelectronic Tech | Method of manufacturing led package |
KR101114197B1 (en) * | 2010-08-09 | 2012-02-22 | 엘지이노텍 주식회사 | Light emitting device and lighing system |
KR101114719B1 (en) * | 2010-08-09 | 2012-02-29 | 엘지이노텍 주식회사 | Light emitting device and lighing system |
JP5740981B2 (en) * | 2011-01-05 | 2015-07-01 | ソニー株式会社 | LIGHT EMITTING DEVICE, LIGHTING DEVICE, AND DISPLAY DEVICE |
JP2012152452A (en) * | 2011-01-27 | 2012-08-16 | Pearl Lighting Co Ltd | Photocatalytic deodorizer |
US8879276B2 (en) | 2011-06-15 | 2014-11-04 | Power Gold LLC | Flexible circuit assembly and method thereof |
JP6104527B2 (en) * | 2012-06-29 | 2017-03-29 | シャープ株式会社 | Light emitting device |
JP2014233383A (en) * | 2013-05-31 | 2014-12-15 | シャープ株式会社 | Photocatalytic sterilization deodorizing device |
US10642087B2 (en) | 2014-05-23 | 2020-05-05 | Eyesafe, Llc | Light emission reducing compounds for electronic devices |
JP2017123418A (en) * | 2016-01-08 | 2017-07-13 | 豊田合成株式会社 | Illumination device |
JP6458793B2 (en) | 2016-11-21 | 2019-01-30 | 日亜化学工業株式会社 | Method for manufacturing light emitting device |
KR102401826B1 (en) * | 2017-09-15 | 2022-05-25 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | Light emitting device package and lighting apparatus |
JP7231809B2 (en) * | 2018-06-05 | 2023-03-02 | 日亜化学工業株式会社 | light emitting device |
JP7266387B2 (en) * | 2018-11-12 | 2023-04-28 | 株式会社ジャパンディスプレイ | Display device |
US11810532B2 (en) | 2018-11-28 | 2023-11-07 | Eyesafe Inc. | Systems for monitoring and regulating harmful blue light exposure from digital devices |
US11592701B2 (en) | 2018-11-28 | 2023-02-28 | Eyesafe Inc. | Backlight unit with emission modification |
US10971660B2 (en) * | 2019-08-09 | 2021-04-06 | Eyesafe Inc. | White LED light source and method of making same |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005158957A (en) * | 2003-11-25 | 2005-06-16 | Matsushita Electric Works Ltd | Light emitting device |
JP4572312B2 (en) * | 2004-02-23 | 2010-11-04 | スタンレー電気株式会社 | LED and manufacturing method thereof |
KR100583162B1 (en) * | 2004-04-06 | 2006-05-23 | 엘지이노텍 주식회사 | Light emitting diode package |
JP4453004B2 (en) * | 2004-08-19 | 2010-04-21 | 日立化成工業株式会社 | Wiring board for mounting light-emitting elements |
JP3956965B2 (en) * | 2004-09-07 | 2007-08-08 | 日立エーアイシー株式会社 | Chip component type light emitting device and wiring board therefor |
JP4659421B2 (en) * | 2004-09-30 | 2011-03-30 | 株式会社トクヤマ | Manufacturing method of light emitting element storage package |
-
2006
- 2006-03-28 JP JP2006089520A patent/JP3978456B2/en not_active Expired - Fee Related
- 2006-04-20 KR KR20060035542A patent/KR100850061B1/en not_active IP Right Cessation
- 2006-10-26 TW TW095139597A patent/TW200729554A/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI382567B (en) * | 2007-11-15 | 2013-01-11 | Epistar Corp | Light-emitting device |
Also Published As
Publication number | Publication date |
---|---|
TW200729554A (en) | 2007-08-01 |
KR20070047680A (en) | 2007-05-07 |
JP2007150228A (en) | 2007-06-14 |
KR100850061B1 (en) | 2008-08-04 |
JP3978456B2 (en) | 2007-09-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |