TW200704327A - Multi-layer printed circuit board - Google Patents

Multi-layer printed circuit board

Info

Publication number
TW200704327A
TW200704327A TW095110045A TW95110045A TW200704327A TW 200704327 A TW200704327 A TW 200704327A TW 095110045 A TW095110045 A TW 095110045A TW 95110045 A TW95110045 A TW 95110045A TW 200704327 A TW200704327 A TW 200704327A
Authority
TW
Taiwan
Prior art keywords
circuit board
printed circuit
plated layer
layer printed
cover plated
Prior art date
Application number
TW095110045A
Other languages
Chinese (zh)
Other versions
TWI328992B (en
Inventor
Takahiro Yamashita
Akihide Ishihara
Naoki Kubota
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Publication of TW200704327A publication Critical patent/TW200704327A/en
Application granted granted Critical
Publication of TWI328992B publication Critical patent/TWI328992B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/421—Blind plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/462—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar double-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern

Abstract

To provide a multi-layer printed circuit board capable of assuring via hole connection reliability. At the connection portion between the bottom of the filled via (60) and the cover plated layer (36a), the connection boundary plane is shifted downward from the upper surface of the cover plated layer (36a) by depth d1. Thus, the connection boundary plane where a crack is caused most easily is at a lower position than the upper surface position of the cover plated layer (36a) where the stress upon heat shrinkage becomes maximum. Accordingly, a crack is not caused easily and resistance against thermal stress can be enhanced.
TW095110045A 2005-03-24 2006-03-23 Multi-layer printed circuit board TW200704327A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005085454 2005-03-24

Publications (2)

Publication Number Publication Date
TW200704327A true TW200704327A (en) 2007-01-16
TWI328992B TWI328992B (en) 2010-08-11

Family

ID=37023794

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095110045A TW200704327A (en) 2005-03-24 2006-03-23 Multi-layer printed circuit board

Country Status (3)

Country Link
JP (1) JP4973494B2 (en)
TW (1) TW200704327A (en)
WO (1) WO2006101134A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107580410A (en) * 2016-07-05 2018-01-12 元太科技工业股份有限公司 Electric connection structure
TWI613942B (en) * 2016-07-05 2018-02-01 元太科技工業股份有限公司 Electrical connection structure
US10103201B2 (en) 2016-07-05 2018-10-16 E Ink Holdings Inc. Flexible display device
US10607932B2 (en) 2016-07-05 2020-03-31 E Ink Holdings Inc. Circuit structure

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5005416B2 (en) * 2007-04-20 2012-08-22 新光電気工業株式会社 Multilayer wiring board and manufacturing method thereof
JP5125531B2 (en) * 2008-01-16 2013-01-23 富士通セミコンダクター株式会社 Wiring substrate and semiconductor device
JP5060998B2 (en) * 2008-03-18 2012-10-31 日本特殊陶業株式会社 Multilayer resin wiring board
TWI468093B (en) 2008-10-31 2015-01-01 Princo Corp Via structure in multi-layer substrate and manufacturing method thereof
JP2015038909A (en) * 2012-07-13 2015-02-26 イビデン株式会社 Wiring board and method of manufacturing the same
JP6287149B2 (en) * 2013-12-10 2018-03-07 イビデン株式会社 Electronic component built-in substrate and manufacturing method of electronic component built-in substrate
JP5797309B1 (en) * 2014-07-22 2015-10-21 株式会社フジクラ Printed wiring board
JP2016072285A (en) * 2014-09-26 2016-05-09 京セラ株式会社 Circuit board and probe card
CN105430876A (en) * 2015-12-29 2016-03-23 景旺电子科技(龙川)有限公司 Method for increasing binding force of wall of insulating slot of metal substrate

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4468528B2 (en) * 1999-11-26 2010-05-26 イビデン株式会社 Multilayer printed wiring board and manufacturing method thereof.
JP2003069233A (en) * 2001-08-30 2003-03-07 Kyocera Corp Multilayer interconnection board
JP3854160B2 (en) * 2002-01-23 2006-12-06 京セラ株式会社 Multilayer wiring board
JP4160765B2 (en) * 2002-03-25 2008-10-08 京セラ株式会社 Wiring board manufacturing method
JP2004158703A (en) * 2002-11-07 2004-06-03 Internatl Business Mach Corp <Ibm> Printed wiring board and method for manufacturing the same

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107580410A (en) * 2016-07-05 2018-01-12 元太科技工业股份有限公司 Electric connection structure
TWI613942B (en) * 2016-07-05 2018-02-01 元太科技工業股份有限公司 Electrical connection structure
US10103201B2 (en) 2016-07-05 2018-10-16 E Ink Holdings Inc. Flexible display device
CN107580410B (en) * 2016-07-05 2019-12-13 元太科技工业股份有限公司 Electric connection structure
US10522597B2 (en) 2016-07-05 2019-12-31 E Ink Holdings Inc. Flexible display device
US10607932B2 (en) 2016-07-05 2020-03-31 E Ink Holdings Inc. Circuit structure

Also Published As

Publication number Publication date
TWI328992B (en) 2010-08-11
JPWO2006101134A1 (en) 2008-09-04
JP4973494B2 (en) 2012-07-11
WO2006101134A1 (en) 2006-09-28

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